公开(公告)号：WO2003098706A2

公开(公告)日：2003-11-27

申请号：PCT/DE2003/001557

申请日：2003-05-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  WAITL, Günter ,  BOGNER, Georg ,  HIEGLER, Michael ,  WINTER, Matthias

Inventor： WAITL, Günter ,  BOGNER, Georg ,  HIEGLER, Michael ,  WINTER, Matthias

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L21/52 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29007 ,  H01L2224/2908 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01063 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: Ein Strahlung aussendender oder empfangender Halbleiterchip (9) wird zum Montieren auf einen Leadframe (2), der mit einem vorgefertigten Kunststoffgehäusekörper (5), einem sogenannten premolded package, umspritzt ist, weichgelötet. Durch die Verwendung eines niedrig schmelzenden Lots (3), das in einer Schichtdicke kleiner als 10 µm aufgebracht wird, läßt sich der Lötvorgang weitestgehend ohne thermische Schädigung des Kunststoffgehäusekörpers (5) durchführen.

Abstract translation: 用于安装在引线框架（2）配有一个预制的塑料外壳体（5）上的辐射发射或接收半导体芯片（9），被称为预制包装，成型，进行焊接。 通过使用低熔点焊锡（3），其在小于10微米，在焊接工艺的层厚度涂敷在很大程度上不会对塑料外壳体（5）可以进行热损伤。

公开(公告)号：EP2062296B1

公开(公告)日：2017-07-05

申请号：EP07817544.5

申请日：2007-09-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： WINDISCH, Reiner ,  WIRTH, Ralph ,  GRÖTSCH, Stefan ,  BOGNER, Georg ,  KIRCHBERGER, Günter ,  STREUBEL, Klaus

IPC: H01L25/16 ,  H01L27/15 ,  H01L33/00

CPC classification number: H01L27/15 ,  H01L24/24 ,  H01L25/0756 ,  H01L25/167 ,  H01L33/08 ,  H01L2224/32145 ,  H01L2924/0002 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/00

公开(公告)号：EP1792351B1

公开(公告)日：2016-07-27

申请号：EP05798035.1

申请日：2005-09-20

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  BRUNNER, Herbert ,  HIEGLER, Michael ,  WAITL, Günter

IPC: H01L33/60 ,  H01L33/48

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

公开(公告)号：EP2223336B1

公开(公告)日：2016-07-20

申请号：EP08865050.2

申请日：2008-12-09

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： SORG, Jörg Erich ,  GRUBER, Stefan ,  BOGNER, Georg

IPC: H01L25/075 ,  H01L25/16 ,  H01L27/15 ,  H01L23/60

CPC classification number: H01L25/167 ,  H01L23/60 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

公开(公告)号：EP1565948B1

公开(公告)日：2016-03-16

申请号：EP03767463.7

申请日：2003-11-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  BOGNER, Georg ,  WAITL, Günter ,  WINTER, Matthias

IPC: H01L33/48 ,  H01L33/62 ,  H01L31/0203

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00

公开(公告)号：EP2596534A1

公开(公告)日：2013-05-29

申请号：EP11739022.9

申请日：2011-07-15

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： WEIDNER, Karl ,  RAMCHEN, Johann ,  KALTENBACHER, Axel ,  WEGLEITER, Walter ,  BARCHMANN, Bernd ,  GRUBER, Stefan ,  BOGNER, Georg

IPC: H01L33/38 ,  H01L33/58 ,  G02B6/00 ,  G02F1/13357 ,  H01L33/20 ,  H01L33/60 ,  H01L25/075 ,  H01L33/46 ,  H01L33/40

CPC classification number: H01L33/60 ,  G02F1/133603 ,  H01L25/0753 ,  H01L25/0756 ,  H01L33/20 ,  H01L33/38 ,  H01L33/405 ,  H01L33/46 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to a radiation-emitting component comprising a semiconductor chip (2), which has a first main surface (25), a second main surface (26) located opposite of the first main surface, and an active region (23) provided for generating radiation; a substrate (5), on which the semiconductor chip is fastened on the side of the second main surface (26); and a decoupling layer (4), which is disposed on the first main surface (25) of the semiconductor chip (2) and forms lateral decoupling surfaces (40) spaced apart from the semiconductor chip (2) in the lateral direction, wherein a recess (45) tapering toward the semiconductor chip (2) is formed in the decoupling layer (4), said recess deflecting radiation exiting the first main surface (25) in the direction of the lateral decoupling surface (40) during operation. The invention further relates to a method for producing a radiation-emitting component.

Abstract translation: 发射辐射的元件包括半导体芯片，其具有第一主表面，在相对的一侧从第一主表面和在有源区上的第二主表面上并产生辐射率; 在其上的半导体芯片被固定在所述第二主面侧的载体; 到配置在半导体芯片的第一主表面和形成在横向方向上的半导体芯片间隔开的横向输出表面上输出层，凹部逐渐变细，在半导体芯片的存在的方向，形成在输出层和偏转辐射 从第一主表面新兴手术进入侧输出表面的方向中。

公开(公告)号：EP2436242B1

公开(公告)日：2013-01-09

申请号：EP10721292.0

申请日：2010-04-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  GRUBER, Stefan

IPC: H05K1/18 ,  H01L25/16

CPC classification number: H05K1/183 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014

公开(公告)号：EP2062301A2

公开(公告)日：2009-05-27

申请号：EP08706734.4

申请日：2008-01-09

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  GRUBER, Stefan ,  ZEILER, Thomas ,  KIRSCH, Markus

IPC: H01L33/00 ,  H01L25/16

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A plastic housing (2) is disposed on a support element (1) and comprises a recess (3) in which an optoelectronic component (12) is arranged. The recess (3) has an opening to the exterior (9) on the side facing away from the support element (1), which can be provided with a transparent cover. One or several structures (5, 6) can be provided at the plastic housing (2) in order to align the cover and/or the optical components relative to the optoelectronic component.

公开(公告)号：EP1929340A1

公开(公告)日：2008-06-11

申请号：EP06791397.0

申请日：2006-09-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  BRUNNER, Herbert ,  GRUBER, Stefan

IPC: G02B6/00

CPC classification number: G02B6/0018 ,  G02B6/002 ,  G02B6/0028 ,  G02B6/0065 ,  G02B6/0073 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An illumination unit comprising a luminescence diode chip mounted on a chip carrier and an optical waveguide is specified. The optical waveguide (3) is assembled from at least two separate parts (4, 5), the luminescence diode chip (2) being encapsulated by one of the parts (4) of the optical waveguide (3). A method for producing a luminescence diode chip (2) of this type and also an LCD display comprising an illumination unit of this type are furthermore specified.

公开(公告)号：EP1886359A2

公开(公告)日：2008-02-13

申请号：EP06722836.1

申请日：2006-05-05

Applicant: Osram Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  ARNDT, Karlheinz

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L23/49805 ,  H01L24/48 ,  H01L31/0203 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: The invention relates to a housing body (1), comprising an upper side (2), a lower side (22), opposite the upper side (2) and lateral faces connecting the upper side (2) and the lower side (22) provided as assembly faces (19), whereby the housing body (1) comprises a number of layers (8) containing a ceramic material and a principal extension direction for the layers (23, 24, 25) runs perpendicular to the assembly faces (19). The invention further relates to a method for production of a housing body (1).

Abstract translation: 具有上侧（2）的包装体（1），具有与上侧（2）相对的下侧（22），以及连接上侧（2）和下侧（22）的侧表面， 并且被设置为安装表面（19），所述封装主体（1）具有多个层（8），所述多个层（8）包含陶瓷材料，并且所述层（23,24,25）的横向主要方向横向延伸 与安装表面（19）的关系。 此外，提供了一种用于制造包装体（1）的方法。