Abstract:
PROBLEM TO BE SOLVED: To provide a method of forming a transparent conductive film which enables a transparent conductive film having a low resistance and a high visible light transmittance to be formed by irradiating a coating film with plasma in the atmosphere without requiring heat treatment or an evacuated atmosphere and is advantageous in mass productivity and cost because of the use of a coating method, and to provide the transparent conductive film. SOLUTION: The method of forming a transparent conductive film is characterized in that a coating film 7 is formed by coating a substrate 6 with conductive paint, and reaction gas is introduced onto the coating film 7 under an atmospheric pressure to make the reaction gas into plasma P, and the coating film 7 is irradiated with the plasma P to be modified, whereby a transparent conductive film 9 is formed on the substrate 6. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To solve the problem of a conventional technology wherein a microminiature needle used for a liquid spray nozzle, a nozzle for an ink jet printer or a painless needle does not satisfy all of mechanical strength, chemical stability and a low price. SOLUTION: This microminiature needle is characterized by forming at least its tip part from hard amorphous carbon. This manufacturing method of the microminiature needle has at least a process for forming a master model of the microminiature needle in the first material, a process for forming a mold of the microminiature needle in the second material, a process for depositing a hard amorphous carbon film on the mold comprising the second material, and a process for exfoliating a mold comprising the hard amorphous carbon film and the second material from the mold comprising the second material on which the hard amorphous carbon film is formed. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To realize a power supply circuit for plasma generation, and a plasma generator capable of smoothly obtaining a plenty of generated plasma without having the device larger-sized, as well as a plasma treatment device capable of putting a plenty of treated objects under plasma treatment at low cost and a target item having target quality passing the plasma treatment, with the use of such a plasma generator. SOLUTION: An LC series circuit serially connecting a capacitor C and a coil L is provided between one of the outputs of an alternate high-voltage generating circuit generating alternate high voltage to be impressed between each electrode for discharge generation consisting of two or more first electrodes and one or more second electrodes and the above first electrodes. When discharge is generated at one of the electrode pairs, voltage fall is restrained by the coil even if discharge of the capacitor is progressed, and discharge by the other electrode pair is induced without being intervened, so that a plenty of plasma can be smoothly generated with a common use of the alternate high-voltage generating circuit. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a plasma-generating electrode capable of stably and surely generating discharge between opposing electrodes and continuously generating plasma with ease, and to provide a plasma generator and a plasma treatment device. SOLUTION: On the plasma-generating electrode 4 for generating plasma between electrodes 4a, 4b, sharp protrusions 4g facing each other are formed at least on one electrode 4a of the electrode A so as to generate a discharge between the protrusion 4g and the electrode 4b at another side, and to generate a plasma. The sharp protrusions 4g may be formed in any shape. If only any fluid is made to flow from a flow feeder 7, required air plasma or liquid plasma can be generated. If a matter to be treated is treated with the plasma, a plasma device such as a film-forming device, a processing device, and a powder treatment device can be constituted. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To thickly and uniformly deposit a DLC (Diamond Like Carbon) film on the surface of a base material such as a low melting point alloy, copper, brass or the like with high adhesion while suppressing the increase of the temperature rise in the base material itself. SOLUTION: A high frequency power source 11 for plasma generation and a power source 12 for high voltage pulse generation are connected to a superimposition apparatus 9. Further, the superimposition apparatus 9 is connected to a base material 1 in a chamber 2 via a common feed through 8, a high frequency pulse is applied to the base material 1 from a high frequency power source 11 for plasma generation, and a negative high voltage pulse is applied to the base material 1 from the power source 12 for high voltage pulse generation in the plasma or afterglow plasma. COPYRIGHT: (C)2005,JPO&NCIPI