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公开(公告)号：US10014455B2
公开(公告)日：2018-07-03
申请号：US14866073
申请日：2015-09-25
Applicant: Point Engineering Co., Ltd.
Inventor： Seung Ho Park , Tae Hwan Song , Sung Hyun Byun
CPC classification number: H01L33/62 , H01L33/486 , H01L33/60 , H05K1/05 , H05K1/185 , H05K2201/09745 , H05K2201/10106
Abstract: A chip substrate includes conductive portions, an insulation portion and a cavity. The conductive portions are laminated in one direction to constitute the chip substrate. The insulation portion is interposed between the conductive portions to electrically isolate the conductive portions. The cavity is formed on an upper surface of the chip substrate at a predetermined depth in a region including the insulation portion. The cavity is defined by a plurality of continuously-extending curved surfaces having predetermined radii of curvature.
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公开(公告)号：US09847462B2
公开(公告)日：2017-12-19
申请号：US14525478
申请日：2014-10-28
Applicant: Point Engineering Co., Ltd.
Inventor： Ki Myung Nam , Seung Ho Park , Young Chul Jun
CPC classification number: H01L33/486 , H01L24/97 , H01L2224/48091 , H01L2924/12041 , H01L2933/0033 , H01L2924/00014 , H01L2924/00
Abstract: Provided is an array substrate for mounting a chip. The array substrate includes a plurality of conductive layers unidirectionally stacked with respect to an original chip substrate; a plurality of insulating layers alternately stacked with the plurality of conductive layers, and electrically separate the plurality of conductive layers; and a cavity having a groove of a predetermined depth with respect to a region including the plurality of insulating layers in an upper surface of the original chip substrate. Accordingly, since the optical device array of a single structure is used as a line source of light, an emission angle emitted from the optical device is great, it is not necessary to form an interval for supplying an amount of light, and a display device can be simply constructed. Further, since it is not necessary to perform soldering a plurality of LED packages on a printed circuit board, a thickness of a back light unit can be reduced.
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公开(公告)号：US09768369B2
公开(公告)日：2017-09-19
申请号：US15392090
申请日：2016-12-28
Applicant: Point Engineering Co., Ltd.
Inventor： Bum Mo Ahn , Seung Ho Park
CPC classification number: H01L33/62 , H01L33/38 , H01L33/486 , H01L2224/13 , H01L2224/48091 , H01L2224/73265 , H01L2933/0016 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: The present invention relates to an LED metal substrate package, and particularly, to an LED metal substrate package having a heat dissipating structure, and a method of manufacturing same. The method comprises at least the steps of: forming at least one cavity having a groove of a predetermined depth in a metal substrate that is electrically separated by at least one vertical insulation layer, the cavity having one vertical insulation layer built in a floor thereof; treating all surfaces, except portions of the top surface of the metal substrate formed in the respective cavities, with shadow masking; removing an oxide film formed on the surface portions that have not been treated with masking; depositing an electrode layer on each of the surface portions of the oxide layer that have been removed; removing the shadow mask; performing Au/Sn soldering on the electrode layer and bonding an optical device chip; and wire bonding one electrode of the optical device, disposed on one side of the metal substrate with respect to each of the vertical insulation layers, through wires to the metal substrate disposed on the other side of each of the vertical insulation layers. The present invention forms solder using Au/Sn material, which has good heat dissipating characteristics and good bonding characteristics, on the electrode layer to bond an optical device chip, so as to have excellent heat dissipating performance compared to existing LED metal packages that use Ag epoxy.
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公开(公告)号：US20170131252A1
公开(公告)日：2017-05-11
申请号：US15344672
申请日：2016-11-07
Applicant: Point Engineering Co., Ltd.
Inventor： Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
CPC classification number: G01N33/0027 , G01N27/123 , G01N27/128 , H05B3/03 , H05B3/06 , H05B3/26
Abstract: A micro heater includes a substrate formed of an anodized film and a heater electrode formed on the substrate and provided with a heat generation wiring line. The heat generation wiring line is formed in a laminated state. Also disclosed are a micro sensor and a micro sensor manufacturing method.
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公开(公告)号：US09559276B2
公开(公告)日：2017-01-31
申请号：US14650672
申请日：2013-12-06
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park
CPC classification number: H01L33/62 , H01L33/38 , H01L33/486 , H01L2224/13 , H01L2224/48091 , H01L2224/73265 , H01L2933/0016 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: The present invention relates to an LED metal substrate package, and particularly, to an LED metal substrate package having a heat dissipating structure, and a method of manufacturing same. The method comprises at least the steps of: forming at least one cavity having a groove of a predetermined depth in a metal substrate that is electrically separated by at least one vertical insulation layer, the cavity having one vertical insulation layer built in a floor thereof; treating all surfaces, except portions of the top surface of the metal substrate formed in the respective cavities, with shadow masking; removing an oxide film formed on the surface portions that have not been treated with masking; depositing an electrode layer on each of the surface portions of the oxide layer that have been removed; removing the shadow mask; performing Au/Sn soldering on the electrode layer and bonding an optical device chip; and wire bonding one electrode of the optical device, disposed on one side of the metal substrate with respect to each of the vertical insulation layers, through wires to the metal substrate disposed on the other side of each of the vertical insulation layers. The present invention forms solder using Au/Sn material, which has good heat dissipating characteristics and good bonding characteristics, on the electrode layer to bond an optical device chip, so as to have excellent heat dissipating performance compared to existing LED metal packages that use Ag epoxy.
Abstract translation: 本发明涉及一种LED金属基板封装，特别涉及具有散热结构的LED金属基板封装及其制造方法。 该方法至少包括以下步骤：在至少一个垂直绝缘层电隔离的金属基板中形成具有预定深度的凹槽的至少一个空腔，该空腔具有内置在其底板中的一个垂直绝缘层; 除了形成在各个空腔中的金属基板的顶表面的部分之外，用阴影掩模处理所有表面; 去除未被掩蔽处理的表面部分上形成的氧化膜; 在去除的氧化物层的每个表面部分上沉积电极层; 去除荫罩; 在电极层上执行Au / Sn焊接并粘合光学器件芯片; 并且将配置在所述金属基板的与所述垂直绝缘层中的每一个垂直的绝缘层的一侧配置的所述光学元件的一个电极通过布线连接到设置在所述垂直绝缘层的另一侧的所述金属基板。 本发明使用在电极层上具有良好的散热特性和良好的结合特性的Au / Sn材料来形成焊接，以便与光学器件芯片接合，从而与使用Ag的现有LED金属封装相比具有优异的散热性能 环氧树脂。
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Patent Agency Ranking
76.发明授权Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by method 有权用于制造用于背光单元和光学元件的光学元件的方法和通过方法制造的光学元件阵列公开(公告)号：US09559268B2
公开(公告)日：2017-01-31
申请号：US14610145
申请日：2015-01-30
Applicant: Point Engineering Co., Ltd.
Inventor： Bum Mo Ahn , Seung Ho Park , Ki Myung Nam
CPC classification number: H01L33/486 , H01L24/97 , H01L25/13 , H01L33/62 , H01L2224/48091 , H01L2924/12041 , H05K1/181 , H05K3/0052 , H05K3/3442 , H05K3/3452 , H05K2201/10106 , Y02P70/611 , Y02P70/613 , Y10T29/41 , Y10T29/49117 , H01L2924/00014 , H01L2924/00
Abstract: A method of manufacturing an optical device for a back light unit includes forming a metal ingot by adhering insulating layers between metal plates. The metal ingot is cut in a vertical direction to create original substrates each with insulating layer portions in parallel with intervals therebetween. Solder resist is deposited on at least one of a top surface and bottom surface of an original substrate.
Abstract translation: 制造背光单元用光学元件的方法包括通过在金属板之间粘合绝缘层来形成金属锭。 金属锭沿垂直方向切割，以形成各自具有彼此平行间隔的绝缘层部分的原始基板。 抗蚀剂沉积在原始基底的顶表面和底表面中的至少一个上。
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公开(公告)号：US09496470B2
公开(公告)日：2016-11-15
申请号：US14986801
申请日：2016-01-04
Applicant: Point Engineering Co., Ltd.
Inventor： Bum Mo Ahn , Seung Ho Park , Tae Hwan Song
CPC classification number: H01L33/60 , H01L33/44 , H01L33/46 , H01L33/486 , H01L33/58
Abstract: A chip package has a light shield for blocking the light radiated from the chip. The chip package includes: a chip substrate including a conductive portion and at least one insulating portion electrically separating the conductive portion; an optical device mounted on the chip substrate; a sealing portion sealing the upper surface of the chip substrate; an adhesive bonding the sealing portion to the chip substrate; and a light shield formed in the sealing portion and blocking the light of the optical device from entering into the adhesive.
Abstract translation: 芯片封装具有用于阻挡从芯片辐射的光的遮光罩。 芯片封装包括：芯片基板，包括导电部分和至少一个绝缘部分，电绝缘部分; 安装在芯片基板上的光学装置; 密封所述芯片基板的上表面的密封部; 将密封部分粘合到芯片基板上的粘合剂; 以及形成在密封部分中并阻挡光学装置的光进入粘合剂的遮光罩。
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公开(公告)号：US20160197252A1
公开(公告)日：2016-07-07
申请号：US14986801
申请日：2016-01-04
Applicant: Point Engineering Co., Ltd.
Inventor： Bum Mo Ahn , Seung Ho Park , Tae Hwan Song
CPC classification number: H01L33/60 , H01L33/44 , H01L33/46 , H01L33/486 , H01L33/58
Abstract: A chip package has a light shield for blocking the light radiated from the chip. The chip package includes: a chip substrate including a conductive portion and at least one insulating portion electrically separating the conductive portion; an optical device mounted on the chip substrate; a sealing portion sealing the upper surface of the chip substrate; an adhesive bonding the sealing portion to the chip substrate; and a light shield formed in the sealing portion and blocking the light of the optical device from entering into the adhesive.
Abstract translation: 芯片封装具有用于阻挡从芯片辐射的光的遮光罩。 芯片封装包括：芯片基板，包括导电部分和至少一个绝缘部分，电绝缘部分; 安装在芯片基板上的光学装置; 密封所述芯片基板的上表面的密封部; 将密封部分粘合到芯片基板上的粘合剂; 以及形成在密封部分中并阻挡光学装置的光进入粘合剂的遮光罩。
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公开(公告)号：US20160190407A1
公开(公告)日：2016-06-30
申请号：US14650672
申请日：2013-12-06
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park
CPC classification number: H01L33/62 , H01L33/38 , H01L33/486 , H01L2224/13 , H01L2224/48091 , H01L2224/73265 , H01L2933/0016 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: The present invention relates to an LED metal substrate package, and particularly, to an LED metal substrate package having a heat dissipating structure, and a method of manufacturing same. The method comprises at least the steps of: forming at least one cavity having a groove of a predetermined depth in a metal substrate that is electrically separated by at least one vertical insulation layer, the cavity having one vertical insulation layer built in a floor thereof; treating all surfaces, except portions of the top surface of the metal substrate formed in the respective cavities, with shadow masking; removing an oxide film formed on the surface portions that have not been treated with masking; depositing an electrode layer on each of the surface portions of the oxide layer that have been removed; removing the shadow mask; performing Au/Sn soldering on the electrode layer and bonding an optical device chip; and wire bonding one electrode of the optical device, disposed on one side of the metal substrate with respect to each of the vertical insulation layers, through wires to the metal substrate disposed on the other side of each of the vertical insulation layers. The present invention forms solder using Au/Sn material, which has good heat dissipating characteristics and good bonding characteristics, on the electrode layer to bond an optical device chip, so as to have excellent heat dissipating performance compared to existing LED metal packages that use Ag epoxy.
Abstract translation: 本发明涉及一种LED金属基板封装，特别涉及具有散热结构的LED金属基板封装及其制造方法。 该方法至少包括以下步骤：在至少一个垂直绝缘层电隔离的金属基板中形成具有预定深度的凹槽的至少一个空腔，该空腔具有内置在其底板中的一个垂直绝缘层; 除了形成在各个空腔中的金属基板的顶表面的部分之外，用阴影掩模处理所有表面; 去除未被掩蔽处理的表面部分上形成的氧化膜; 在去除的氧化物层的每个表面部分上沉积电极层; 去除荫罩; 在电极层上执行Au / Sn焊接并粘合光学器件芯片; 并且将配置在所述金属基板的与所述垂直绝缘层中的每一个垂直的绝缘层的一侧配置的所述光学元件的一个电极通过布线连接到设置在所述垂直绝缘层的另一侧的所述金属基板。 本发明使用在电极层上具有良好的散热特性和良好的结合特性的Au / Sn材料来形成焊接，以便与光学器件芯片接合，从而与使用Ag的现有LED金属封装相比具有优异的散热性能 环氧树脂。
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公开(公告)号：US09318679B2
公开(公告)日：2016-04-19
申请号：US14765457
申请日：2014-02-06
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Tae Hwan Song
CPC classification number: H01L33/62 , H01L33/54 , H01L2224/48091 , H01L2924/00014
Abstract: An optical device includes a metal substrate wherein at least one vertical insulation layer is formed from the upper to the lower surface; a metal plated layer formed on the upper surface of the metal substrate except for the vertical insulation layer; and an optical device chip bonded to one portion of the metal plated layer. One electrode of the optical device chip is electrically connected to a bonded surface of the metal plated layer, and the other electrode of the optical device chip is wire bonded to the other portion of metal plated layer. The optical device chip and a peripheral region thereof is shielded with a sealant, and at least one groove is formed on a partial surface of the metal plated layer so that a portion of the sealant is directly bonded to the metal substrate.
Abstract translation: 光学装置包括金属基板，其中至少一个垂直绝缘层从上表面到下表面形成; 形成在所述金属基板的除了所述垂直绝缘层之外的上表面上的金属镀层; 以及与金属镀层的一部分接合的光学器件芯片。 光器件芯片的一个电极与金属镀层的接合表面电连接，并且光学器件芯片的另一个电极被引线接合到金属镀层的另一部分。 光学元件芯片及其外围区域用密封剂屏蔽，并且在金属镀层的部分表面上形成至少一个凹槽，使得密封剂的一部分直接接合到金属基底。
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