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公开(公告)号：KR100663323B1
公开(公告)日：2007-01-02
申请号：KR1020050106159
申请日：2005-11-07
Applicant: (주) 인텍플러스
IPC: G01B11/25
Abstract: An apparatus for measuring a three dimensional shape and a method of measuring the three dimensional shape using the same are provided to reduce the installation space by forming the light source and the lattice pattern generating unit at the co-axis. An apparatus for measuring a three dimensional shape comprises a light source(2) installed to supply the light to the measured surface of an object(7); a lattice pattern generating unit(3) installed to be placed at the same axis as the light source to generate the lattice pattern; a projection unit(4) installed at the upper side of the object to project the standard lattice pattern to the object; a lattice pattern acquisition unit(5) obtaining the lattice pattern reflected from the object; and a computer(6) mounted with an image processing unit(61) analyzing the data of the three dimensional shape. The lattice pattern generating unit contains a field stop(33), an aperture stop(31), a first projection lens(32), and a second projection lens(34).
Abstract translation: 提供了一种用于测量三维形状的设备和使用该设备测量三维形状的方法，以通过在共轴上形成光源和格子图案生成单元来减小安装空间。 一种用于测量三维形状的设备，包括：光源（2），被安装以将光提供给物体（7）的测量表面; 格子图案产生单元（3），所述格子图案产生单元（3）安装成与所述光源放置在相同的轴线处以产生所述格子图案; 安装在物体上侧的投影单元（4），用于将标准格子图案投影到物体上; 格子图案获取单元（5），获得从所述物体反射的格子图案; 和安装有分析三维形状数据的图像处理单元（61）的计算机（6）。 该格子图案生成单元包含视场光阑（33），光圈（31），第一投影透镜（32）和第二投影透镜（34）。
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公开(公告)号：KR1020060127529A
公开(公告)日：2006-12-13
申请号：KR1020050048576
申请日：2005-06-07
Applicant: (주) 인텍플러스
IPC: H01L21/66
CPC classification number: G06T7/001 , G06T2207/30148 , H01L22/20 , H01L2924/014
Abstract: A method for testing a semiconductor device is provided to improve precision of a defect test in a ball or a printed circuit board of the semiconductor device by obtaining a lighting image and a coaxial image. A light image is obtained as light image information(S10). A coaxial image is obtained as coaxial image information(S20). An annular image is obtained by subtracting the coaxial image information from the lighting image information(S30). A region between inner and outer diameters are uniformly divided(S40). A binary value of the divided region is analyzed(S50). It is judged whether there are pixels having a binary value of 1 in the divided regions(S60). When there is at least one pixel having a binary value of 1, it is judged that a corresponding region is a normal(S70). It is judged whether a rate of the normal region is equal to or greater than a set value(S80). When the rate of the normal region is equal to or greater than a set value, it is judged that a corresponding ball is normal(S90).
Abstract translation: 提供了一种用于测试半导体器件的方法，以通过获得照明图像和同轴图像来提高半导体器件的球或印刷电路板中的缺陷测试的精度。 获得作为光图像信息的光图像（S10）。 获得同轴图像作为同轴图像信息（S20）。 通过从照明图像信息中减去同轴图像信息获得环形图像（S30）。 内径和外径之间的区域被均匀分割（S40）。 分析分割区域的二进制值（S50）。 在划分的区域中判断是否存在二进制值为1的像素（S60）。 当存在二进制值为1的至少一个像素时，判断对应的区域是正常的（S70）。 判断正常区域的速率是否等于或大于设定值（S80）。 当正常区域的速度等于或大于设定值时，判断为相应的球是正常的（S90）。
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公开(公告)号：KR1020050031328A
公开(公告)日：2005-04-06
申请号：KR1020030067590
申请日：2003-09-29
Applicant: (주) 인텍플러스
IPC: H01L21/66
Abstract: A method and an apparatus for three-dimensional inspection using a stereo vision and a moire are provided to detect a defect of a lead of a package having a bending state and a phase value of 180 degrees and more by overcoming limitation of 2 phi ambiguity. A light projection part(2) includes a condensing lens for condensing light generated from a light source(21) and a projection grating(23) and a projection lens(24) for projecting the condensed light to a measuring target. A first light-receiving part(3) includes an image forming lens(31) and a CCD camera(32) to obtain a grating stripe image. A second light-receiving part(4) includes an image forming lens(41) and a stereo vision camera(42) to obtain an image of the measuring target.
Abstract translation: 提供了使用立体视觉和莫尔条纹进行三维检查的方法和装置，通过克服2个phi模糊度的限制来检测具有弯曲状态和相位值为180度以上的包装的引线的缺陷。 光投射部分（2）包括用于聚集从光源（21）产生的光和投影光栅（23）的聚光透镜和用于将聚光的光投射到测量对象的投影透镜（24）。 第一光接收部分（3）包括图像形成透镜（31）和CCD相机（32），以获得光栅条纹图像。 第二光接收部分（4）包括图像形成透镜（41）和立体视觉相机（42），以获得测量对象的图像。
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公开(公告)号：KR1020160108069A
公开(公告)日：2016-09-19
申请号：KR1020150031936
申请日：2015-03-06
Applicant: (주) 인텍플러스
CPC classification number: G01N21/8806 , G01N2201/102 , G01N2201/12715 , G03B3/10
Abstract: 본발명은슬릿빔과다단으로단차진반사수단을이용하여피검체의높이를파악하고, 검사용카메라의위치를조절하는슬릿빔을이용한오토포커싱장치및 이를이용한오토포커싱방법이개시된다. 본발명은슬릿빔을출력하는광원과, 상기광원에서출력된슬릿빔을피검체의표면으로반사시켜전달하되, 상기슬릿빔의라인을따라다단으로단차지게형성되어, 상기피검체에복수의슬릿빔으로분할하여조사하는제1반사수단과, 상기피검체에서반사된라인이미지를획득하는이미지센서와, 상기이미지센서에서획득한라인이미지의결상위치에따라피검체의높이를판단하는분석부와, 상기분석부에서판단된피검체의높이와대응하여상기검사용카메라와피검체의간격을조절하는거리조절부를포함하는슬릿빔을이용한오토포커싱장치및 이를이용한오토포커싱방법에관한것이다.
Abstract translation: 本发明涉及一种自动对焦装置，其使用多级和阶梯式反射装置的狭缝光束来识别检查目标的高度并调整检查照相机的位置以及使用其的自动聚焦方法。 根据本发明，自动对焦装置包括：输出狭缝光束的光源; 将从光源输出的狭缝光束反射到检查对象的表面的第一反射装置形成为沿着狭缝光束的多个台阶阶梯状，并且向检查对象发射多个分裂狭缝光束; 获取从检查对象反射的线法师的图像传感器; 分析单元，其根据从图像传感器获得的行图像的成像位置确定检查对象的高度; 以及距离调节装置，其调整检查照相机和检查对象之间的间隙，以对应于由分析单元确定的检查对象的高度。
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Patent Agency Ranking
公开(公告)号：KR101628761B1
公开(公告)日：2016-06-09
申请号：KR1020150031934
申请日：2015-03-06
Applicant: (주) 인텍플러스
CPC classification number: G01B9/0209 , G01B9/02022 , G01B11/2441
Abstract: 본발명은넓은파장의광원을출력하는광출력수단과, 상기광출력수단에서출력된넓은파장의광원을입력받아 2개의점광원형태로분배하여출력하는광커플러와, 상기광커플러에서출력된점광원을전달하고, 각단부가상호마주보게배치되는제1,2광섬유와, 상기제1광섬유의단부와마주보게설치되어상기제1광섬유에서출력되면서확산된광원을입력받아평행광으로출력하는제1시준렌즈와, 상기제2광섬유의단부와마주보게설치되어상기제2광섬유에서출력되면서확산된광원을입력받아평행광으로출력하는제2시준렌즈와, 상기제1시준렌즈와제2시준렌즈사이에배치되어상기제1시준렌즈를통과한평행광을수직하부에배치된측정대상의표면으로전달하고, 상기제2시준렌즈를통과한평행광을수직상부로전달하는광경로변경수단과, 상기광경로변경수단의상부에배치되어, 상기측정대상의표면에서반사된측정광과, 상기광경로변경수단에서상부로전달된기준광의간섭에의해생성되는간섭무늬를획득하는촬상수단을포함하는비대칭간섭계를이용한표면형상측정장치에관한것이다.
Abstract translation: 本发明涉及一种使用测量大面积测量对象的表面形状的不对称干涉仪来测量表面形状的装置，并且实现了细小的干涉仪。 更具体地，使用非对称干涉仪测量表面形状的装置包括：输出具有宽波长的光源的光输出单元; 光耦合器，其接收从光输出单元输出的宽波长的光源，以二点光源的形式分布，输出点光源; 第一和第二光纤，其传送从光耦合器输出的点光源，并且被布置成彼此面对; 第一准直透镜安装成面对第一光纤的端部，接收由第一光纤的输出扩散的光源作为平行光输出; 第二准直透镜安装成面对第二光纤的端部，接收由第二光纤的输出扩散的光源作为平行光输出; 设置在第一准直透镜和第二准直透镜之间的光路改变单元将通过第一准直透镜的平行光传送到设置在垂直下方的测量对象的表面，并将通过第二准直透镜 准直透镜到垂直上部; 以及设置在光路改变单元的上部的成像单元，获得从测量对象的表面反射的测量光以及由光路改变单元传送到上部的参考光的干涉产生的干涉图案。
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公开(公告)号：KR101436572B1
公开(公告)日：2014-09-11
申请号：KR1020120078929
申请日：2012-07-19
Applicant: (주) 인텍플러스
IPC: G01B11/24
Abstract: 본 발명은 라인빔을 조사하여 측정대상물의 높이를 측정하는 과정에서 측정대상물의 영역별 반사도에 따라 조사되는 라인빔의 인텐시티를 다르게 출력하는 것을 특징으로 하는 광삼각법을 이용한 3차원형상 측정장치에 관한 것으로, 인쇄회로기판에 다수개의 범프가 돌출되도록 실장된 입체형상의 측정대상물이 로딩되는 테이블과, 상기 측정대상물의 상면에 빔을 출력하도록 상기 측정대상물의 상방에 배치되는 프로젝터와, 상기 프로젝터의 하방에 배치되어 상기 프로젝터에서 조사된 면 형태의 빔을 입력 받아 라인빔으로 집광시켜 출력하는 집광수단과, 상기 측정대상물의 일측 상방에 배치되어, 상기 집광수단에 의하여 라인빔으로 조사되었다가 상기 측정대상물로부터 반사된 라인빔의 이미지를 획득하는 이미지 획득 수단을 포함한다.
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公开(公告)号：KR101436574B1
公开(公告)日：2014-09-01
申请号：KR1020130007611
申请日：2013-01-23
Applicant: (주) 인텍플러스
IPC: G02F1/13 , G02F1/13357 , G01N21/88
Abstract: 본 발명은 LED 모듈에 전원을 인가하여 발광되도록 한 후 LED 모듈에서 출력된 광을 촬영하여 LED 모듈을 구성하는 LED칩과 렌즈의 정렬 및 형광층의 분포상태를 검사하는 LED 백라이트 유닛의 검사장치 및 방법에 관한 것으로, LED 모듈에 전원을 공급하는 전원공급부와, 상기 LED 모듈의 상부에 배치되고, 상기 LED 모듈에서 출력된 영상을 획득하는 이미지 획득수단과, 상기 이미지 획득수단을 이동시키는 이동수단과, 상기 이미지 획득수단과 LED 모듈 사이에 배치되는 디퓨저를 포함한다.
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公开(公告)号：KR1020140094937A
公开(公告)日：2014-07-31
申请号：KR1020130007611
申请日：2013-01-23
Applicant: (주) 인텍플러스
IPC: G02F1/13 , G02F1/13357 , G01N21/88
CPC classification number: G02F1/1309 , G01N21/88 , G02F1/1336
Abstract: The present invention relates to an apparatus and a method for inspecting an LED backlight unit, capable of inspecting the distribution state of a fluorescent layer and the arrangement of a lens and an LED chip constituting an LED module by photographing light outputted from the LED module after power is applied to the LED module to emit light. The present invention includes a power supply unit which supplies power to the LED module, an image obtaining unit which is arranged on the upper side of the LED module and obtains an image outputted from the LED module, a moving unit which moves the image obtaining unit, and a diffuser which is arranged between the image obtaining unit and the LED module.
Abstract translation: 本发明涉及一种用于检查LED背光单元的装置和方法，该装置和方法能够通过在LED模块之后拍摄从LED模块输出的光来检查荧光层的分布状态以及构成LED模块的透镜和LED芯片的布置 电源施加到LED模块发光。 本发明包括向LED模块供电的电源单元，配置在LED模块的上侧并获得从LED模块输出的图像的图像获取单元，使图像获取单元移动的移动单元 以及布置在图像获取单元和LED模块之间的扩散器。
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公开(公告)号：KR101410037B1
公开(公告)日：2014-06-20
申请号：KR1020130007612
申请日：2013-01-23
Applicant: (주) 인텍플러스
Abstract: The present invention relates to a method to inspect an LED array capable of inspecting whether or not the light axis of the LED chips and lenses composing an LED module is aligned by photographing light emitted from an LED array in various positions after applying power to the LED array to emit light. The present invention comprises: a power supply step to apply power to the LED array; a photographing step of photographing the image of the LED array in at least two different positions through an image acquisition unit arranged above the LED array; and a decipherment step of determining whether or not the light axis of the LED chips and the lenses is within an allowable error range by combining the images of the LED arrays acquired in the photographing step.
Abstract translation: 本发明涉及一种能够检查LED阵列的方法，该LED阵列能够通过在对LED施加电力之后通过拍摄来自LED阵列的各种位置的LED来排列LED芯片的光轴和构成LED模块的透镜。 阵列发光。 本发明包括：向LED阵列施加电力的电源步骤; 通过布置在LED阵列上方的图像获取单元在至少两个不同位置拍摄LED阵列的图像的拍摄步骤; 以及解密步骤，通过组合在拍摄步骤中获取的LED阵列的图像来确定LED芯片和透镜的光轴是否在容许误差范围内。
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