Abstract:
The present invention relates to a vehicle body integrated with an airbag sensor module which detects the deformation ratio of the vehicle body to detect vehicle collision. The vehicle body according to an embodiment of the present invention includes: a vehicle body; a main substrate which is attached to the vehicle body; and a strain sensor which is formed on the main substrate to be deformed according to the deformation of the vehicle body due to the vehicle collision to measure the deformation ratio. Accordingly, disclosed is the vehicle body integrated with an airbag sensor module including a collision detection sensor unit sensing whether the vehicle body crashed onto another object.
Abstract:
PURPOSE: A wafer via solder filling device and method are provided to fill via of a wafer with a molten solder through pressure of a pressing unit within a gap and to prevent the deformation of the wafer by including a porous plate. CONSTITUTION: A solder bath(10) comprises sidewalls(12) and a floor(14). An accommodation space(S) is formed inside the solder bath. The accommodation space is filled with a molten solder(m). A fixing unit(20) provides suction force to the upper side of a wafer(40) and fixes the wafer to a fixing unit(22). A pressing unit(30) has an area corresponding to the accommodation space. The pressing unit comprises a pressing board(32) and a pressing cylinder(34). The pressing board transfers the molten solder. The pressing cylinder moves up and down the pressing board.
Abstract:
PURPOSE: An overlap laser welding method for improved welding bead quality of a reverse side is provided to prevent spiking phenomenon in a complete penetration. CONSTITUTION: An overlap laser welding method for improved welding bead quality of a reverse side comprises the next step. A welded surface of a base metal faces to a welded surface of a second material to be overlapped. The laser, which alternately projects peak output and base output, is emitted to a welding part for welding process. In a welding process, the output of the laser has spherical wave shape of peak output and base output. In a welding process, the laser is emitted so that the base output has a positive value.
Abstract:
PURPOSE: A copper member, for enclosure formation having hybrid junction structure, and a bonding method are provided to secure proper durability by forming a sealed space under vacuum condition. CONSTITUTION: A copper member, for enclosure formation having hybrid junction structure, comprises a body portion and a fixing unit. The body portion comprises a top coupling plane(10) and a lower part coupling plane(20). The top coupling plane is made of copper material. The lower part coupling plane is made of copper material and combined in the top coupling plane. The fixing unit fixes the top coupling plane and lower part coupling plane.
Abstract:
PURPOSE: A method and a device for welding aluminum alloy using laser weaving are provided to reduce cracks on aluminum alloy by using a weaving welding method through a laser. CONSTITUTION: A method for welding aluminum alloy using laser weaving is as follows. A temporary welding line for weaving welding is inputted to a controller. The weaving frequency and weaving width of a laser beam are inputted to the controller in order to perform laser welding along the temporary welding line. The moving displacement of a robot is inputted to the controller. The laser beam is irradiated to mirrors(21) inside a scanner(20). The laser beam, reflected from the mirrors, is weave-welded in aluminum alloy by rapidly rotating one mirror.
Abstract:
A ternary lead free micro-bump and a formation method thereof by binary electroplating including nano particles are provided to extend the life span of bump by minimizing the thickness of inter metallic compound. A ternary lead free micro-bump and a formation method thereof by binary electroplating including nano particles comprises a step of forming a copper layer(10) on a substrate, a step of forming a photoresist film(20) on the copper layer and etching in order to expose a part of the copper layer, a step of forming a Sn-Cu alloy plating layer including nano particles or a Sn-Bi alloy plating layer including nano particles on the exposed copper layer, a step of laminating a Sn-Ag alloy plating layer on the Sn-Cu alloy plating layer or the Sn-Bi alloy plating layer, a step of removing the photoresist film, and a step of forming a Sn-Ag-Cu or Sn-Ag-Bi alloy bump including nano particles by reflowing the laminated alloy plating layers.
Abstract:
A weld-fume removing device for treating concurrently a particulate and gaseous phases is provided to remove both particulate and gaseous weld-fumes, to maximize electric efficiency by utilizing an air-cooled type of heat exchanger in a gas phase removing device, and to prevent the temperature in a workplace from being increased with the welding heat by installing a discharged-air cooling unit, that is, a cooler to cool air in workplace. A weld-fume removing device for treating concurrently a particulate and gaseous phases comprises: a duct(2) connected with a weld-fume suction hood; a fume particle removing unit(3) for eliminating the particulate phase of weld-fumes; a dust removing unit(4) for intermittently eliminating the collected fume particles; an absorbing unit(5) for collecting the gaseous fume; a ring blower(6) sucking the weld-fumes and discharging purified air; a catalytic unit(9) for completely resolving the gaseous fume; a heat exchanger(7) preheating the gaseous fume inflowing to the catalytic unit and cooling the purified air discharged from the catalytic unit; a heater(8) increasing temperature of the gaseous fume passing through the heat exchanger and inflowing to the catalytic unit; and a cooler(10) falling temperature of the purified air discharge from the heat exchanger.
Abstract:
PURPOSE: A method for surface modification of an implant formed of titanium or titanium alloys is provided to increase the contact area with osseous tissue and to form a dense oxidized layer(TiO2) having porosity similar to that of the osseous tissue. CONSTITUTION: The method comprises the steps of: rotating an implant; spraying sand microparticles to the surface of the implant by using a blasting gun; dipping the blasted implant into an electrolyte to perform anodic oxidation treatment, while increasing an applied voltage, so that a coating layer is formed to provide the surface of the implant with network-shaped porosity; and evaluating wettability of the implant by measuring the contact angle between the surface of the implant and water, evaluating cytotoxicity of the implant and judging bioavailability of the implant.