公开(公告)号：EP3023603A1

公开(公告)日：2016-05-25

申请号：EP15194348.7

申请日：2015-11-12

Applicant: United Technologies Corporation

Inventor： SHEEDY, Paul ,  DARDONA, Sameh ,  McCAFFREY, Michael G. ,  SCHMIDT, Wayde R. ,  CULP, Slade R.

IPC: F01D17/02 ,  F01D25/00 ,  F01D5/28

CPC classification number: H05K1/0201 ,  F01D5/284 ,  F01D17/02 ,  F01D25/005 ,  F05D2300/211 ,  F05D2300/222 ,  G01M15/14 ,  H05K1/0306 ,  H05K1/18 ,  H05K2201/068

Abstract: An instrumented article (20; 120; 220; 320; 420; 520) includes a ceramic-based substrate (22) and at least one conformal electronic device (24; 524a, 524b) deposited on a surface of the ceramic-based substrate (22). A compliant layer (26) is located between the ceramic-based substrate (22) and the one or more conformal electronic devices (24; 524a, 524b). The compliant layer (26) has a thermal expansion that is intermediate of the thermal expansions of, respectively, the ceramic-based substrate (22) and the one or more conformal electronic devices (24; 524a, 524b).

Abstract translation: 的仪表化制品（20; 120; 220; 320; 420; 520）包括陶瓷基底（22）和至少一个共形电子器件;沉积在所述陶瓷基底的一个表面上（（24 524A，524B） 22）。 柔顺层（26）位于所述陶瓷基底（22）和所述一个或多个保形的电子设备之间（24; 524A，524B）。 柔顺层（26）具有热膨胀所做的是中间的，分别是基于陶瓷的基片（22）和所述一个或多个保形的电子器件中的热膨胀（24; 524A，524B）。

公开(公告)号：EP3009416A1

公开(公告)日：2016-04-20

申请号：EP15190461.2

申请日：2015-10-19

Applicant: United Technologies Corporation

Inventor： SCHMIDT, Wayde R.

IPC: C04B35/571 ,  B29C35/08 ,  C04B35/634 ,  B28B1/00 ,  B29C67/00

CPC classification number: B28B1/001 ,  B29C35/045 ,  B29C35/0805 ,  B29C64/135 ,  B29C2035/0827 ,  B29C2035/0855 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C04B35/571 ,  C04B35/62802 ,  C04B2235/6026 ,  C04B2235/665 ,  C08K9/04

Abstract: The present disclosure relates to systems, methods and resins for additive manufacturing. In one embodiment, a method for additive manufacturing of a ceramic structure includes providing a resin including a preceramic polymer and inorganic ceramic filler particles dispersed in the preceramic polymer. The preceramic polymer is configured to convert to a ceramic phase. The method includes functionalizing inorganic ceramic filler particles with a reactive group and applying an energy source to the resin to create at least one layer of the ceramic phase from the resin.

Abstract translation: 本公开涉及用于添加剂制造的系统，方法和树脂。 在一个实施方案中，陶瓷结构的添加制造方法包括提供包含分散在预陶瓷聚合物中的预陶瓷聚合物和无机陶瓷填料颗粒的树脂。 预陶瓷聚合物被配置成转化成陶瓷相。 该方法包括使具有反应性基团的无机陶瓷填料颗粒官能化，并向树脂施加能量源以从树脂产生至少一层陶瓷相。

公开(公告)号：EP2984058A1

公开(公告)日：2016-02-17

申请号：EP14782827.1

申请日：2014-04-08

Applicant: United Technologies Corporation

Inventor： SHEEDY, Paul ,  SCHMIDT, Wayde R. ,  KASHYAP, Tania Bhatia

IPC: C04B35/622 ,  C04B35/64 ,  C04B35/657

CPC classification number: C04B35/806 ,  C04B35/571 ,  C04B35/573 ,  C04B35/58 ,  C04B35/65 ,  C04B41/009 ,  C04B41/50 ,  C04B41/85 ,  C04B2235/3891 ,  C04B2235/5244 ,  C04B2235/5248 ,  C04B2235/616 ,  F01D5/282 ,  F01D5/284 ,  F01D5/288 ,  F05D2250/621 ,  F05D2300/2102 ,  F05D2300/6033 ,  F23R3/007 ,  C04B35/80 ,  C04B38/00 ,  C04B41/4523 ,  C04B41/4535

Abstract: A method for fabricating a ceramic material includes providing a mobilized filler material capable of infiltrating a porous ceramic matrix composite. The mobilized filler material includes at least one of a ceramic material and a free metal. The mobilized filler material is infiltrated into pores of the porous ceramic matrix composite. The mobilized filler material is then immobilized within the pores of the porous ceramic matrix composite.

公开(公告)号：EP2966946A2

公开(公告)日：2016-01-13

申请号：EP15174120.4

申请日：2015-06-26

Applicant: United Technologies Corporation

Inventor： SCHMIDT, Wayde R. ,  DARDONA, Sameh ,  CULP, Slade R. ,  PIECH, Marcin

IPC: H05K1/16 ,  H05K3/20

CPC classification number: H05K1/16 ,  H05K3/202 ,  H05K2201/0355

Abstract: A method for manufacturing an electronic assembly using direct writing with fabricated foils is provided. The electronic assembly may include one or more foil substrates (210) and one or more elements (220, 222, 224, 226, 228, 230.). The elements may be produced by an additive manufacturing process. Moreover, the elements may be produced in the same plane or out of plain with one or more foil substrates. The elements may also be various structures, including, for example, connectors, electrical components (e.g., a resistor, a capacitor, a switch, and/or the like), and/or any other suitable electrical elements and/or structures.

Abstract translation: 提供了一种用于使用直接写入与制造的箔制造电子组件的方法。 该电子组件可以包括一个或多个箔基材（210）和一个或多个元素（220，222，224，226，228，230）。 这些元件可以通过附加的制造处理来制造。 更上方，元件可以在相同的平面或出产生的纯与一个或多个箔衬底。 因此，该元件可以是各种结构，包括，例如，连接器，电气部件（E. G.，电阻器，电容器，开关，和/或类似物），和/或任何其他适当的电元件和/或结构。

公开(公告)号：EP2823174A1

公开(公告)日：2015-01-14

申请号：EP13757723.5

申请日：2013-02-23

Applicant: United Technologies Corporation

Inventor： SCHMIDT, Wayde R. ,  BEALS, James T. ,  NARDI, Aaron T.

IPC: F02K3/00 ,  F02C7/00 ,  F02C3/00 ,  F02K99/00

Abstract: An erosion resistant and hydrophobic article includes a core that has a first hardness and a surface on the core. The surface includes a plurality of geometric features that have a second, greater hardness. The geometric features define a surface porosity by area percent and a corresponding surface solidity by area percent. The surface includes a ratio of the surface solidity divided by the surface porosity that is 1.8 or greater. The geometric features and the ratio establish the surface to be hydrophobic, and the second, greater hardness and the ratio establish an erosion rate of the surface that is equal to or less than an erosion rate of the core under identical erosion conditions.

Abstract translation: 耐腐蚀和疏水性制品包括具有第一硬度和芯表面的芯。 该表面包括具有第二更大硬度的多个几何特征。 几何特征定义了面积百分比的表面孔隙率和面积百分比的相应表面固体性。 表面包括表面固体性除以表面孔隙度的比值为1.8或更大。 几何特征和比率确定表面是疏水性的，并且第二更大的硬度和比率确定表面的侵蚀速率等于或小于相同侵蚀条件下的芯的侵蚀速率。