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公开(公告)号：KR1020120118693A
公开(公告)日：2012-10-29
申请号：KR1020110036223
申请日：2011-04-19
Applicant: 한국광기술원
IPC: F21S2/00 , F21V5/04 , F21V7/04 , G02F1/13357
CPC classification number: F21K9/20 , F21V7/0083 , F21Y2103/10 , F21Y2115/10 , H01L25/0753 , H01L33/58 , H01L33/60
Abstract: PURPOSE: A light emitting diode package and a liquid crystal display device using the same are provided to increase light efficiency by improving the light emitting property to a side direction. CONSTITUTION: A frame has a first cavity(131), a second cavity(132), and a third cavity(133). Reflectors(131a,131b) of the first cavity reflect a light emitted from a first LED chip to a first direction. Reflectors(132a,132b) of the second cavity reflect a light emitted from a second LED chip. Reflectors(133a,133b) of the third cavity reflect a light emitted from the third LED chip. A sealing member(140) is sealed to the first to third cavities.
Abstract translation: 目的：提供发光二极管封装和使用其的液晶显示装置，以通过改善侧向发光特性来提高光效。 构成：框架具有第一腔（131），第二腔（132）和第三空腔（133）。 第一腔的反射器（131a，131b）将从第一LED芯片发射的光反射到第一方向。 第二腔的反射器（132a，132b）反射从第二LED芯片发射的光。 第三空腔的反射器（133a，133b）反射从第三LED芯片发出的光。 密封构件（140）被密封到第一至第三腔。
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公开(公告)号：KR101195062B1
公开(公告)日：2012-10-29
申请号：KR1020100131145
申请日：2010-12-21
Applicant: 한국광기술원
IPC: H01L33/48
Abstract: 본 발명은 세라믹 기판을 이용한 발광 다이오드 패키지에서 열 방출용 금속 코어부와 세라믹 기판부 사이에 열충격 방지용 버퍼를 형성하여 금속 코어부의 열팽창에 의한 충격을 완충시켜 세라믹 기판부의 파손을 방지한 발광 다이오드 패키지를 제공하는 것을 목적으로 한다. 본 발명은 상부 세라믹 기판부의 하부로 상부 전극과 하부 세라믹 기판부와 하부 전극이 설치되고, 상기 하부 세라믹 기판부의 중앙에는 열방출용 금속 코어부가 형성되며, 상기 금속 코어부의 상면에는 빛을 발광하는 발광 다이오드 칩이 실장된 발광 다이오드 패키지에 있어서, 상기 하부 세라믹 기판부와 금속 코어부 사이에 형성되어 상기 금속 코어부와 상기 하부 세라믹 기판부 사이에 열전달 특성을 개선하고 상기 금속 코어부의 열팽창으로 인한 충격이 상기 하부 세라믹 기판부에 전달되는 것을 방지하도록 완충 공간을 형성하는 버퍼부를 포함하는 것을 특징으로 한다.
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公开(公告)号：KR1020120116032A
公开(公告)日：2012-10-22
申请号：KR1020110033531
申请日：2011-04-12
Applicant: 한국광기술원
Abstract: PURPOSE: An apparatus and method for coating a fluorescent substance are provided to immediately separate a mask by simultaneously hardening and coating the fluorescent substance. CONSTITUTION: A fluorescent substance is coated on a surface of a wafer(200). Microwaves are outputted on the surface of the wafer. A fluorescent substance coating layer is formed on the surface of the wafer. A chamber(101) receives the wafer. A microwave generation part irradiates the inside of the chamber with the microwaves.
Abstract translation: 目的：提供用于涂布荧光物质的装置和方法，以通过同时硬化和涂覆荧光物质来立即分离掩模。 构成：将荧光物质涂覆在晶片（200）的表面上。 在晶片的表面上输出微波。 在晶片的表面上形成荧光物质涂层。 腔室（101）接收晶片。 微波产生部件利用微波照射室内。
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公开(公告)号：KR101164368B1
公开(公告)日：2012-07-09
申请号：KR1020090091660
申请日：2009-09-28
Applicant: 한국광기술원
IPC: H01L33/50
Abstract: 발광다이오드 패키지 및 이의 제조방법을 제공한다. 상기 발광다이오드 패키지는 패키지 기판, 상기 패키지 기판 상에 배치되되, 발광다이오드 칩 및 상기 발광다이오드 칩 상에 배치된 파장변환물질층을 구비하고, 서로 다른 파장광을 방출하는 다수개의 단일파장 LED 패키지들을 구비하는 LED 패키지 그룹, 및 상기 LED 패키지 그룹 상에 배치되되, 상기 발광다이오드 칩으로부터 방출되는 광원을 공통스펙트럼 유사광으로 변환시키는 공통스펙트럼 변환물질 혼합층을 포함하되, 상기 LED 패키지 그룹은 상기 공통스펙트럼 유사광에 대해 초과되는 파장대의 광을 방출하는 단일파장 LED 패키지들을 구비한다.
발광다이오드 패키지, 일중태양광 유사광원, 풀스펙트럼-
公开(公告)号：KR1020120069831A
公开(公告)日：2012-06-29
申请号：KR1020100131145
申请日：2010-12-21
Applicant: 한국광기술원
IPC: H01L33/48
CPC classification number: H01L33/641 , H01L33/12 , H01L33/483
Abstract: PURPOSE: A light emitting diode package is provided to prevent damage to a ceramic substrate by reducing impacts due to thermal expansion of a metal core unit through a buffer for preventing thermal impacts. CONSTITUTION: A top electrode(300), a bottom ceramic substrate unit(100), and a bottom electrode(310) are installed on the lower side of a top ceramic substrate(200). A metal core unit(500) is formed in the center of the bottom ceramic substrate unit. A light emitting diode chip(400) is mounted on the upper side of the metal core unit. A buffer unit(800) is formed between the bottom ceramic substrate unit and the metal core unit. The buffer unit improves a heat transfer property between the metal core unit and the bottom ceramic substrate unit.
Abstract translation: 目的：提供一种发光二极管封装，以通过减少由于金属芯单元通过缓冲器的热膨胀而引起的冲击，从而防止对陶瓷基板的损坏，以防止热冲击。 构成：顶部电极（300），底部陶瓷基板单元（100）和底部电极（310）安装在顶部陶瓷基板（200）的下侧。 金属芯单元（500）形成在底部陶瓷基板单元的中心。 发光二极管芯片（400）安装在金属芯单元的上侧。 在底部陶瓷基板单元和金属芯单元之间形成缓冲单元（800）。 缓冲单元提高金属芯单元和底部陶瓷基板单元之间的传热性能。
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Patent Agency Ranking
公开(公告)号：KR1020120069794A
公开(公告)日：2012-06-29
申请号：KR1020100131092
申请日：2010-12-21
Applicant: 한국광기술원
CPC classification number: A61B1/247 , A61B1/05 , A61B1/0684 , A61C1/0015 , A61C1/088 , G06F19/32
Abstract: PURPOSE: A tooth monitoring apparatus is provided to enable a user to confirm the information filmed by a camera. CONSTITUTION: A tooth monitoring apparatus comprises a tooth inspecting unit(100) and a monitoring unit(300). The tooth inspecting unit outputs light source according to the optimal brightness and outputs an image which is filmed by a camera according to the fixed data format. The monitoring unit displays the image of a tooth outputted from the tooth inspecting unit. The tooth inspecting unit comprises a main body member, a switch input unit, a camera, a plurality of LED lighting units, a controller, a data transceiver, and an action display unit. The switch input unit detects an action control type input signal. The camera films a tooth inside the oral cavity. The LED lighting unit provides light source to the inside of the oral cavity.
Abstract translation: 目的：提供一种牙齿监测装置，使用户能够确认照相机拍摄的信息。 构成：牙齿监测装置包括牙齿检查单元（100）和监视单元（300）。 牙齿检查单元根据最佳亮度输出光源，并根据固定数据格式输出由相机拍摄的图像。 监视单元显示从牙齿检查单元输出的齿的图像。 牙齿检查单元包括主体构件，开关输入单元，照相机，多个LED照明单元，控制器，数据收发器和动作显示单元。 开关输入单元检测动作控制型输入信号。 相机拍摄口腔内的牙齿。 LED照明单元向口腔内部提供光源。
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公开(公告)号：KR101135580B1
公开(公告)日：2012-04-17
申请号：KR1020090105509
申请日：2009-11-03
Applicant: 한국광기술원
Abstract: PURPOSE: A light emitting diode lamp module is provided to improve thermal emission property and thermal saturated capacity by including a heat sink and using only single radiation wire substrate. CONSTITUTION: In a light emitting diode lamp module, a light-emitting diode package(200) comprises at least one light emitting diode A cross section heat dissipation wiring substrate mounts a light-emitting diode package in one side. The cross section heat dissipation wiring board comprises a plurality of holes The cross section heat dissipation wiring board emits the heat of the light-emitting diode package. A cooling fin(230) comprises a plurality of protrusions(232) which are fitted into the hole. The heat sink is formed on the other side of the cross section heat dissipation wiring board.
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78.发明授权
公开(公告)号：KR101092027B1
公开(公告)日：2011-12-12
申请号：KR1020090131422
申请日：2009-12-28
Applicant: 한국광기술원
IPC: H01L21/203 , H01L33/02
Abstract: 박막형성장치, 이를이용한박막형성방법및 상기박막형성장치를이용한발광다이오드제조방법을제공한다. 상기박막형성장치는피처리물이거치되는거치대, 상기거치대와이격하여배치되는코팅유닛, 상기거치대와이격하여배치되는프루브유닛, 상기유닛들과전기적으로연결된전원공급부, 및상기전원공급부와전기적으로연결된제어부를포함한다.
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公开(公告)号：KR1020110043812A
公开(公告)日：2011-04-28
申请号：KR1020090100498
申请日：2009-10-22
Applicant: 한국광기술원
CPC classification number: F21V13/02 , F21V14/04 , F21V29/717
Abstract: PURPOSE: A lighting device is provided to improve the reliability of illumination efficiency by relatively moving an optical module and a reflector reflecting the light from the optical module. CONSTITUTION: A lighting device(10) comprises an optical source module(100), a reflector(300), and a heat dissipation unit(500). The optical module is accommodated into a reflector and radiates the light. The reflector is comprised of a reflector body(320) and a mobile supporter(340). The reflector body a trapezoidal shape which increase a cross section according to a lighting direction. A radiation unit is contacted with the optical module and discharge heat from a light source.
Abstract translation: 目的：提供照明装置，通过相对移动光学模块和反射来自光学模块的光的反射器来提高照明效率的可靠性。 构成：照明装置（10）包括光源模块（100），反射器（300）和散热单元（500）。 光学模块被容纳在反射器中并照射光。 反射器包括反射体（320）和移动支架（340）。 反射体是根据照明方向增加横截面的梯形形状。 辐射单元与光学模块接触并从光源排出热量。
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公开(公告)号：KR1020110013636A
公开(公告)日：2011-02-10
申请号：KR1020090071181
申请日：2009-08-03
Applicant: 한국광기술원
IPC: H01L33/50
CPC classification number: H01L24/73 , H01L2224/14 , H01L2224/16225 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265 , H01L2924/00014
Abstract: PURPOSE: A light emitting diode including wavelength conversion posts and a manufacturing method thereof are provided to reduce manufacturing time of the light emitting diode through wavelength conversion materials by forming the wavelength conversion materials on the upper, lower and lateral sides of a light emitting structure in a fab process. CONSTITUTION: A light emitting structure(S) is arranged on the upper side of a first semiconductor layer(12) of a substrate(10). The light emitting structure includes a second semiconductor layer(16) which exposes the part of the upper side of the first semiconductor layer. A first electrode(22) and a second electrode(24) are arranged on the upper side of the first and second semiconductor layers. A light transmitting protection layer(26) is arranged on the substrate except the first and second electrodes. A wavelength conversion post(32) is arranged on the light transmitting protection layer and a plurality of penetration holes which pass through the edges of the substrate.
Abstract translation: 目的：提供包括波长转换柱的发光二极管及其制造方法，以通过在发光结构的上，下和外侧上形成波长转换材料来减少发光二极管通过波长转换材料的制造时间， 制造工艺。 构成：发光结构（S）布置在基板（10）的第一半导体层（12）的上侧。 发光结构包括暴露第一半导体层的上侧的一部分的第二半导体层（16）。 第一电极（22）和第二电极（24）布置在第一和第二半导体层的上侧。 在第一电极和第二电极之外的基板上布置有透光保护层（26）。 波长转换柱（32）布置在透光保护层和穿过基板边缘的多个穿透孔中。
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