公开(公告)号：EP3122920B1

公开(公告)日：2018-05-02

申请号：EP15709922.7

申请日：2015-03-12

Applicant: Atotech Deutschland GmbH

Inventor： NISHIGAWA, Tadahiro ,  HIGUCHI, Jun ,  ISHIKAWA, Hitoshi

IPC: C25D5/56 ,  C25D5/34 ,  C25D3/38 ,  H05K3/42

CPC classification number: C25D5/34 ,  C25D3/38 ,  C25D5/56 ,  H05K1/0296 ,  H05K3/424 ,  H05K3/427 ,  H05K3/467 ,  H05K2201/032 ,  H05K2201/0329 ,  H05K2203/0793 ,  H05K2203/0796

Abstract: In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, the insulator outer surface and the copper layer outer surface are simultaneously subjected to (1) a process including treatment with an alkali metal hydroxide solution, (2) a process including treatment with an alkaline aqueous solution containing an aliphatic amine, (3) a process including treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt % and a pH of 8 to 11, (4) a process including treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polystyrenesulphonic acid, and (5) a process including copper electroplating, which are implemented sequentially.

公开(公告)号：EP3077871A1

公开(公告)日：2016-10-12

申请号：EP14821905.8

申请日：2014-11-19

Applicant: Eastman Kodak Company

Inventor： WANG, Yongcai ,  LEBENS, John Andrew ,  WRIGHT, Mitchell Lawrence ,  CUMMINGS, Julie A.

IPC: G03F7/00

CPC classification number: H05K1/09 ,  G03F7/0002 ,  G03F7/0035 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/0313 ,  H05K3/0023 ,  H05K3/04 ,  H05K3/22 ,  H05K2201/0108 ,  H05K2201/032

Abstract: Conductive articles and devices have conductive micro-wires formed by curing a photocurable layer on a transparent flexible substrate that has a distortion temperature of less than 150° C. The photocurable layer has a viscosity

公开(公告)号：EP2974564A2

公开(公告)日：2016-01-20

申请号：EP14710783.3

申请日：2014-02-27

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： STAHR, Johannes ,  TUOMINEN, Mikael

IPC: H05K1/18 ,  H05K3/32 ,  H05K3/46

CPC classification number: H05K3/4611 ,  H05K1/185 ,  H05K1/188 ,  H05K3/30 ,  H05K3/323 ,  H05K3/46 ,  H05K2201/032 ,  H05K2203/063 ,  H05K2203/068

Abstract: In a semi-finished product for the production of a printed circuit board, the semi-finished product comprising a plurality of having multiple insulating layers of a prepreg material and conductive layers (2, 2′) of a conductive material and further comprising having at least one electronic component embedded in at least one insulating layer the at least one electronic component is attached to a corresponding conductive layer by the aid of an Anisotropic Conductive Film and the Anisotropic Conductive Film as well as the prepreg material are in an unprocessed state. The method for producing a printed circuit board comprises the following steps: Providing at least one conductive layer (2), Applying an Anisotropic Conductive Film on the conductive layer, Affixing at least one electronic component on the Anisotropic Conductive Film, Embedding the electronic component in at least one insulating layer of prepreg material to obtain a semi-finished product, Laminating the semi-finished product to process the prepreg material and the Anisotropic Conductive Film.

公开(公告)号：EP2811050A4

公开(公告)日：2015-10-07

申请号：EP13744378

申请日：2013-01-30

Applicant: TOPPAN PRINTING CO LTD ,  UNIV GUNMA NAT UNIV CORP

Inventor： TSUCHIDA TETSUYUKI ,  OKUBO TOSHIKAZU ,  SHOHJI IKUO ,  KANO TAKAHIRO

IPC: C23C18/36 ,  C23C18/16 ,  C23C18/44 ,  C23C18/50 ,  H05K1/09 ,  H05K3/24

CPC classification number: H05K1/09 ,  C23C18/1651 ,  C23C18/36 ,  C23C18/44 ,  C23C18/50 ,  H05K3/243 ,  H05K3/244 ,  H05K2201/032 ,  H05K2201/0776 ,  H05K2203/072

Abstract: A wiring substrate (1) includes an electrode (12) including Cu or a Cu alloy, and a plated film (14) including an electroless nickel-plated layer (18) formed on the electrode (12) and an electroless gold-plated layer (22) formed on the electroless nickel-plated layer (18). The electroless nickel-plated layer (18) is formed by co-precipitation of Ni, P, Bi, and S, the electroless nickel-plated layer (18) includes a content of P of 5% by mass or more and less than 10% by mass, a content of Bi of 1 ppm by mass to 1,000 ppm by mass, and a content of S of 1 ppm by mass to 2,000 ppm by mass, and a mass ratio of the content of S to the content of Bi (S/Bi) is more than 1.0.

公开(公告)号：EP2820596A1

公开(公告)日：2015-01-07

申请号：EP13764036.3

申请日：2013-03-20

Applicant: LG Innotek Co., Ltd.

Inventor： Lim, Seol Hee

IPC: G06K19/077 ,  H05K1/18

CPC classification number: H05K1/05 ,  C25D3/14 ,  C25D3/16 ,  C25D5/022 ,  C25D5/12 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/11 ,  H05K1/117 ,  H05K1/181 ,  H05K3/244 ,  H05K2201/0104 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/10159 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed circuit board for a memory card includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on exposed surfaces of the mounting part and the terminal part.

Abstract translation: 用于存储卡的印刷电路板包括在绝缘层; 在绝缘层的第一表面的安装部分，该安装部分被电连接到存储装置; 和在所述绝缘层的第二表面上的端子部，所述端子部电连接到外部电子设备，worin具有相同的属性是形成在安装部和所述端子部分的暴露的表面上的相同的金属层。

公开(公告)号：EP2520139A1

公开(公告)日：2012-11-07

申请号：EP10800869.9

申请日：2010-12-29

Applicant: E.I. Du Pont De Nemours And Company

Inventor： NAIR, Kumaran, Manikantan ,  GORDON, Scott, E. ,  MCCOMBS, Mark, Frederick

IPC: H05K1/09 ,  H01B1/22

CPC classification number: H05K3/0094 ,  H01B1/22 ,  H05K1/09 ,  H05K1/092 ,  H05K1/095 ,  H05K1/115 ,  H05K3/4061 ,  H05K2201/032 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1126

Abstract: A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt% gold and 80-55 wt% silver and (ii) 100 wt% silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt%, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.

公开(公告)号：EP3255014B1

公开(公告)日：2018-12-12

申请号：EP17174823.9

申请日：2017-06-07

Applicant: COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES

Inventor： BENWADIH, Mohammed ,  ALIANE, Abdelkader

IPC: B81B7/00 ,  C09D11/52 ,  H05K1/09 ,  H01Q7/00 ,  C09D11/033 ,  C09D11/037 ,  C09D11/322 ,  C09D11/36

CPC classification number: H05K3/125 ,  B05D1/02 ,  B81B7/0006 ,  B81B2207/07 ,  C09D11/033 ,  C09D11/037 ,  C09D11/322 ,  C09D11/36 ,  C09D11/52 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/0284 ,  H05K1/092 ,  H05K1/097 ,  H05K1/165 ,  H05K3/0014 ,  H05K2201/032 ,  H05K2201/10098 ,  H05K2203/013

公开(公告)号：EP3299113A4

公开(公告)日：2018-05-16

申请号：EP16796071

申请日：2016-04-26

Applicant: PANASONIC IP MAN CO LTD

Inventor： HINE KIYOHIRO ,  FURUSAWA AKIO ,  KITAURA HIDETOSHI

IPC: B23K35/26 ,  C22C13/00 ,  H05K1/18 ,  H05K3/34

CPC classification number: B23K35/262 ,  B23K35/26 ,  C22C13/00 ,  C22C13/02 ,  H05K1/09 ,  H05K1/181 ,  H05K3/34 ,  H05K3/3457 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/032 ,  Y02P70/611

Abstract: A solder alloy contains 0.5 mass% or more and 1.25 mass% or less of Sb, In which satisfies 5.5‰¤[In]‰¤5.50+1.06[Sb] in a case of 0.5‰¤[Sb]‰¤1.0; and 5.5‰¤[In]‰¤6.35+0.212[Sb] in a case of 1.0

公开(公告)号：EP3184511A4

公开(公告)日：2017-07-26

申请号：EP15835592

申请日：2015-08-27

Applicant: TOKYO OHKA KOGYO CO LTD

Inventor： ISHIKAWA TATSURO ,  NODA KUNIHIRO ,  OHUCHI YASUHIDE ,  CHISAKA HIROKI ,  SHIOTA DAI ,  MAEDA YUKITSUGU ,  IMOTO TAKAFUMI ,  FUJITA KOUHEI ,  AKAI YASUYUKI

IPC: C07D233/60 ,  C23C22/02 ,  C23C22/05 ,  C23F11/00 ,  G03F7/004 ,  G03F7/039 ,  H05K3/28

CPC classification number: C07D233/60 ,  C08K5/3445 ,  C23C22/02 ,  C23C22/05 ,  C23F11/00 ,  G03F7/004 ,  G03F7/031 ,  G03F7/038 ,  G03F7/039 ,  G03F7/162 ,  G03F7/168 ,  G03F7/20 ,  G03F7/322 ,  G03F7/40 ,  H05K1/09 ,  H05K3/28 ,  H05K3/4644 ,  H05K2201/032

Abstract: This invention provides: a new imidazole compound that yields a surface treatment liquid that is very effective at suppressing migration and the oxidation of a wiring surface; a metal surface treatment liquid that contains the imidazole compound; a metal surface treatment method that uses the metal surface treatment liquid; and a laminate production method that uses the surface treatment liquid. Metal is surface-treated using the surface treatment liquid which includes a saturated fatty acid or a saturated fatty acid ester of a specific structure, in which a prescribed position is substituted by an aromatic group of a prescribed structure and an imidazolyl group that may have a substituent group.

Abstract translation: 本发明提供一种新的咪唑化合物，其产生对抑制布线表面的迁移和氧化非常有效的表面处理液; 含有咪唑化合物的金属表面处理液; 使用该金属表面处理液的金属表面处理方法; 以及使用该表面处理液的层压体制造方法。 金属使用包含特定结构的饱和脂肪酸或饱和脂肪酸酯的表面处理液进行表面处理，其中规定位置被规定结构的芳香族基团和可具有 取代基。

公开(公告)号：EP3122920A1

公开(公告)日：2017-02-01

申请号：EP15709922.7

申请日：2015-03-12

Applicant: Atotech Deutschland GmbH

Inventor： NISHIGAWA, Tadahiro ,  HIGUCHI, Jun ,  ISHIKAWA, Hitoshi

IPC: C25D5/34 ,  C25D5/54 ,  H05K3/42 ,  C25D3/38

CPC classification number: C25D5/34 ,  C25D3/38 ,  C25D5/56 ,  H05K1/0296 ,  H05K3/424 ,  H05K3/427 ,  H05K3/467 ,  H05K2201/032 ,  H05K2201/0329 ,  H05K2203/0793 ,  H05K2203/0796

Abstract: In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, the insulator outer surface and the copper layer outer surface are simultaneously subjected to (1) a process including treatment with an alkali metal hydroxide solution, (2) a process including treatment with an alkaline aqueous solution containing an aliphatic amine, (3) a process including treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt % and a pH of 8 to 11, (4) a process including treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polystyrenesulphonic acid, and (5) a process including copper electroplating, which are implemented sequentially.

Abstract translation: 在像的印刷电路板，其包括上绝缘体和层压在所述绝缘体的一部分的铜层的基板，所述绝缘体的外表面和铜层外表面同时进行（1）一种方法，包括治疗有超过碱金属氢氧化物溶液， （2）一种方法，包括用在碱性wässrige溶液在脂肪族胺含治疗，（3）一种方法，包括用在碱性wässrige溶液具有0.3〜3.5重量％的高锰酸盐浓度和pH为8至11的治疗，（4） 与在酸性微滴乳状液wässrige溶液含噻吩化合物和聚苯乙烯磺酸的碱金属盐，以及（5）一种方法，包括铜电镀，这是按顺序实施的处理包括治疗。