Abstract:
PROBLEM TO BE SOLVED: To obtain the subject copolymer having alicyclic groups and acid- cleavable polar organic groups, having high radiation penetrability, excellent dry etching resistance, excellent adhesivity, etc., and useful for optical materials, electronic materials, etc. SOLUTION: This polar norbornene derivative/maleic anhydride copolymer comprises repeating units of formula I (X and Y are each H or a 4-20C acid- cleavable organic group; A and B are each H or a 1-4C alkyl) preferably in an amount of 60-40 mol.% and repeating units of formula II preferably in an amount of 40-60 mol.%, and has a polystyrene-converted weight-average mol.wt. of 1,000-1,000,000. The copolymer is obtained by radically copolymerizing at least one kind of norbornene derivative of formula III [for example, 8-t- butoxycarbonyltetracyclo(4.4.0.1 , .1 , )dodeca-3-ene] with maleic anhydride and, if necessary, one or more other copolymerizable unsaturated compound [for example, bicyclo(2.2.1)hept-2-enel.
Abstract:
PROBLEM TO BE SOLVED: To obtain a radiation sensitive resin compsn. having high transparency to radiation and satisfactory dry etching resistance as a chemical amplification type resist. SOLUTION: The radiation sensitive resin compsn. contains a polymer contg. repeating units derived from a norbornene deriv. typified by 8-t- butoxycarbonyltetracyclo[4,4,0,1 ,1 ]norbornene, a radiation sensitive acid generating agent and an androstane-17-carboxylic-ester compd. typified by t- butoxycarbonylmethyl deoxycholate. In the formula, A and B are each H or an acid dissociable
Abstract:
PROBLEM TO BE SOLVED: To provide the positive or negative radiation sensitive resin composition especially high in sensitivity and superior in resolution and pattern profiles and the like. SOLUTION: The positive photoresist resin composition contains (A) a compound represented by the formula [in which each of R and R is an alkyl group; R is a hydroxy or -OR group; R is a univalent organic group; (a) is an integer of 4-7; and (b) is an integer of 1-7] and (B1) a resin having an acid-dissociable group, or (A) and (B2) an alkali-soluble resin and an alkali- solubility controller. The negative photoresist resin composition contains (A) and (C) an alkali-soluble resin and (D) a cross-linking agent.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a cured film capable of forming a cured film having excellent surface curability and deep curability even in the case of using an ultraviolet curing apparatus of an ultraviolet LED curing system while suppressing sublimation of a photopolymerization initiator.SOLUTION: A method for forming a cured film comprises (1) a step of coating a radiation-sensitive resin composition on a substrate to form a coated film, (2) a step of exposing the coated film through a photomask, (3) a step of developing the exposed coated film and (4) a step of heating the developed coated film. The radiation sensitive resin composition contains [A] an alkali-soluble resin, [B] a polymerizable compound having an ethylenically unsaturated bond, [C] a photopolymerization initiator and [D] an acid generator, and in the above step (2), the coated film is exposed using an ultraviolet LED as a light source.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which has high radiation sensitivity and enables a patterned thin film excellent in adhesion to be easily formed. SOLUTION: The radiation-sensitive resin composition includes: [A] a copolymer of (a1) at least one selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic acid anhydrides and (a2) a copolymer of an unsaturated compound comprising at least one selected from the group consisting of unsaturated compounds having an oxetanyl group and unsaturated compounds having the oxetanyl group; and [B] a 1,2-quinonediazide compound having a specific structure. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition forming a protective film having excellent adhesiveness to a substrate or an underlying or an upper layer, suppressing formation of sublimates during baking of a step of forming the film, satisfying high heat resistance and high surface hardness and having excellent load resistance while heating and performances flattening the difference in level of a color filter formed on the underlying substrate. SOLUTION: A radiation-sensitive resin composition comprises (A) a polymer polymerized in the presence of a specific thiocarbonylthio compound by living radical polymerization and having ≤1.7 ratio (Mw/Mn) of the weight-average molecular weight (Mw) to the number-average molecular weight (Mn) and expressed in terms of polystyrene measured by a gel permeation chromatography and (B) a cationically polymerizable compound. (A) The polymer has carboxy groups or oxiranyl groups or oxetanyl groups. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition, having high radiation sensitivity and a development margin that can form proper pattern profile, even after the lapse of the optimum developing time in a developing step, capable of easily forming a patterned thin film that is superior in adhesion, capable of reducing a sublimate generated in baking, and of being suitable for forming an interlayer insulation film and microlenses. SOLUTION: The radiation-sensitive resin composition contains (A) a polymer having carboxyl and epoxy groups, wherein the ratio (Mw/Mn) of the weight average molecular weight (Mw) of the polymer (expressed in terms of polystyrene) to the number average molecular weight (Mn) (expressed in terms of polystyrene) measured by gel permeation chromatography is ≤1.7, and (B) a 1,2- quinonediazido compound. A living radical polymerization for producing the polymer (A) is a polymerization that uses a specific thiocarbonyl thio compound as a molecular weight control agent. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high sensitivity and high resolution, capable of easily forming a patterned thin film that is superior in various performances such as pattern profile, compressive strength, rubbing resistance and adhesion to a transparent substrate, and capable of suppressing generation of a sublimate in baking, spacers formed from the composition, and to provide a method for forming the spacers. SOLUTION: The radiation-sensitive resin composition contains (A) a polymer having carboxyl and epoxy groups, wherein the ratio (Mw/Mn) of the weight average molecular weight (Mw) of the polymer (expressed in terms of polystyrene) to the number average molecular weight (Mn) (expressed in terms of polystyrene) measured by gel permeation chromatography is ≤1.7, (B) a polymerizable unsaturated compound and (C) a radiation-sensitive polymerization initiator. A living radical polymerization for producing the polymer (A) is a polymerization that uses a specific thiocarbonyl thio(disulfide) compound as a molecular weight control agent. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition which can form an over coat having desired transparency, heat resistance, surface hardness, and adhesiveness, excellent in load withstanding property, even when heated, little in sublimate at the time of firing, and also excellent in the performance capability to eliminate the level difference of a color filter formed on an underlying substrate, and to provide an over coat formed by using the composition and a method for forming the over coat. SOLUTION: The curable resin composition contains (A) a polymer containing at least two epoxy groups in a molecule thereof and obtained by the living radical polymerization, (B) a cationic polymerizable compound except a polymerizable unsaturated compound constituting the component A, wherein, the living radical polymerization for producing the polymer A is carryied out by using a specified thiocarbonylthio compound as a molecular weight controlling agent. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a composition to be used suitably for forming a protective film for an optical device, from which a highly-planarity hardened film, which has high surface hardness and various superior resistances such as heat resistance, pressure resistance, acid resistance, alkali resistance and sputtering resistance, can be formed even on a substrate having an uneven surface, and to provide the protective film. SOLUTION: This composition for forming the protective film of a color filter contains polyorganosiloxane, carboxylic anhydride and an agent from which an acid is generated by heating or photoirradiation. The polyorganosiloxane has ≤1,600 g/mol epoxy equivalent. COPYRIGHT: (C)2006,JPO&NCIPI