公开(公告)号：DE10002377A1

公开(公告)日：2001-08-02

申请号：DE10002377

申请日：2000-01-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BERTHOLD JOERG ,  SEWALD DIETER ,  TIEBOUT MARC

IPC: H01F17/00 ,  H01F27/36 ,  H01L23/522 ,  H01F17/02 ,  H01L23/64 ,  H01L27/08 ,  H01L21/768 ,  H01F17/04

Abstract: The invention relates to a coil (20) and a coil system to be integrated in a microelectronic circuit (10) and to a corresponding microelectronic circuit (10). According to the invention, the coil (20) is placed inside an oxide layer (13) of a chip (11), whereby the oxide layer (13) is placed on the substrate surface (14) of a substrate (12). The coil (20) comprises one or more windings (21), whereby the winding(s) (21) is/are formed by at least segments of two conductor tracks (22, 23), which are each provided in spatially separated metallization levels (24, 25), and by via-contacts (40) which connect these conductor track(s) (22) and/or conductor track segments (23). In order to be able to produce high-quality coils (20), a coil (20) is produced with the largest possible coil cross-section (27), whereby a standard metallization, especially a standard metallization using copper, can, however, be used for producing the coil (20). To this end, the via contacts (40) are formed from a stack (41) of two or more via elements (42) arranged one above the other. Parts (43) of the metallization levels can be located between the via elements (42).