公开(公告)号：US20170363656A1

公开(公告)日：2017-12-21

申请号：US15542761

申请日：2015-07-23

Applicant: Goertek.Inc

Inventor： Huabin Fang ,  Qinglin Song ,  Yanmei Sun

IPC: G01P15/125

CPC classification number: G01P15/125 ,  G01P2015/0822

Abstract: A Z-axis structure in an accelerometer comprises a mass block (1) moving relative to a substrate (4) in a Z-axis direction in a reciprocating manner. A first movable electrode plate (10) and a second movable electrode plate (11) are disposed on a sidewall of the mass block (1). A first fixed electrode plate (20) and a second fixed electrode plate (30) extending toward a plane consisting of an X axis and a Y axis are also disposed on the sidewall of the mass block (1). According to the Z-axis accelerometer, a lower plate structure is discarded, therefore the limitation of a lower plate to the Z-axis accelerometer is avoided, the mass block (1) can move up and down in the Z-axis direction, rather than moving in a teeterboard moving manner, the parasitic capacitance of the Z-axis accelerometer is reduced, and the detection precision is improved; the contact between the movable mass block (1) and the substrate (4) is avoided, and therefore the chip reliability is improved; the mass block (1) and the fixed electrodes are located at a same layer, therefore the consistence is superior to that of the traditional Z-axis structure; in addition, anchor points can be centralized in design, so as to reduce the sensitivity of a chip to the changes of the temperature and stress.

公开(公告)号：US10277968B2

公开(公告)日：2019-04-30

申请号：US15521151

申请日：2015-01-05

Applicant: Goertek.Inc

Inventor： Guanxun Qiu ,  Qinglin Song

IPC: H04R25/00 ,  H04R1/08 ,  H04R19/00 ,  H04R19/04 ,  H04R1/02

Abstract: The present invention discloses a microphone, comprises: a silicon substrate; a diaphragm disposed over the silicon substrate; a backplate disposed over the diaphragm, the backplate having a plurality of through holes formed therein and a barrier structure, and the plurality of through holes being arranged in a through hole pattern on the backplate; the barrier structure having one or more protruding portions extending from at least one part of the through hole wall of the barrier structure, thereby the section shape of at least one through hole being an irregular shape with one or more inwardly concave portion. The microphone provided by the present invention can achieve a better dustproof effect.

公开(公告)号：US10177055B2

公开(公告)日：2019-01-08

申请号：US15559780

申请日：2015-12-10

Applicant: Goertek.Inc

Inventor： Luyu Duanmu ,  Junde Zhang ,  Qinglin Song

IPC: H01L23/10 ,  B81B7/02 ,  H01L23/552 ,  B81B7/00

Abstract: Provided are an encapsulation structure and encapsulation method for an integrated sensor. The encapsulation structure comprises: a first substrate (1) and a first outer housing (2), the first outer housing and first substrate enclosing a first encapsulation cavity; a plurality of sensors arranged inside the first encapsulation cavity, each of the sensors comprising MEMS sensor chips (3, 8) and ASIC chips (5, 7) electrically connected to the MEMS sensor chips; inside the first encapsulation cavity, the exterior of the ASIC chip of at least one of the sensors is provided with a shielding structure. Arranging a shielding structure on the exterior of the ASIC chip in the integrated sensor and likely to be subjected to interference causes the ASIC chip to be encapsulated in isolation from other sensor units, preventing the other sensor units in the integrated sensor from interfering with the ASIC chip, and effectively improving the performance of the sensor unit and the overall performance of the integrated sensor.