公开(公告)号：US09045333B2

公开(公告)日：2015-06-02

申请号：US12797389

申请日：2010-06-09

Applicant: Pierre Cusin ,  Jean-Philippe Thiebaud

Inventor： Pierre Cusin ,  Jean-Philippe Thiebaud

IPC: B23P15/00 ,  C03C25/00 ,  B44C1/00 ,  B81C99/00 ,  B81C1/00 ,  B81B3/00 ,  C25D1/20 ,  G04B13/02 ,  G04D3/00 ,  C25D1/00 ,  C25D5/02

CPC classification number: B81C99/008 ,  B81B3/0075 ,  B81B2201/035 ,  B81C1/00031 ,  B81C1/00087 ,  B81C1/00119 ,  B81C2201/0132 ,  B81C2201/032 ,  C25D1/003 ,  C25D1/20 ,  C25D5/022 ,  G04B13/022 ,  G04B13/026 ,  G04D3/0069

Abstract: The invention relates to a method of fabricating a composite micromechanical component, particularly for timepiece movements, including steps: a) providing a substrate including a horizontal top layer and a horizontal bottom layer made of electrically conductive, micromachinable material, and secured to each other by an electrically insulating, horizontal, intermediate layer; b) etching a pattern in the top layer through to the intermediate layer, thereby forming at least one cavity in the substrate; c) coating the top part of the substrate with an electrically insulating coating; d) directionally etching the coating and the intermediate layer to limit the presence thereof exclusively at each vertical wall; e) performing an electrodeposition by connecting the electrode to the conductive bottom layer of the substrate to form at least one metal part of the component; g) releasing the composite component from the substrate.

Abstract translation: 本发明涉及一种制造复合微机械部件的方法，特别是用于钟表运动的方法，包括步骤：a）提供包括由导电的可微加工材料制成的水平顶层和水平底层的基板，并通过 电绝缘的水平中间层; b）将顶层中的图案蚀刻到中间层，从而在衬底中形成至少一个空腔; c）用电绝缘涂层涂覆基材的顶部; d）定向蚀刻涂层和中间层，以限制其在每个垂直壁上的存在; e）通过将所述电极连接到所述基板的导电底层来进行电沉积以形成所述部件的至少一个金属部分; g）从基底释放复合组分。

公开(公告)号：US20140004374A1

公开(公告)日：2014-01-02

申请号：US14017510

申请日：2013-09-04

Applicant: Microfabrica Inc.

Inventor： Adam L. Cohen

IPC: C25D1/00 ,  C25D5/02

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

公开(公告)号：US08603316B2

公开(公告)日：2013-12-10

申请号：US13167451

申请日：2011-06-23

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C25D5/02 ,  C25D5/10

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

公开(公告)号：US20120234688A1

公开(公告)日：2012-09-20

申请号：US13441136

申请日：2012-04-06

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C25D5/02 ,  C25D5/48

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

公开(公告)号：US20120042510A1

公开(公告)日：2012-02-23

申请号：US13266229

申请日：2010-05-26

Applicant: Alexandre Fussinger

Inventor： Alexandre Fussinger

IPC: H05K3/00

CPC classification number: C25D1/003 ,  B81C99/0085 ,  B81C2201/032 ,  C25D1/20 ,  C25D5/022 ,  G03F7/0035 ,  Y10T29/49124

Abstract: The present invention concerns a method of fabricating a plurality of metallic microstructures, characterized in that it includes the steps consisting in: a) taking a conductive substrate or an insulating substrate coated with a conductive seed layer; b) applying a layer of photosensitive resin over the conductive part of the substrate surface; c) flattening the surface of the photosensitive resin layer to the desired thickness and/or surface state; d) irradiating the resin layer through a mask defining the contour of the desired microstructure; e) dissolving the non-polymerized areas of the photosensitive resin layer to reveal, in places, the conductive surface of the substrate; f) the galvanic deposition of at least one layer of a metal from said conductive layer to form a unit substantially reaching the upper surface of the photosensitive resin; g) flattening the resin and the electroformed metal to bring the resin and the electroformed units to the same level and thereby form electroformed parts or microstructures; h) separating the resin layer and the electroformed parts from the substrate; and i) removing the layer of photosensitive resin from the structure obtained at the end of step g) to release the microstructures thereby formed.

Abstract translation: 本发明涉及一种制造多个金属微结构的方法，其特征在于包括以下步骤：a）取导电基底或涂有导电种子层的绝缘基片; b）在基板表面的导电部分上施加一层感光树脂; c）将感光性树脂层的表面平坦化成所需的厚度和/或表面状态; d）通过限定所需微结构轮廓的掩模照射树脂层; e）溶解感光性树脂层的未聚合区域，以露出基材的导电表面; f）从所述导电层电镀沉积至少一层金属以形成基本上到达感光树脂上表面的单元; g）使树脂和电铸金属变平，使树脂和电铸单元达到同一水平，从而形成电铸部件或微结构; h）从基板分离树脂层和电铸部件; i）从步骤g）结束时得到的结构除去感光性树脂层，以释放由此形成的微结构。

公开(公告)号：US07652384B2

公开(公告)日：2010-01-26

申请号：US11680600

申请日：2007-02-28

Applicant: Gabriel Matus ,  Vlad Novotny

Inventor： Gabriel Matus ,  Vlad Novotny

IPC: H01L23/29

CPC classification number: G03F7/0035 ,  B81C1/00619 ,  B81C2201/032 ,  B81C2203/0109 ,  B81C2203/019

Abstract: A micro structure includes a seed electrode layer on a substrate and a plurality of conductive layers on the seed electrode layer. The combined thickness of the seed electrode layer and the plurality of conductive layers can be more than 0.1 mm and the lateral dimensions of the seed electrode layer and the plurality of conductive layers vary less than 20% along the direction normal to a surface of the substrate and the micro structure has striations on an outer surface.

Abstract translation: 微结构包括在基底上的种子电极层和种子电极层上的多个导电层。 种子电极层和多个导电层的组合厚度可以大于0.1mm，并且种子电极层和多个导电层的横向尺寸沿着垂直于衬底表面的方向变化小于20％ 并且微结构在外表面上具有条纹。

公开(公告)号：US20080230390A1

公开(公告)日：2008-09-25

申请号：US11927309

申请日：2007-10-29

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C25D5/02

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

公开(公告)号：US07384530B2

公开(公告)日：2008-06-10

申请号：US10841001

申请日：2004-05-07

Applicant: Adam L. Cohen ,  Dennis R. Smalley

Inventor： Adam L. Cohen ,  Dennis R. Smalley

IPC: C25D5/02 ,  C25D5/48

CPC classification number: B81C1/00126 ,  B33Y10/00 ,  B81B2201/042 ,  B81C1/00396 ,  B81C2201/032 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

Abstract: The invention includes methods of fabrication and apparatuses. In at least some embodiments of the applicants' invention, the methods include processes of: maskless selective deposition of non-layered structures, selective etching and/or deposition without use of a separate mask and/or lithography techniques, retaining selected portions of sacrificial material during removal (e.g. etching) of other portions of sacrificial material, depositing materials other than the structural and sacrificial materials, including more than one type of structural and/or sacrificial material, and fabrication of interlacing elements. Embodiments of the methods of the invention provide increased capabilities, properties, flexibility and in the fabrication of three-dimensional structures by electro-deposition or other techniques. In certain embodiments, the apparatuses of the invention include structures having non-layered elements, retained sacrificial materials, three or more different deposited materials, and interlaced elements.

Abstract translation: 本发明包括制造方法和装置。 在申请人的发明的至少一些实施例中，所述方法包括以下过程：无掩模地选择性沉积非分层结构，选择性蚀刻和/或沉积，而不使用单独的掩模和/或光刻技术，保留牺牲材料的选定部分 在牺牲材料的其它部分的去除（例如蚀刻）期间，沉积除结构和牺牲材料之外的材料，包括多于一种类型的结构和/或牺牲材料，以及制造隔行元件。 本发明的方法的实施例通过电沉积或其他技术提供增强的能力，性质，柔性和制造三维结构。 在某些实施例中，本发明的装置包括具有非层状元件，保留的牺牲材料，三种或更多种不同沉积材料和隔行元件的结构。

公开(公告)号：US20080110857A1

公开(公告)日：2008-05-15

申请号：US11927342

申请日：2007-10-29

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C23F1/00 ,  B23H3/00

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

公开(公告)号：US07238429B2

公开(公告)日：2007-07-03

申请号：US10946051

申请日：2004-09-21

Applicant: Bruce Allan Cook ,  Yun Tian ,  Joel Lee Harringa ,  Alan Paul Constant ,  Alan Mark Russell ,  Palaniappa A. Molian

Inventor： Bruce Allan Cook ,  Yun Tian ,  Joel Lee Harringa ,  Alan Paul Constant ,  Alan Mark Russell ,  Palaniappa A. Molian

IPC: B32B15/20 ,  C23C14/34 ,  C23C14/16 ,  C22C21/00

CPC classification number: C23C14/067 ,  B81B3/0075 ,  B81C2201/032 ,  C23C14/28 ,  Y10S428/938 ,  Y10T428/12736 ,  Y10T428/1275 ,  Y10T428/31678

Abstract: Performance and reliability of microelectromechanical system (MEMS) components enhanced dramatically through the incorporation of protective thin film coatings. Current-generation MEMS devices prepared by the LIGA technique employ transition metals such as Ni, Cu, Fe, or alloys thereof, and hence lack stability in oxidizing, corrosive, and/or high temperature environments. Fabrication of a superhard, self-lubricating coating based on a ternary boride compound AlMgB14 is described in this letter as a potential breakthrough in protective coating technology for LIGA microdevices. Nanoindentation tests show that hardness of AlMgB14 films prepared by pulsed laser deposition ranges from 45 GPa to 51 GPa, when deposited at room temperature and 573 K, respectively. Extremely low friction coefficients of 0.04-0.05, which are thought to result from a self-lubricating effect, have also been confirmed by nanoscratch tests on the AlMgB14 films. Transmission electron microscopy studies show that the as-deposited films are amorphous, regardless of substrate temperature; however, analysis of FTIR spectra suggests that the higher substrate temperature facilitates formation of the B12 icosahedral framework, therefore leading to the higher hardness.

Abstract translation: 微机电系统（MEMS）组件的性能和可靠性通过并入保护性薄膜涂层而显着提高。 通过LIGA技术制备的当前一代MEMS器件采用过渡金属如Ni，Cu，Fe或其合金，因此在氧化，腐蚀性和/或高温环境中缺乏稳定性。 在本文中描述了基于三元硼化物AlMgB 14的超硬自润滑涂层的制造，作为LIGA微型器件的保护涂层技术的潜在突破。 纳米压痕测试显示，当分别在室温和573K下沉积时，通过脉冲激光沉积制备的AlMgB 14 N膜的硬度范围为45GPa至51GPa。 认为是由自润滑效应引起的非常低的摩擦系数0.04-0.05也已经通过AlMgB 14膜的纳米尺度试验证实。 透射电子显微镜研究表明，沉积膜是无定形的，不管基底温度如何; 然而，FTIR光谱的分析表明较高的底物温度有助于形成B 12二十面体骨架，因此导致更高的硬度。