公开(公告)号：US20180048973A1

公开(公告)日：2018-02-15

申请号：US15553414

申请日：2015-12-17

Applicant: GOERTEK.INC

Inventor： Kang PING ,  Xinfeng YANG ,  Jie WEI

IPC: H04R29/00 ,  H04R23/00

CPC classification number: H04R29/00 ,  H04R3/007 ,  H04R23/002 ,  H04R29/003

Abstract: Disclosed are a method, system and controller for simultaneously verifying amplitude and temperature parameters of an electrical-acoustic conversion device, including: inputting a sweep signal to the electrical-acoustic conversion device; testing the amplitude of the electrical-acoustic conversion device while adjusting the gain of the whole frequency band of the sweep signal until the maximum value of the tested amplitude is a maximum amplitude parameter Xmax, and testing the temperature of a voice coil at this moment; and if the tested temperature of the voice coil at this moment is higher or lower than Tmax, gradually reducing/increasing the gain of the sweep signal in the frequency band above a gain improvement frequency point until the tested temperature of the voice coil is Tmax, and then maintaining the gain of the sweep signal for a predetermined period of time and then testing the performance of the electrical-acoustic conversion device.

公开(公告)号：US20180035211A1

公开(公告)日：2018-02-01

申请号：US15551254

申请日：2015-11-26

Applicant: Goertek.Inc

Inventor： Minghui SHAO ,  Jianbin YANG

IPC: H04R9/02 ,  H04R9/06

CPC classification number: H04R9/025 ,  H04R7/10 ,  H04R7/26 ,  H04R9/06 ,  H04R29/001 ,  H04R31/003

Abstract: The present invention discloses a speaker device capable of restraining polarization, a method for adjusting a diaphragm balance position of the speaker device and a method for adjusting diaphragm compliance performance of the speaker device. The speaker device comprises a vibration system, a magnetic circuit system, a shell accommodating the vibration system and the magnetic circuit system, a first electret layer, a second electret layer and a third electret layer, wherein the first electret layer, the second electret layer and the third electret layer have the same electric charge polarity; the first electret layer is attached to the vibration system; the second electret layer is attached to a first fixing component above the vibration system and opposite to the first electret layer; the third electret layer is attached to a second fixing component below the vibration system and opposite to the first electret layer; and the first electret layer, the second electret layer and the third electret layer are parallel to one another. In the present invention, an electrostatic field force is adopted to restrain the polarization of a diaphragm in a vibration direction.

公开(公告)号：US20170363656A1

公开(公告)日：2017-12-21

申请号：US15542761

申请日：2015-07-23

Applicant: Goertek.Inc

Inventor： Huabin Fang ,  Qinglin Song ,  Yanmei Sun

IPC: G01P15/125

CPC classification number: G01P15/125 ,  G01P2015/0822

Abstract: A Z-axis structure in an accelerometer comprises a mass block (1) moving relative to a substrate (4) in a Z-axis direction in a reciprocating manner. A first movable electrode plate (10) and a second movable electrode plate (11) are disposed on a sidewall of the mass block (1). A first fixed electrode plate (20) and a second fixed electrode plate (30) extending toward a plane consisting of an X axis and a Y axis are also disposed on the sidewall of the mass block (1). According to the Z-axis accelerometer, a lower plate structure is discarded, therefore the limitation of a lower plate to the Z-axis accelerometer is avoided, the mass block (1) can move up and down in the Z-axis direction, rather than moving in a teeterboard moving manner, the parasitic capacitance of the Z-axis accelerometer is reduced, and the detection precision is improved; the contact between the movable mass block (1) and the substrate (4) is avoided, and therefore the chip reliability is improved; the mass block (1) and the fixed electrodes are located at a same layer, therefore the consistence is superior to that of the traditional Z-axis structure; in addition, anchor points can be centralized in design, so as to reduce the sensitivity of a chip to the changes of the temperature and stress.

公开(公告)号：US20170363655A1

公开(公告)日：2017-12-21

申请号：US15538230

申请日：2015-07-23

Applicant: Goertek.Inc

Inventor： Tingkai ZHANG

IPC: G01P15/125 ,  G01P15/18

Abstract: An inertia measurement module and three-axis accelerometer, comprising a first pole piece (4) located on a substrate and a mass block (1) suspendingly connected above the substrate via elastic beams (11, 12); the elastic beams (11, 12) includes a first elastic beam (12) and a second elastic beam (11), two ends of the second elastic beams (11) being connected to an anchor point (6) of the substrate, two ends of the first elastic beam (11) being connected to the mass block (1); a center of the first elastic beam (12) and/or the second elastic beam (11) deviates from a center of gravity of the mass block (1); the mass block (1) is further provided with a first movable electrode (9) and a second movable electrode (10) in a Y-axis and an X-axis direction; the movement of one axis in a plane of the inertia measurement module cannot be affected by an eccentric structure feature, such that both X-axis movement and Y-axis movement are linear movements, thus not intensifying an inter-axis coupling, and also not reducing displacement of a mass block on the X-axis and the Y-axis, thus improving capacitance detection precision.

公开(公告)号：US20170278734A1

公开(公告)日：2017-09-28

申请号：US15529590

申请日：2015-08-18

Applicant: Goertek.Inc

Inventor： Quanbo Zou ,  Zhe Wang

IPC: H01L21/67 ,  H01L23/00 ,  H01L33/40 ,  H01L27/15 ,  H01L33/00

CPC classification number: H01L21/67144 ,  H01L24/83 ,  H01L24/95 ,  H01L27/15 ,  H01L33/0095 ,  H01L33/405 ,  H01L2924/12042

Abstract: A pre-screening method, manufacturing method, device and electronic apparatus of micro-LED. The method for pre-screening defect micro-LEDs comprises: obtaining a defect pattern of defect micro-LEDs on a laser-transparent substrate (S6100); and irradiating the laser-transparent substrate with laser from the laser-transparent substrate side in accordance with the defect pattern (S6200), to lift-off the defect micro-LEDs from the laser-transparent substrate.

公开(公告)号：US20170263593A1

公开(公告)日：2017-09-14

申请号：US15529612

申请日：2015-04-01

Applicant: Goertek.Inc

Inventor： Quanbo Zou ,  Zhe Wang

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0066

Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED comprises: forming a micro-LED on a laser-transparent original substrate; bringing the micro-LED into contact with a pad preset on a receiving substrate; and irradiating the original substrate with laser from the original substrate side to lift-off the micro-LED from the original substrate.

公开(公告)号：US20200039816A1

公开(公告)日：2020-02-06

申请号：US16339455

申请日：2016-10-08

Applicant: GOERTEK.INC

Inventor： QUANBO ZOU

IPC: B81B7/00 ,  H04R19/04

Abstract: An MEMS microphone device and an electronics apparatus are provided. The MEMS microphone device comprises: a substrate; a MEMS microphone element placed on the substrate; a cover encapsulating the MEMS microphone element together with the substrate; and an acoustic port for the MEMS microphone element, wherein a compliant membrane is provided to seal the acoustic port, and the membrane has a mechanical stiffness lower than that of the diaphragm of the MEMS microphone element.

公开(公告)号：US10473686B2

公开(公告)日：2019-11-12

申请号：US15538230

申请日：2015-07-23

Applicant: Goertek.Inc

Inventor： Tingkai Zhang

IPC: G01P15/125 ,  G01P15/18

Abstract: An inertia measurement module and three-axis accelerometer, comprising a first pole piece (4) located on a substrate and a mass block (1) suspendingly connected above the substrate via elastic beams (11, 12); the elastic beams (11, 12) includes a first elastic beam (12) and a second elastic beam (11), two ends of the second elastic beams (11) being connected to an anchor point (6) of the substrate, two ends of the first elastic beam (11) being connected to the mass block (1); a center of the first elastic beam (12) and/or the second elastic beam (11) deviates from a center of gravity of the mass block (1); the mass block (1) is further provided with a first movable electrode (9) and a second movable electrode (10) in a Y-axis and an X-axis direction; the movement of one axis in a plane of the inertia measurement module cannot be affected by an eccentric structure feature, such that both X-axis movement and Y-axis movement are linear movements, thus not intensifying an inter-axis coupling, and also not reducing displacement of a mass block on the X-axis and the Y-axis, thus improving capacitance detection precision.

公开(公告)号：US10397676B2

公开(公告)日：2019-08-27

申请号：US15542866

申请日：2015-11-18

Applicant: Goertek.Inc

Inventor： Minghui Shao ,  Jianbin Yang

IPC: H04R1/02 ,  H04R7/12 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06 ,  H04R31/00 ,  B29C45/00 ,  B29K105/16 ,  B29L31/34

Abstract: The present invention discloses a speaker module, comprising: a speaker assembly, a module shell and a front cover. The module shell is configured to bear the speaker assembly, and comprises a first shell and a second shell, wherein the first shell is doped with a thermally conductive filler. The front cover is configured to cooperate with the module shell to encapsulate the speaker assembly. The speaker module provided by the present invention can quickly discharge heat generated by the speaker assembly during operation through the module shell to prevent overheat of the speaker assembly, thereby avoiding performance loss of a speaker due to high temperature.

公开(公告)号：US10273150B2

公开(公告)日：2019-04-30

申请号：US15554653

申请日：2015-12-14

Applicant: Goertek.Inc

Inventor： Yanmei Sun

IPC: H04R31/00 ,  G01L7/08 ,  B81B7/02 ,  H04R19/04 ,  B81C1/00 ,  H04R19/00

Abstract: The present invention discloses a manufacturing method of an integrated structure of a MEMS microphone and a pressure sensor, which comprises the following steps: depositing an insulating layer, a first polycrystalline silicon layer, a sacrificial layer and a second polycrystalline silicon layer in sequence on a shared substrate; etching the second polycrystalline silicon layer to form a vibrating diaphragm and an upper electrode; eroding the sacrificial layer to form a containing cavity of a microphone and a pressure sensor, and etching the sacrificial layer between the microphone and the pressure sensor; etching the first polycrystalline silicon layer to form a back electrode of the microphone and a lower electrode of the pressure sensor; etching a position of the shared substrate below a back electrode of the microphone to form a back cavity; and etching away the region of the insulating layer below the back electrode. A capacitance structure of a MEMS microphone and that of a pressure sensor are integrated on a shared substrate, improving integration of a MEMS microphone and a pressure sensor, and greatly reducing a size of a whole packaging structure; in addition, a microphone and a pressure sensor can be simultaneously manufactured on a shared substrate to improve the efficiency of production.