72.
    发明专利
    未知

    公开(公告)号:DE3683603D1

    公开(公告)日:1992-03-05

    申请号:DE3683603

    申请日:1986-11-24

    Applicant: BASF AG

    Abstract: One component system (I), substantially free from protective colloid, based on prim. dispersion of a synthetic polymer (II) and a water-insoluble phenol-aldehyde polycondensate (III) (wherein the aldehyde may be partly replaced by a ketone), and obtd. by mixing the phenolic component of (III) with the dispersion of (II) then polycondensing it with the aldehyde (and ketone if employed) in the mixt., is used to prepare adhesives for heat-resistant bonds. Phenolic component of (III) has solubility less than 10g per 100g water at 20 deg.C and pH below 5, and partic. is bisphenol A, opt. with phenol, alkyl-substd. phenol, and/or hydroxybiphenyl. (II) contains glycidyl, carbonyl, N-methylol, N-alkoxymethyl, ether, amino, and/or hydrazo gps. and opt. also COOH or OH gps. Aldehyde for prepn. of (III) is HCHO, paraformaldehyde, and/or acetaldehyde. Ratio of (II):(III) is 98:2 to 2:1.

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