公开(公告)号：US4632294A

公开(公告)日：1986-12-30

申请号：US684823

申请日：1984-12-20

Applicant: William O. Druschel ,  Alexander Kostenko ,  Rolf G. Meinert

Inventor： William O. Druschel ,  Alexander Kostenko ,  Rolf G. Meinert

IPC: H01L23/50 ,  B23K1/012 ,  B23K1/018 ,  H01R43/02 ,  H05K13/04 ,  B23K31/00

CPC classification number: H05K13/0404 ,  B23K1/012 ,  B23K1/018 ,  H05K13/0486 ,  B23K2201/40 ,  H01R43/02

Abstract: The disclosure is directed to process and apparatus for the removal, site preparation, and replacement of any single connector pin contained within a sizeable array of closely spaced very small connector pins on an electronic packaging structure (substrate or module) without causing deleterious metallurgical effects either to the remaining pins or the ceramic substrate.

Abstract translation: 本公开涉及用于去除，现场准备和替换包含在电子封装结构（基板或模块）上的紧密间隔非常小的连接器针的相当大阵列中的任何单个连接器针的处理和装置，而不会引起有害的冶金效应 到剩余的引脚或陶瓷基板。

公开(公告)号：US4618088A

公开(公告)日：1986-10-21

申请号：US679170

申请日：1984-12-07

Applicant: Heinz Karla

Inventor： Heinz Karla

IPC: H01R4/02 ,  B23K1/20 ,  C03C27/04 ,  H01R43/02 ,  B23K1/19

CPC classification number: H01R43/02 ,  B23K1/203 ,  B23K2201/40

Abstract: A process for improving the solderability of a layer of a silver frit burnt onto a glass pane and a current connecting element wherein a layer of enamel is disposed and the surface of soldering and the glass pane. According to the process the surface is treated with a fluorine containing etching agent prior to soldering. The fluorine containing etching agent may be an aqueous solution of an acid fluoride, such as ammonium hydrogen fluoride or alkali hydrogen fluoride.

Abstract translation: 一种用于改善燃烧到玻璃板上的银玻璃料层和当前连接元件的可焊性的方法，其中设置有一层搪瓷和焊接表面和玻璃板。 根据该方法，在焊接之前，用含氟蚀刻剂处理表面。 含氟蚀刻剂可以是氟化氢等氟化氢或碱金属氟化氢的水溶液。

公开(公告)号：US4278867A

公开(公告)日：1981-07-14

申请号：US974595

申请日：1978-12-29

Applicant: Swie-In Tan

Inventor： Swie-In Tan

IPC: H05K3/34 ,  B23K1/005 ,  B23K26/08 ,  B23K26/12 ,  B23K26/20 ,  B29C65/00 ,  B29C65/16 ,  H01L21/60 ,  H01L23/32 ,  B23K26/02

CPC classification number: B23K26/123 ,  B23K1/0056 ,  B23K26/032 ,  B23K26/08 ,  B23K26/082 ,  B23K26/12 ,  B23K26/127 ,  H01L24/75 ,  H01L24/81 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75102 ,  H01L2224/75253 ,  H01L2224/75263 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  Y10S148/093

Abstract: Defective chips are removed from a substrate package. The package is cleaned. Replacement chips with solder bearing elements are replaced in the position(s) of the defective chip(s). Silicon chips are less damaged by heating with light wavelengths substantially shorter than infrared radiation, when the radiation is directed upon the upper chip surface and the lower chip surface carries circuitry and solder balls. Radiation is absorbed by the upper chip surface and converted there directly to heat, protecting the circuitry below. An argon-ion laser beam confined to a given chip is directed upon the upper surface of the chip to be soldered in place. A thin laser beam can be scanned under computer control across a chip to heat the areas of a chip above solder balls. Automatic temperature control of the chip can be provided by a heat detector or chip condition detector and a program controller in a feedback loop controlling laser power.

Abstract translation: 从衬底封装中去除有缺陷的芯片。 包装被清洁。 具有焊料轴承元件的替换芯片在有缺陷的芯片的位置被替换。 当辐射指向上芯片表面并且下芯片表面承载电路和焊球时，硅芯片通过加热而比红外辐射短得多的损坏。 辐射被上芯片表面吸收，并在那里直接转化为热，保护下面的电路。 限于给定芯片的氩离子激光束被引导到待焊接的芯片的上表面就位。 可以在计算机控制下跨芯片扫描薄激光束，以加热焊球上方的芯片区域。 芯片的自动温度控制可以由热检测器或芯片状态检测器和控制激光功率的反馈回路中的程序控制器提供。

公开(公告)号：US3970819A

公开(公告)日：1976-07-20

申请号：US526988

申请日：1974-11-25

Applicant: Gerald Alan Gates ,  William John Ryan

Inventor： Gerald Alan Gates ,  William John Ryan

IPC: B23K26/00 ,  B23K26/40 ,  B28D5/00 ,  H01L21/268 ,  H01L21/301

CPC classification number: H01L21/268 ,  B23K26/40 ,  B28D5/0011 ,  B28D5/0029 ,  B23K2201/40 ,  B23K2203/50 ,  H01L2224/13 ,  Y10T225/12

Abstract: A wafer of semiconductor material having a plurality of units defined on its face is subdivided by treating the wafer, on its back or reverse side, in the kerf regions between the units, where division of the units is desired, such that the material of the wafer in the treated kerf regions is converted to a material having a breaking strength lower than the breaking strength of the semiconductor material.

Abstract translation: 在其表面上具有多个单元的半导体材料晶片通过在其单元之间的切割区域中在其背面或反面上处理晶片来细分，其中希望单元的划分，使得 经处理的切口区域中的晶片转变为具有低于半导体材料的断裂强度的断裂强度的材料。

公开(公告)号：US3786172A

公开(公告)日：1974-01-15

申请号：US3786172D

申请日：1972-12-07

Applicant: ACCRA POINT ARRAYS CORP

Inventor： CONLEY L

IPC: B23K1/20 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/24 ,  H05K3/32 ,  H05K3/34 ,  H05K3/42 ,  H05K3/36

CPC classification number: B23K1/20 ,  B23K2201/40 ,  B23K2201/42 ,  H05K1/09 ,  H05K1/114 ,  H05K3/002 ,  H05K3/067 ,  H05K3/328 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/3468 ,  H05K3/427 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2201/10287 ,  H05K2201/2081 ,  H05K2203/0361 ,  H05K2203/1184

Abstract: A method for the low cost production of printed circuits with both soldered-in component leads and welded wire connections, which includes applying a sheet of highly weldable material such as stainless steel to an insulative board, plating a layer of highly solderable material such as copper over the stainless steel, applying a first resist pattern and then a first etchant such as ferric chloride that etches both copper and stainless steel to form a predetermined printed circuit pattern, and then applying a second resist pattern and a second etchant such as chromic acid which etches only the copper to leave exposed regions of the stainless steel. Components can be wave soldered in place, and the solder will not adhere to the stainless steel so that wires can later be welded to the exposed stainless steel weld regions. More uniform welding can be obtained by applying an underlayer of copper to the insulative substrate under the stainless steel layer, so that there is a low resistance path to all weld regions.

公开(公告)号：US3774834A

公开(公告)日：1973-11-27

申请号：US16425271

申请日：1971-07-20

Applicant: J AND A KELLER MACHINE CO INC

Inventor： HOLLER J ,  WAELDCHEN E

IPC: B23K20/02 ,  H01L21/00 ,  B23K21/00

CPC classification number: H01L21/67144 ,  B23K20/02 ,  B23K2201/40 ,  Y10T29/49121

Abstract: A bonding apparatus and method for simultaneously bonding the leads of a beam-leaded device uniformly to conductive pads on a substrate. A continuous strip of metal consisting of a plurality of heat and pressure transmitting members is intermittently fed to a rotatable bonding head having a plurality of bonding tools. Each transmitting member is adapted to be interposed between the bonding tool and the leads of the beam-leaded device to evenly distribute and transmit bonding forces to such leads to effect uniform and simultaneous bonding thereof to their connections. A crimping device coacts with the bonding tools to partially deform a transmitting member about its respective tool prior to bonding.

Abstract translation: 一种用于将光束引线器件的引线均匀地接合到衬底上的导电焊盘的接合装置和方法。 将由多个热压传递部件组成的连续的金属条状物间歇地供给到具有多个接合工具的可旋转接合头。 每个传输构件适于插入在焊接工具和束引导装置的引线之间以均匀地分布和传递到这种引线的结合力，以实现其连接的均匀和同时的结合。 压接装置与接合工具共同作用，以在接合之前使传递构件围绕其相应的工具变形。

公开(公告)号：US3401861A

公开(公告)日：1968-09-17

申请号：US50160665

申请日：1965-10-22

Applicant: MOTOROLA INC

Inventor： FOLK LEE E

IPC: B23K20/00 ,  H01L21/00

CPC classification number: H01L24/78 ,  B23K20/005 ,  B23K2201/40 ,  H01L24/45 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/20752

公开(公告)号：US3128648A

公开(公告)日：1964-04-14

申请号：US13503261

申请日：1961-08-30

Applicant: WESTERN ELECTRIC CO

Inventor： CLAGETT ROBERT P

IPC: B23K20/00 ,  H01L21/00

CPC classification number: B23K20/005 ,  B23K2201/32 ,  B23K2201/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48455 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78302 ,  H01L2224/78313 ,  H01L2224/78315 ,  H01L2224/78318 ,  H01L2224/85 ,  H01L2224/85099 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/19043 ,  H01L2924/20752 ,  Y10S228/904 ,  H01L2924/00014 ,  H01L2924/00

Abstract: 1,007,459. Welding by pressure. WESTERN ELECTRIC CO. Inc. Aug. 21, 1962 [Aug. 30, 1961 (2)], No. 32018/62. Heading B3R. [Also in Divisions H1 and H4] A device for banding a fine wire to a part comprises an elongated member having at one end a banding head for transmitting pressure to the wire, the head having a groove with non-concave inner faces to engage the wire initially along lines of contact only. A device for bonding a very fine gold wire 12, Fig. 1, to an aluminium stripe 13 sputtered on a semiconductive body 14 comprises a steel member 16 having a pair of parallel tungsten cylinders 19 welded to the lower surface thereof to form a groove for the wire passed from a guide 22. The member 16 is mounted in a chuck 27, Fig. 4, on an arm 32 carrying a transducer mounted by wedges 37 in a carrier 36 and supplied with current at a frequency of 20-60 kc. per sec. Clamps 38, 39 on the carrier 36 are pivoted to a cradle 43 and the pressure exerted on the work by the member 16 is determined by a knob 76 carrying a pin 77 which may be spring urged into one of a number of slots in a plate 75, the knob carrying a cam operating on a sleeve between which and the carrier 36 is arranged a coil spring. In operation the semi-conductor body 14 soldered etc. to a header 86 is held by placing header leads 87 into apertures 88 in a support disc 89 on a fixture 92 adjustable for height and transverse location, the member 16 is brought adjacent the stripe on the semiconductor and the knob 76 is rotated to provide a force of about ten grams on the work. The transducer is energized to scrub the wire against the stripe resulting in bonding. The wire and/ or the stripe may be heated. In a modification the elongated member of glass, sapphire, quartz, diamond etc. has a V-shaped groove on a flat side, a chamfered edge and a flat portion for a round wire passed through a guide. In a further modification the elongated member has a passageway 187, Fig. 12, therethrough and is tapered at its lower end to provide a flat surface 193 to which are welded parallel tungsten cylinders forming a groove for the wire 12 passing down through the passage way 187. A shearing device 213 cuts the wire projecting from the elongated member and bends it through 90 degrees into the groove. This member is used in thermo-compression bonding also. The apparatus may be used to bond wires of copper etc. to conductive, semi-conductive or non- conductive parts.

公开(公告)号：US2978388A

公开(公告)日：1961-04-04

申请号：US78944659

申请日：1959-01-27

Applicant: PHILCO CORP

Inventor： TOPFER ALVIN R

IPC: C25D3/66 ,  H01L21/3063

CPC classification number: H01L21/3063 ,  B23K28/006 ,  B23K2201/40 ,  C25D3/66 ,  C25D7/12

公开(公告)号：US996374A

公开(公告)日：1911-06-27

申请号：US1907393492

申请日：1907-09-18

Applicant: GEN ELECTRIC

Inventor： SWAN ALFRED

CPC classification number: B23K3/06 ,  B23K2201/40 ,  H01L2224/11 ,  H01L2924/12033 ,  H01L2924/00 ,  H01L2924/00012