公开(公告)号：US20150138659A1

公开(公告)日：2015-05-21

申请号：US14546298

申请日：2014-11-18

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Ki Myung Nam ,  Kyung Soo Yoo

IPC: G02B5/08 ,  B32B3/26

CPC classification number: G02B5/085 ,  B32B3/26 ,  B32B3/263 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2551/00 ,  Y10T428/24612

Abstract: A substrate for an optical device includes an optical device substrate including a plurality of conductive plates elongated along a length direction, wherein side surfaces of the conductive plates are bonded to each other with insulators interposed therebetween, the insulators being respectively formed on the side surfaces. A groove having a predetermined depth for preventing burrs is formed in a lower surface of the optical device substrate at each point where a cutting line is crossed with one of the insulators when the optical device substrate is cut in a length direction and in a vertical direction, the groove being formed in such a way that said one of the insulators is exposed to an inside of the groove.

Abstract translation: 用于光学器件的衬底包括：光学器件衬底，其包括沿着长度方向伸长的多个导电板，其中导电板的侧表面彼此接合，绝缘体彼此接合，绝缘体分别形成在侧表面上。 在光学元件基板沿长度方向和垂直方向切割时，在光学元件基板的下表面上形成有用于防止毛刺的预定深度的凹槽，其中切割线与绝缘体之一交叉的每个点处 所述槽形成为使得所述绝缘体中的一个暴露于所述槽的内部。

公开(公告)号：US20150049447A1

公开(公告)日：2015-02-19

申请号：US14460587

申请日：2014-08-15

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Kyoung Ja Yun

IPC: H05K3/00 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K3/0052 ,  H01L33/48 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/183 ,  H05K2201/09718 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2201/10 ,  H05K2201/10106 ,  H05K2201/10121 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A base substrate which prevents burrs generated during the cutting process includes: multiple conductive layers stacked in one direction with respect to the base substrate; at least one insulation layer being alternately stacked with said conductive layers and electrically separating said conductive layers; and a through-hole penetrating said base substrate covering said insulation layer at the contact region where said cut surface and said insulation layer meet during the cutting of said base substrate in accordance with a predetermined region of the chip substrate. A method of manufacturing the base substrate includes alternately stacking conductive layers and insulation layers and forming a through-hole.

Abstract translation: 防止在切割过程中产生的毛刺的基底基板包括：相对于基底基板沿一个方向堆叠的多个导电层; 至少一个绝缘层与所述导电层交替堆叠并电分离所述导电层; 以及根据所述芯片基板的预定区域，在切割所述基底基板期间，在所述切割面和所述绝缘层相接触的接触区域处覆盖所述绝缘层的通孔。 制造基底基板的方法包括交替地堆叠导电层和绝缘层并形成通孔。

公开(公告)号：US11852655B2

公开(公告)日：2023-12-26

申请号：US17038642

申请日：2020-09-30

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01R1/073 ,  H05K1/02 ,  H05K3/10 ,  H05K3/46

CPC classification number: G01R1/07342 ,  H05K1/0298 ,  H05K3/107 ,  H05K3/462

Abstract: Proposed is a multilayer wiring substrate having excellent joining strength, a method of manufacturing the multilayer wiring substrate, and a probe card having the multilayer wiring substrate.

公开(公告)号：US20230090643A1

公开(公告)日：2023-03-23

申请号：US18058177

申请日：2022-11-22

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: B32B3/26 ,  B32B7/12 ,  B32B15/20 ,  C25D11/04 ,  B32B43/00 ,  B32B37/12 ,  B32B15/04 ,  B23P6/00

Abstract: Proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure. More particularly, proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure, wherein production yield of the entire product can be improved by repairing a defective region to be made normal.

公开(公告)号：US11610937B2

公开(公告)日：2023-03-21

申请号：US16921564

申请日：2020-07-06

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01L27/15 ,  H01L33/48 ,  H01L33/56 ,  H01L33/00

Abstract: Disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same. More particularly, disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same, wherein the need for a micro LED replacement process is eliminated.

公开(公告)号：US11523504B2

公开(公告)日：2022-12-06

申请号：US17166768

申请日：2021-02-03

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Sung Hyun Byun ,  Tae Hwan Song

IPC: C23C28/04 ,  H05K1/11 ,  G01R1/073 ,  C23C28/00

Abstract: Proposed is an anodic oxide film structure that includes an anodic oxide film sheet and has high strength, chemical resistance and corrosion resistance.

公开(公告)号：US11497126B2

公开(公告)日：2022-11-08

申请号：US17087261

申请日：2020-11-02

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/16 ,  H05K3/36 ,  H05K3/40 ,  H01L21/00 ,  H01L21/50 ,  H01L23/14 ,  H01L23/15 ,  H01L23/48 ,  H01L23/58 ,  H01L23/498 ,  H05K3/46

Abstract: Proposed are a multilayer wiring board having both durability and chemical resistance, and a probe card including the same.

公开(公告)号：US11253619B2

公开(公告)日：2022-02-22

申请号：US16890777

申请日：2020-06-02

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Moon Hyun Kim

IPC: A61L2/10 ,  A61L2/26

Abstract: Provided is a UV sterilizer including an illumination unit, a cover that has an open hole in an upper surface thereof and supports the illumination unit, and a body that is provided underneath the cover and secures an illumination distance between the illumination unit and an illumination target object. The body is composed of a first body and a second body into which the first body is inserted. The first body and the second body are separably combined with each other.

公开(公告)号：US11201272B2

公开(公告)日：2021-12-14

申请号：US16383462

申请日：2019-04-12

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Moon Hyun Kim

IPC: H01L33/62 ,  H01L25/13 ,  H01L33/60

Abstract: The present invention relates generally to an optical device package on which an optical device is mounted and, more particularly, to an optical device package that is configured such that a unit substrate of the optical device package comes into surface contact with a curved surface of a light transmission member.

公开(公告)号：US20210331446A1

公开(公告)日：2021-10-28

申请号：US17232029

申请日：2021-04-15

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: B32B15/04 ,  B32B15/20 ,  B32B3/26 ,  C25D11/04 ,  G01R1/073

Abstract: Proposed are a laminated anodic aluminum oxide structure in which a plurality of anodic aluminum oxide films are stacked, a guide plate of a probe card using the same, and a probe card having the same. More particularly, proposed are a laminated anodic aluminum oxide structure with a high degree of surface strength, a guide plate of a probe card using the same, and a probe card having the same.