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    AXIAL ALIGNMENT OF A LENSED FIBER IN A SILICA V-GROOVE
    71.
    发明申请
    AXIAL ALIGNMENT OF A LENSED FIBER IN A SILICA V-GROOVE 审中-公开
    二氧化硅V型玻璃中的透镜纤维的轴向对准

    公开(公告)号：US20160341919A1

    公开(公告)日：2016-11-24

    申请号：US15136229

    申请日：2016-04-22

    Applicant: Skorpios Technologies, Inc.

    Inventor： Daming Liu ,  John Zyskind

    IPC: G02B6/42 ,  G02B6/36 ,  G02B6/30

    CPC classification number: G02B6/4243 ,  G02B6/30 ,  G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4202 ,  G02B6/4214 ,  G02B6/4225 ,  G02B6/4226 ,  G02B6/4239

    Abstract: A v-groove assembly is used to edge couple a lensed fiber (e.g., an optical fiber made of silica) with a waveguide in a photonic chip. The v-groove assembly is made from fused silica. Fused silica is used to so that an adhesive (e.g., epoxy resin) used in bonding the lensed fiber to the v-groove assembly and/or bonding the v-groove assembly to the photonic chip can be cured, at least partially, by light.

    Abstract translation: V沟槽组件用于将透镜光纤（例如，由二氧化硅制成的光纤）与光子芯片中的波导连接。 V型槽组件由熔融二氧化硅制成。 使用熔融二氧化硅使得用于将透镜纤维粘合到V形槽组件和/或将V形槽组件粘合到光子芯片上的粘合剂（例如，环氧树脂）可以至少部分地被光固化 。

    Method and system for performing testing of photonic devices
    73.
    发明授权
    Method and system for performing testing of photonic devices 有权
    用于执行光子器件测试的方法和系统

    公开(公告)号：US09236958B2

    公开(公告)日：2016-01-12

    申请号：US13959166

    申请日：2013-08-05

    Applicant: Skorpios Technologies, Inc.

    Inventor： Robert J. Stone ,  Stephen B. Krasulick

    IPC: G01R31/00 ,  G01R31/3187 ,  H04B17/00 ,  H04B10/073

    CPC classification number: G01J1/08 ,  G01J1/42 ,  G01J2001/083 ,  G01J2001/4247 ,  G01R31/3187 ,  H04B10/035 ,  H04B10/0731 ,  H04B10/0779 ,  H04B17/0082

    Abstract: A photonics system includes a transmit photonics module and a receive photonics module. The photonics system also includes a transmit waveguide coupled to the transmit photonics module, a first optical switch integrated with the transmit waveguide, and a diagnostics waveguide optically coupled to the first optical switch. The photonics system further includes a receive waveguide coupled to the receive photonics module and a second optical switch integrated with the receive waveguide and optically coupled to the diagnostics waveguide.

    Abstract translation: 光子系统包括发射光子模块和接收光子模块。 光子系统还包括耦合到发射光子模块的发射波导，与发射波导集成的第一光开关，以及光耦合到第一光开关的诊断波导。 光子系统还包括耦合到接收光子模块的接收波导和与接收波导集成并与光学耦合到诊断波导的第二光开关。

    Method and system for forming a membrane over a cavity
    77.
    发明授权
    Method and system for forming a membrane over a cavity 有权
    在空腔上形成膜的方法和系统

    公开(公告)号：US09184094B1

    公开(公告)日：2015-11-10

    申请号：US13750163

    申请日：2013-01-25

    Applicant: SKORPIOS TECHNOLOGIES, INC.

    Inventor： Elton Marchena

    IPC: H01L21/30 ,  H01L33/00 ,  H01L33/48 ,  H01L21/78 ,  H01L21/762 ,  H01L21/764

    CPC classification number: H01L33/0079 ,  H01L21/762 ,  H01L21/76251 ,  H01L21/76254 ,  H01L21/764 ,  H01L21/7806

    Abstract: A method of fabricating a semiconductor device includes providing an assembly substrate including a split plane defining a handle region and a transfer region, a film layer coupled to the transfer region, and one or more active devices coupled to the film layer. The method also includes providing a device substrate including one or more bonding regions and joining the assembly substrate to the device substrate. The method further includes splitting the assembly substrate to remove the handle region.

    Abstract translation: 一种制造半导体器件的方法包括提供包括限定手柄区域和转移区域的分裂平面的组合衬底，耦合到转移区域的膜层以及耦合到膜层的一个或多个有源器件。 该方法还包括提供包括一个或多个结合区域并将组装衬底接合到器件衬底的器件衬底。 该方法还包括拆分组件衬底以移除把手区域。

    VERTICAL INTEGRATION OF CMOS ELECTRONICS WITH PHOTONIC DEVICES
    79.
    发明申请
    VERTICAL INTEGRATION OF CMOS ELECTRONICS WITH PHOTONIC DEVICES 有权
    CMOS电子与光电器件的垂直集成

    公开(公告)号：US20150123157A1

    公开(公告)日：2015-05-07

    申请号：US14482650

    申请日：2014-09-10

    Applicant: Skorpios Technologies, Inc.

    Inventor： John Dallesasse ,  Stephen B. Krasulick ,  Timothy Creazzo ,  Elton Marchena

    IPC: H01L27/146 ,  H01L27/15

    CPC classification number: H01L27/14689 ,  H01L21/76254 ,  H01L21/8221 ,  H01L21/8258 ,  H01L21/84 ,  H01L27/0688 ,  H01L27/12 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14643 ,  H01L27/14687 ,  H01L27/15

    Abstract: A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices, providing a compound semiconductor substrate including a plurality of photonic devices, and dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method also includes providing an assembly substrate having a base layer and a device layer including a plurality of CMOS devices, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, and aligning the SOI substrate and the assembly substrate. The method further includes joining the SOI substrate and the assembly substrate to form a composite substrate structure and removing at least the base layer of the assembly substrate from the composite substrate structure.

    Abstract translation: 制造复合半导体结构的方法包括提供包括多个硅基器件的SOI衬底，提供包括多个光子器件的化合物半导体衬底，以及切割化合物半导体衬底以提供多个光子管芯。 每个管芯包括多个光子器件中的一个或多个。 该方法还包括提供具有基底层和包括多个CMOS器件的器件层的组装衬底，将多个光子管芯安装在组件衬底的预定部分上，以及对准SOI衬底和组件衬底。 该方法还包括将SOI衬底和组件衬底接合以形成复合衬底结构，并从复合衬底结构去除组装衬底的至少基底层。

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