公开(公告)号：US20070170440A1

公开(公告)日：2007-07-26

申请号：US11600860

申请日：2006-11-16

Applicant: Aaron Partridge ,  Markus Lutz ,  Pavan Gupta

Inventor： Aaron Partridge ,  Markus Lutz ,  Pavan Gupta

IPC: H01L31/0312

CPC classification number: B81C1/00277 ,  B81B7/0035 ,  B81B7/0058 ,  B81B7/007 ,  B81B2201/0271 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00269 ,  B81C1/00301 ,  B81C2201/0171 ,  B81C2203/031 ,  B81C2203/036 ,  B81C2203/037 ,  B81C2203/038 ,  H01L23/051 ,  H01L41/1136 ,  H01L2924/0002 ,  H01L2924/00

Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.