公开(公告)号：US08927391B2

公开(公告)日：2015-01-06

申请号：US13118108

申请日：2011-05-27

Applicant: Meng-Tse Chen ,  Wei-Hung Lin ,  Sheng-Yu Wu ,  Chun-Cheng Lin ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Chih-Wei Lin ,  Wen-Hsiung Lu ,  Hsiu-Jen Lin ,  Bor-Ping Jang ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Wei-Hung Lin ,  Sheng-Yu Wu ,  Chun-Cheng Lin ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Chih-Wei Lin ,  Wen-Hsiung Lu ,  Hsiu-Jen Lin ,  Bor-Ping Jang ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/30 ,  H01L21/56 ,  H01L25/00 ,  H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L24/17 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16055 ,  H01L2224/16113 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1304 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/00

Abstract: A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.

Abstract translation: 包装方法包括将包装部件放置在脱模膜上，其中包装部件表面上的焊球与剥离膜物理接触。 接下来，填充在剥离膜和包装部件之间的模塑料固化，其中在固化步骤期间，焊球与剥离膜保持物理接触。

公开(公告)号：US08674496B2

公开(公告)日：2014-03-18

申请号：US13399437

申请日：2012-02-17

Applicant: Cheng-Chung Lin ,  Hsiu-Jen Lin ,  Cheng-Ting Chen ,  Chun-Cheng Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Cheng-Chung Lin ,  Hsiu-Jen Lin ,  Cheng-Ting Chen ,  Chun-Cheng Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L25/07

CPC classification number: H01L24/14 ,  H01L23/49816 ,  H01L23/5389 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00

Abstract: A fine pitch package-on-package (PoP), and a method of forming, are provided. The PoP may be formed by placing connections, e.g., solder balls, on a first substrate having a semiconductor die attached thereto. A first reflow process is performed to elongate the solder balls. Thereafter, a second substrate having another semiconductor die attached thereto is connected to the solder balls. A second reflow process is performed to form an hourglass connection.

Abstract translation: 提供了一种精细节距封装（PoP）和一种形成方法。 PoP可以通过将连接例如焊球放置在具有附接到其上的半导体管芯的第一基板上而形成。 执行第一回流处理以延长焊球。 此后，具有安装有另一个半导体管芯的第二基板连接到焊球。 执行第二回流处理以形成沙漏连接。

公开(公告)号：US20140049461A1

公开(公告)日：2014-02-20

申请号：US13588166

申请日：2012-08-17

Applicant: Hsing-Yuan Shen ,  Chun-Cheng Lin

Inventor： Hsing-Yuan Shen ,  Chun-Cheng Lin

IPC: G06F3/01

CPC classification number: A63F13/22 ,  G06F3/038

Abstract: A fully automatic simulation system for an input device permits storage in advance of executable applications and associated simulation setting flies into a database, and then combination of the detection, automatic data searching and matching, transmission and conversion, enabling rapid and convenient operation by the users, whenever they operate various applications or whether they adopt a keyboard, mouse or joystick as the simulation controller.

Abstract translation: 用于输入设备的全自动仿真系统允许在可执行应用程序之前进行存储，并将相关的仿真设置进入数据库，然后组合检测，自动数据搜索和匹配，传输和转换，使用户能够快速方便地进行操作 ，每当他们操作各种应用程序，或者他们是否采用键盘，鼠标或操纵杆作为模拟控制器。

公开(公告)号：US08642445B2

公开(公告)日：2014-02-04

申请号：US13476340

申请日：2012-05-21

Applicant: Meng-Tse Chen ,  Hui-Min Huang ,  Chun-Cheng Lin ,  Chih-Chun Chiu ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Hui-Min Huang ,  Chun-Cheng Lin ,  Chih-Chun Chiu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/301

CPC classification number: B29C53/18 ,  H01L21/561 ,  H01L21/565 ,  H01L21/566 ,  H01L23/295 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2924/00

Abstract: Embodiments of mechanisms for flattening a packaged structure are provided. The mechanisms involve a flattening apparatus and the utilization of protection layer(s) between the packaged structure and the surface(s) of the flattening apparatus. The protection layer(s) is made of a soft and non-sticking material to allow protecting exposed fragile elements of the packaged structure and easy separation after processing. The embodiments of flattening process involve flattening the warped packaged structure by pressure under elevated processing temperature. Processing under elevated temperature allows the package structure to be flattened within a reasonable processing time.

Abstract translation: 提供了用于使封装结构平坦化的机构的实施例。 这些机构涉及压平装置以及在封装结构和平坦化装置的表面之间利用保护层。 保护层由柔软和不粘的材料制成，以保护封装结构的暴露的易碎元件并且在加工之后易于分离。 扁平化过程的实施例涉及在升高的加工温度下通过压力使翘曲的包装结构变平。 在高温下进行处理可使包装结构在合理的处理时间内变平。

公开(公告)号：US20130214401A1

公开(公告)日：2013-08-22

申请号：US13399437

申请日：2012-02-17

Applicant: Cheng-Chung Lin ,  Hsiu-Jen Lin ,  Cheng-Ting Chen ,  Chun-Cheng Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Cheng-Chung Lin ,  Hsiu-Jen Lin ,  Cheng-Ting Chen ,  Chun-Cheng Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L25/07 ,  H01L21/50

CPC classification number: H01L24/14 ,  H01L23/49816 ,  H01L23/5389 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00

Abstract: A fine pitch package-on-package (PoP), and a method of forming, are provided. The PoP may be formed by placing connections, e.g., solder balls, on a first substrate having a semiconductor die attached thereto. A first reflow process is performed to elongate the solder balls. Thereafter, a second substrate having another semiconductor die attached thereto is connected to the solder balls. A second reflow process is performed to form an hourglass connection.

Abstract translation: 提供了一种精细节距封装（PoP）和一种形成方法。 PoP可以通过将连接例如焊球放置在具有附接到其上的半导体管芯的第一基板上而形成。 执行第一回流处理以延长焊球。 此后，具有安装有另一个半导体管芯的第二基板连接到焊球。 执行第二回流处理以形成沙漏连接。

公开(公告)号：US20130143364A1

公开(公告)日：2013-06-06

申请号：US13312395

申请日：2011-12-06

Applicant: Hsiu-Jen LIN ,  Chung-Shi LIU ,  Ming-Da CHENG ,  Chun-Cheng LIN ,  Yu-Peng TSAI ,  Cheng-Ting CHEN

Inventor： Hsiu-Jen LIN ,  Chung-Shi LIU ,  Ming-Da CHENG ,  Chun-Cheng LIN ,  Yu-Peng TSAI ,  Cheng-Ting CHEN

IPC: H01L21/58

Abstract: A method includes vacuum annealing on a substrate having at least one solder bump to reduce voids at an interface of the at least one solder bump. A die is mounted over the substrate.

Abstract translation: 一种方法包括在具有至少一个焊料凸块的衬底上进行真空退火以减少在至少一个焊料凸块的界面处的空隙。 模具安装在基板上。

公开(公告)号：US20110280428A1

公开(公告)日：2011-11-17

申请号：US12877633

申请日：2010-09-08

Applicant: Chen Tseng ,  Yi-An Lai ,  Chun-Cheng Lin

Inventor： Chen Tseng ,  Yi-An Lai ,  Chun-Cheng Lin

IPC: H04R1/02

CPC classification number: H04R1/2811 ,  H04R1/028 ,  H04R2499/11

Abstract: An electronic device is provided. The electronic device includes a first body, a second body, a speaker cabinet and a link mechanism. The second body rotates relative to the first body by a hinge. The speaker cabinet, disposed in the first body, is selectively lengthened or shortened. The link mechanism connects the hinge with the speaker cabinet. When the second body is closed relative to the first body, the speaker cabinet is concealed in the first body, and when the second body is opened relative to the first body, the hinge drives the link mechanism to press the speaker cabinet, enabling the speaker to be lengthened or to be shortened

Abstract translation: 提供电子设备。 电子装置包括第一主体，第二主体，扬声器壳体和连杆机构。 第二主体通过铰链相对于第一主体旋转。 设置在第一主体中的扬声器柜选择性地延长或缩短。 连杆机构将铰链与扬声器机箱连接。 当第二主体相对于第一主体闭合时，扬声器箱被隐藏在第一主体中，并且当第二主体相对于第一主体打开时，铰链驱动连杆机构以按压扬声器柜，从而使扬声器 延长或缩短

公开(公告)号：US08013355B2

公开(公告)日：2011-09-06

申请号：US11939552

申请日：2007-11-13

Applicant: Chun-Cheng Lin ,  Abram Chang ,  Sheng-Jia Sheu ,  Eddie Huang

Inventor： Chun-Cheng Lin ,  Abram Chang ,  Sheng-Jia Sheu ,  Eddie Huang

IPC: H01L33/00 ,  H01L31/0203 ,  H01L31/0232

CPC classification number: H05K1/0203 ,  H01L33/647 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/10659

Abstract: A high power light emitting diode, The high power light emitting diode comprises a light emitting diode chip, a main module, two first electrode pins, two second electrode pins, and at least one heat dissipation board. The main module has a concave and the light emitting diode chip is positioned in the concave. The first electrode pins are connected to a first side of the main module and also electrically connected to the light emitting diode chip. The second electrode pins are arranged on a second side of the main module that is relative to the first electrode pins wherein the second electrode pins and the first electrode pins are electrically opposite. The second electrode pins are electrically connected to the light emitting diode chip. The heat dissipation board is connected to a part of the main module between the first electrode pin and the second electrode pin.

Abstract translation: 大功率发光二极管，大功率发光二极管包括发光二极管芯片，主模块，两个第一电极引脚，两个第二电极引脚和至少一个散热板。 主模块具有凹面，发光二极管芯片位于凹面。 第一电极引脚连接到主模块的第一侧，并且电连接到发光二极管芯片。 第二电极引脚布置在主模块的相对于第一电极引脚的第二侧，其中第二电极引脚和第一电极引脚电气相对。 第二电极引脚电连接到发光二极管芯片。 散热板与主模块的一部分连接在第一电极销和第二电极销之间。

公开(公告)号：US20100144734A1

公开(公告)日：2010-06-10

申请号：US12591235

申请日：2009-11-13

Applicant: Duen-Ren Hou ,  Ming-Shiu Hung ,  Chun-Chen Liao ,  Chun-Cheng Lin

Inventor： Duen-Ren Hou ,  Ming-Shiu Hung ,  Chun-Chen Liao ,  Chun-Cheng Lin

IPC: A61K31/5377 ,  C07D249/04 ,  A61K31/4192 ,  C07D401/12 ,  A61K31/445 ,  C07D413/12

CPC classification number: C07D249/06 ,  A61K31/4192 ,  A61K31/445 ,  A61K31/5377 ,  C07D405/12 ,  C07D409/04

Abstract: The present invention relates to 1,2,3-triazole derivatives which can be used as cannabinoid CB1 receptor antagonists. In addition, the compound of the 1,2,3-triazole derivatives in the present invention can be formulated into a pharmaceutical composition for treating indications relative to signal transduction of CB1 receptors.

Abstract translation: 本发明涉及可用作大麻素CB1受体拮抗剂的1,2,3-三唑衍生物。 此外，本发明中的1,2,3-三唑衍生物的化合物可以配制成用于治疗相对于CB1受体信号转导的适应症的药物组合物。

公开(公告)号：US20100138911A1

公开(公告)日：2010-06-03

申请号：US12327703

申请日：2008-12-03

Applicant: Chun-Cheng LIN ,  Chia-Feng Kang

Inventor： Chun-Cheng LIN ,  Chia-Feng Kang

IPC: H04L9/32

CPC classification number: H04L63/20 ,  H04L63/0272 ,  H04L67/025

Abstract: The preset invention provides an Intrnet-based automatic security system and method. The security system includes a network server with a database, a network detection module and an automatic transmitting module, and a security device with a microcontroller, a virtual IP network module and wireless transmission module. The network detection module receives the information of security device and detects the networking state. The automatic transmitting module automatically transmits the alarm information from the network detection module to the client and security operator. The microcontroller links security components. The virtual IP network module employs a virtual IP address and links to a virtual IP router through a transmission interface. The security device also contains a polling module automatically linked to the network server for reading data.

Abstract translation: 本发明提供了一种基于Intrnet的自动安全系统和方法。 安全系统包括具有数据库的网络服务器，网络检测模块和自动发送模块，以及具有微控制器，虚拟IP网络模块和无线传输模块的安全装置。 网络检测模块接收安全设备信息，检测组网状态。 自动发送模块自动将报警信息从网络检测模块发送给客户端和安全运营商。 微控制器链接安全组件。 虚拟IP网络模块采用虚拟IP地址，并通过传输接口链接到虚拟IP路由器。 安全设备还包含一个自动链接到网络服务器的轮询模块，用于读取数据。