公开(公告)号：AU2003257647A1

公开(公告)日：2004-03-11

申请号：AU2003257647

申请日：2003-08-21

Applicant: JSR CORP

Inventor： OHTA MASARU ,  INOMATA KATSUMI ,  IWANAGA SHINICHIRO

IPC: G03F7/11 ,  G03F7/40 ,  G03F7/42 ,  H01L21/60 ,  H01L23/12 ,  H05K3/28 ,  H05K3/34

Abstract: A process for forming bumps on electrode pads performs at least the following steps (a) to (d) for a wiring board including a substrate and a plurality of electrode pads: (a) a step of forming a laminated two-layer film on the wiring board and forming a pattern of apertures at positions corresponding to the electrode pads, the laminated two-layer film including a lower layer containing an alkali-soluble radiation-nonsensitive resin composition and an upper layer containing a negative radiation-sensitive resin composition; (b) a step of filling a low-melting metal in the aperture pattern; (c) a step of reflowing the low-melting metal by pressing or heating to form bumps; and (d) a step of peeling and removing the laminated two-layer film from the board. The laminated film including two layers with different properties permits high resolution and easy peeling.

公开(公告)号：DE69703902T2

公开(公告)日：2001-06-13

申请号：DE69703902

申请日：1997-02-28

Applicant: JSR CORP

Inventor： IWANAGA SHINICHIRO ,  SAKURAI AKIHIKO ,  TANABE TAKAYOSHI ,  TSUJI AKIRA

IPC: G03F7/004

Abstract: A radiation sensitive composition comprising (A) a copolymer comprising recurring units of a p-hydroxystyrene unit and a styrene unit having an acetal group or a ketal group at the p-position, (B) a copolymer comprising recurring units of a t-butyl (meth)acrylate unit and a p-hydroxystyrene unit, and (C) a radiation sensitive acid-generating agent.

公开(公告)号：EP1542520A4

公开(公告)日：2008-12-03

申请号：EP03792769

申请日：2003-08-21

Applicant: JSR CORP

Inventor： OHTA MASARU ,  INOMATA KATSUMI ,  IWANAGA SHINICHIRO

IPC: G03F7/11 ,  G03F7/40 ,  G03F7/42 ,  H01L21/60 ,  H01L23/12 ,  H05K3/28 ,  H05K3/34

CPC classification number: H01L24/12 ,  H01L24/02 ,  H01L24/03 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/10126 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/19042 ,  H05K3/28 ,  H05K3/3473 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0577 ,  H05K2203/0793

Abstract: A method for forming a bump on an electrode pad characterized in that at least the following steps (a)-(d) are conducted on a wiring substrate which is composed of a base and a plurality of electrode pads: (a) a step wherein a double-layered film composed of a lower layer made of an alkali-soluble, radiation-nonsensitive resin composition and an upper layer made of a negative, radiation-sensitive resin composition is formed on the wiring substrate, and then an aperture pattern is formed in a corresponding position of the electrode pad; (b) a step wherein a low-melting metal is introduced into the aperture pattern; (c) a step wherein the low-melting metal is reflowed by conducting a press or a heat treatment so as to from a bump, and (d) a step wherein the double-layered film is removed from the substrate. By using the double-layered film having different characteristics, the high-resolution property and the easy-release property become compatible.

公开(公告)号：EP1469353A4

公开(公告)日：2007-09-19

申请号：EP02781788

申请日：2002-11-15

Applicant: JSR CORP

Inventor： OHTA MASARU ,  ITO ATSUSHI ,  MOCHIZUKI ISAMU ,  INOMATA KATSUMI ,  IWANAGA SHINICHIRO

IPC: G03F7/023 ,  G03F7/095 ,  G03F7/40 ,  G03F7/26 ,  G03F7/022 ,  G11B5/60

CPC classification number: G03F7/0236 ,  G03F7/0233 ,  G03F7/095 ,  G03F7/40

Abstract: A method of forming a film by vapor deposition and/or sputtering by the lift-off technique and a two-layer resist film with which a burr-free film layer can be easily formed on a substrate surface. The method of forming a pattern uses this two-layer resist film. The method of pattern formation is characterized by including the step of forming, on a substrate 1, a two-layer film which comprises: a resist film 2 formed from a positive radiation-sensitive resin composition comprising A a radical polymer having a hydroxy and/or carboxy group, B a compound having a quinonediazide group, and C a solvent and a resist film 3 formed from a positive radiation-sensitive resin composition comprising D a polymer having a phenolic hydroxy group, E a compound having a quinonediazide group, and F a solvent.

公开(公告)号：JP2007057595A

公开(公告)日：2007-03-08

申请号：JP2005240038

申请日：2005-08-22

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： INOMATA KATSUMI ,  ITO JUNJI ,  YOKOYAMA KENICHI ,  GOTO HIROFUMI ,  IWANAGA SHINICHIRO

IPC: G03F7/023 ,  G03F7/004 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a cured product excellent in properties such as resolution, thermal shock resistance, curing shrinkage ratio and water absorption, and a positive photosensitive insulating resin composition capable of giving the cured product. SOLUTION: The positive photosensitive insulating resin composition contains an alkali-soluble resin (A) having a constitutional unit represented by formula (1), a compound (B) having a quinonediazido group, a compound (C) having a functional group capable of reacting with the alkali-soluble resin (A), and a solvent (D), wherein R represents a 1-4C alkyl group, a 1-4C alkoxy group, a halogen atom or a hydroxyl group; and m is 0-3. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供能够提供固化产物的分辨率，耐热冲击性，固化收缩率和吸水性等优异的固化产物和正性感光性绝缘树脂组合物。 正型感光性绝缘性树脂组合物含有具有由式（1）表示的结构单元的碱可溶性树脂（A），具有醌二叠氮基的化合物（B），具有官能团的化合物（C） 能够与碱溶性树脂（A）反应的溶剂（D），其中R表示1-4C烷基，1-4C烷氧基，卤素原子或羟基的溶剂（D） m为0-3。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2006330366A

公开(公告)日：2006-12-07

申请号：JP2005153985

申请日：2005-05-26

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： NISHIKAWA KOJI ,  MORI KOSUKE ,  OTA KATSU ,  IWANAGA SHINICHIRO

IPC: G03F7/039 ,  G03F7/004 ,  G03F7/033 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a positive radiation sensitive resin composition excellent in adhesion to a substrate as well as in sensitivity and resolution, leaving no residue in an opening after development, and capable of suppressing cracking after plating, a transfer film using the composition, and a production method by which a thick plated formed product such as a bump or wiring can be formed with high dimensional accuracy. SOLUTION: The positive radiation sensitive resin composition contains (A) a polymer having an acid-dissociable functional group which is dissociated by an acid to generate an acidic functional group, (B) a vinyl alkyl ether resin represented by formula (1), (C) a component which generates an acid upon irradiation with radiation and (D) an organic solvent. In the formula (1), R 1 and R 2 are each hydroxyl or carboxyl; R 3 is a 1-4C alkyl; and n is an integer of 1-100. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了提供对基材的粘附性以及灵敏度和分辨率优异的正辐射敏感性树脂组合物，在显影后在开口中不留下残留物，并且能够抑制电镀后的裂纹，转印膜 使用该组合物，并且可以以高尺寸精度形成诸如凸块或布线的厚镀层成形产品的制造方法。 阳离子敏感性树脂组合物含有（A）具有酸解离性官能团的聚合物，其由酸解离以产生酸性官能团，（B）由式（1）表示的乙烯基烷基醚树脂 ），（C）在辐射照射时产生酸的成分和（D）有机溶剂。 在式（1）中，R SP 1和R SP 2各自为羟基或羧基; R 3是一个1-4C烷基; n为1-100的整数。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2006176796A

公开(公告)日：2006-07-06

申请号：JP2006073197

申请日：2006-03-16

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： KAJIWARA ICHIRO ,  YAMASHITA TAKANORI ,  IWANAGA SHINICHIRO ,  NIIGAE SHIGERU ,  NOJIMA TAKANORI ,  MORITA TAKASHI

IPC: C08L51/00 ,  C08F279/02 ,  D21H19/58

Abstract: PROBLEM TO BE SOLVED: To provide a coating copolymer latex having excellent coating operability and excellent printing suitability such as surface strength, print gloss and rigidity, and to provide a paper coating composition.
SOLUTION: This paper coating composition which comprises a latex of a copolymer consisting of (a) 20 to 80% by weight of an aliphatic conjugated diene monomer unit, (b) 0.5 to 10% by weight of an ethylenically unsaturated carboxylic acid monomer unit and (c) 20 to 79.5% by weight of a unit of another monomer copolymerizable with the above components (a) and (b), and having two glass transition points in the range of from -100 to 50°C, the difference between the two transition points being at least 5°C.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供具有优异的涂布操作性和优异的印刷适应性（如表面强度，印刷光泽和刚性）的涂料共聚物胶乳，并提供纸张涂料组合物。 解决方案：该纸涂料组合物包含由（a）20至80重量％的脂族共轭二烯单体单元组成的共聚物胶乳，（b）0.5至10重量％的烯键式不饱和羧酸 单体单元和（c）20〜79.5重量％的可与上述组分（a）和（b）共聚的另一单体的单元，并且具有-100至50℃的两个玻璃化转变点， 两个转换点之间的差别至少为5°C。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2006154780A

公开(公告)日：2006-06-15

申请号：JP2005311850

申请日：2005-10-26

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： ITO JUNJI ,  YOKOYAMA KENICHI ,  INOMATA KATSUMI ,  IWANAGA SHINICHIRO

IPC: G03F7/023 ,  G03F7/004 ,  G03F7/075 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a positive photosensitive insulating resin composition from which a cured product with excellent characteristics such as resolution, electric insulating property, thermal shock resistance and adhesiveness can be formed, and to provide its cured product.
SOLUTION: The positive photosensitive insulating resin composition contains: (A) a copolymer composed of (A1) 10 to 99 mol% of a structural unit expressed by general formula (1) and (A2) 90 to 1 mol% of a structural unit expressed by general formula (2); (B) a compound having a quinonediazide group; (C) (C1) an alky etherified amino group-containing compound and/or (C2) an epoxy group-containing compound; (D) a solvent; and (E) an adhesion improver. A cured product of the composition is also provided. In formulae, each of Ra and Rc represents a 1-4C alkyl group, alkoxy group or aryl group; each of Rb and Rd represents a hydrogen atom or a methyl group; n represents an integer of 0 to 3; and m represents an integer of 1 to 3.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种正型感光绝缘树脂组合物，可以形成具有分辨率，电绝缘性，耐热冲击性和粘合性等优异特性的固化产物，并提供其固化产物。 正型感光性绝缘性树脂组合物含有：（A）由（A1）10〜99摩尔％的通式（1）表示的结构单元和（A2）所组成的共聚物，90〜1摩尔％ 由通式（2）表示的结构单元; （B）具有醌二叠氮基的化合物; （C）（C1）含有醚基的含氨基化合物和/或（C2）含环氧基的化合物; （D）溶剂; 和（E）粘合改进剂。 还提供了组合物的固化产物。 在式中，R a和R c各自表示1-4C烷基，烷氧基或芳基; Rb和Rd各自表示氢原子或甲基; n表示0〜3的整数， m表示1〜3的整数。（C）2006，JPO＆NCIPI

公开(公告)号：JP2006139284A

公开(公告)日：2006-06-01

申请号：JP2005325737

申请日：2005-11-10

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： SUWA MITSUFUMI ,  IWAZAWA HARUO ,  KAJITA TORU ,  IWANAGA SHINICHIRO

IPC: G03F7/004 ,  G03F7/039 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition for manufacture of a semiconductor device excellent in transparency, dry etching resistance and uniformity in film thickness. SOLUTION: The radiation sensitive resin composition comprises (A) an acid cleavable group-containing resin selected from the group consisting of a resin (AI) having an alicyclic skeleton represented by formula (1) and a resin (AII) having a structure obtained by substituting the hydrogen atoms of carboxyl groups in a carboxyl-containing alkali-soluble resin by a group having an alicyclic skeleton and an acid cleavable group, (B) a radiation-sensitive acid generator and (C) a solvent comprising a mixture of a linear ketone and an alkyl 2-hydroxypropionate. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种用于制造透明性，耐干蚀刻性和膜厚均匀性优异的半导体器件的辐射敏感性树脂组合物。 解决方案：辐射敏感性树脂组合物包含（A）选自含有可螯合基团的树脂，其由具有式（1）表示的脂环骨架的树脂（AI）和具有式 通过用具有脂环骨架和酸可分解基团的基团代替含羧基的碱溶性树脂中的羧基的氢原子获得的结构，（B）辐射敏感性酸产生剂和（C）包含混合物的溶剂 的直链酮和2-羟基丙酸烷基酯。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005290146A

公开(公告)日：2005-10-20

申请号：JP2004105578

申请日：2004-03-31

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： IWANAGA SHINICHIRO ,  OTA KATSU

IPC: C09J5/00 ,  H01L21/304

Abstract: PROBLEM TO BE SOLVED: To provide a method for peeling a bonded material off easily from a substrate without breaking the bonded material and substrate, and without leaving an adhesive on the surface of the bonded material and the surface of the substrate.
SOLUTION: This method for peeling the bonded material off from the substrate comprises (I) a process of irradiating light on a laminate material where the bonded material and substrate are laminated through a cured adhesive to decompose the cured adhesive, (II) a process of heating the laminated material where the cured adhesive is decomposed, to foam the cured adhesive, and (III) a process of dissolving the foamed cured adhesive with a solvent and/or an aqueous alkaline solution for peeling the bonded material from the substrate off.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种从基材容易地剥离粘合材料而不破坏粘合材料和基材，并且在粘合材料表面和基材表面上不留下粘合剂的方法。 解决方案：从基板剥离粘合材料的方法包括：（I）通过固化的粘合剂层合粘合材料和基材的层合材料上照射光的方法以分解固化的粘合剂，（II） 加热固化的粘合剂分解的层压材料以使固化的粘合剂发泡的工序，（III）使用溶剂和/或碱性水溶液使发泡固化的粘合剂溶解的方法，以从基材剥离粘合材料 关闭。 版权所有（C）2006，JPO＆NCIPI