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公开(公告)号：KR101043956B1
公开(公告)日：2011-06-24
申请号：KR1020090070326
申请日：2009-07-31
Applicant: 전자부품연구원
IPC: H01R4/58
CPC classification number: H01L24/27 , H01L21/6835 , H01L24/29 , H01L2221/68359 , H01L2224/2929 , H01L2224/29299 , H01L2224/83101 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/14 , H01L2924/15788 , H01R4/04 , H01R13/2414 , H01R43/007 , Y10T428/24612 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2924/00
Abstract: 미세피치를 갖는 두 전극을 반복압착하여 연결할 수 있는 경박단소화된 다목적 비등방성 입자배열체 및 그 제조방법이 제안된다. 제안된 비등방성 입자배열체는 탄성 고분자층 및 탄성 고분자층내에 상부 및 하부가 노출되도록 위치하는 탄성 도전체 또는 탄성 열전도체를 포함한다.
비등방성, 열전도, 전기전도, 커넥터-
Patent Agency Ranking
公开(公告)号：KR1020110033968A
公开(公告)日：2011-04-04
申请号：KR1020090091343
申请日：2009-09-25
Applicant: 전자부품연구원
Abstract: PURPOSE: An LED module and a manufacturing method thereof are provided to improve performance and reliability by preventing degradation by forming a solder resist layer on a ceramic PCB with a ceramic rear printing method. CONSTITUTION: A ceramic PCB(110) includes a bottom part(111) and a partition part(112). An LED package(120) is mounted in an inner space comprised of the bottom part and the partition part. A cover(130) covers the upper side of the ceramic PCB. A heat sink is positioned on the lower side of the ceramic PCB. The heat sink discharges heat from the LED package to the outside.
Abstract translation: 目的：提供一种LED模块及其制造方法，其通过在陶瓷PCB上通过陶瓷后印刷方法形成阻焊层来防止劣化来提高性能和可靠性。 构成：陶瓷PCB（110）包括底部（111）和分隔部分（112）。 LED封装（120）安装在由底部和分隔部分构成的内部空间中。 盖（130）覆盖陶瓷PCB的上侧。 散热器位于陶瓷PCB的下侧。 散热片将LED封装的热量排放到外部。
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公开(公告)号：KR1020110012559A
公开(公告)日：2011-02-09
申请号：KR1020090070325
申请日：2009-07-31
Applicant: 전자부품연구원
IPC: H05K1/02
CPC classification number: H01L23/3737 , B05D3/12 , B05D2202/25 , B05D2451/00 , F28F2013/006 , H01L21/4882 , H01L23/3733 , H01L2924/0002 , Y10T29/4935 , B05D2401/32 , B05D2401/40 , H01L2924/00
Abstract: PURPOSE: A thermally conductive substrate and a manufacturing method thereof are provided to directly form a thermally conductive path by directly connecting a lower heat sink layer to an upper layer through a thermal conductor. CONSTITUTION: A thermally conductive substrate includes a lower heat sink layer(110), a thermal conductive layer(120), and an upper layer. The thermally conductive layer is comprised of a thermal conductor(121) and an insulation adhesive part(122). The thermal conductor is formed on a lower heat sink layer. An insulation adhesive unit is filled between the thermal conductors. The upper layer is formed on the thermally conductive layer and emits heat to the lower heat sink layer. The lower heat sink layer is an aluminum substrate. The upper layer is a roll annealed copper foil.
Abstract translation: 目的：提供一种导热基板及其制造方法，通过热导体直接连接下部散热层与上层直接形成导热路径。 构成：导热基板包括下散热层（110），导热层（120）和上层。 导热层由热导体（121）和绝缘粘合部分（122）组成。 热导体形成在下散热层上。 在热导体之间填充绝缘粘合剂单元。 上层形成在导热层上并向下散热层发热。 下部散热层是铝基板。 上层是辊退火铜箔。
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公开(公告)号：KR1020100138662A
公开(公告)日：2010-12-31
申请号：KR1020090057296
申请日：2009-06-25
Applicant: 전자부품연구원
IPC: G02F1/13357
CPC classification number: G02F1/133606 , G02F1/133603 , G02F2001/133607
Abstract: PURPOSE: An LED backlight unit and an LED illuminating device using the same are provided to increase the amount of light emitted from an LED package using a diffusing body and an optical interface material. CONSTITUTION: An LED package(100) includes a silicon encapsulating material which encapsulates an LED in a light emitting direction. A light guide plate guides light emitted from the LED. A diffusing body(500) is integrated with the lower side of the light guide plate to scatter light emitted from a reflecting body and horizontally diffuse light. An optical interface material(200) is placed on an upper side of the silicon encapsulating material and a lower side of the light guide plate to reduce an emission angle of light emitted from an LED.
Abstract translation: 目的：提供使用其的LED背光单元和LED照明装置，以增加使用漫射体和光学界面材料从LED封装发射的光量。 构成：LED封装（100）包括在发光方向封装LED的硅封装材料。 导光板引导从LED发出的光。 漫射体（500）与导光板的下侧一体化，以散射从反射体发出的光并水平地漫射光。 将光学界面材料（200）放置在硅封装材料的上侧和导光板的下侧，以减少从LED发射的光的发射角。
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公开(公告)号：KR100993252B1
公开(公告)日：2010-11-10
申请号：KR1020080082926
申请日：2008-08-25
Applicant: 전자부품연구원
IPC: H01L33/64
CPC classification number: H01L2224/45139 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: 본 발명은 발광 다이오드 모듈에 관한 것으로, 복수개의 발광 다이오드 패키지들이 히트 싱크 상부에 직접 부착되어 있어 열 경로(Thermal path)를 줄일 수 있으므로, 발광 다이오드에서 발생되는 열을 효율적으로 방출시킬 수 있는 장점이 있다.
그리고, 본 발명은 열 방출 효율이 증가됨에 따라 발광 다이오드의 수명을 향상시킬 수 있는 장점이 있다.
또한, 본 발명은 인쇄회로기판의 하부에 발광 다이오드 패키지들이 실장되는 구조이므로, 기존의 고가의 MCPCB 기판 및 TIM(Thermal Interface Material) 소재를 사용하지 않아도 되기에, 저가의 발광 다이오드 모듈의 제작이 가능한 장점이 있다.
발광, 다이오드, 모듈, 열, 방출, 패키지, 인쇄회로기판-
公开(公告)号：KR1020100024183A
公开(公告)日：2010-03-05
申请号：KR1020080082926
申请日：2008-08-25
Applicant: 전자부품연구원
IPC: H01L33/64
CPC classification number: H01L2224/45139 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: PURPOSE: A light emitting diode module is provided to efficiently emit heat generated from the light emitting diode by mounting a plurality of light emitting diode packages on the upper side of a heat-sink and shortening a thermal path. CONSTITUTION: A plurality of through holes are formed in a printed circuit board(PCB)(130). Lenses(111, 121) are formed on a plurality of light emitting diode packages. The light emitting diode packages are mounted on the lower side of the PCB. The light emitting diode packages are projected over the upper side of the PCB. A heat-sink(160) is mounted on the lower side of the light emitting diode packages. Pads are formed on the lower side of the PCB adjacent to each through hole.
Abstract translation: 目的：提供一种发光二极管模块，用于通过在散热器的上侧安装多个发光二极管封装并缩短热路径来有效地发射由发光二极管产生的热量。 构成：在印刷电路板（PCB）（130）中形成多个通孔。 透镜（111,121）形成在多个发光二极管封装上。 发光二极管封装安装在PCB的下侧。 发光二极管封装突出在PCB的上侧。 散热器（160）安装在发光二极管封装的下侧。 在邻近每个通孔的PCB的下侧形成有垫。
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