Abstract:
PROBLEM TO BE SOLVED: To provide a production method for particulate arrangement structure with little defect, a production method for optical media with little defect, and production apparatuses used for production thereof. SOLUTION: The production apparatus in the figure for the particulate arrangement structure is provided with a device 5 partially speeding up vaporization rate of a dispersion medium. In this apparatus, after a particulate dispersion liquid 2 is applied on a substrate 1, the dispersion medium is quickly vaporized from the dispersion liquid 2 positioned facing the device 5, speeding up the vaporization rate of the dispersion medium, and remaining particulates are deposited on the substrate 1 to self-organizingly form a particulate assembly 3. By moving the device 5 to the dispersion liquid 2 side in conformity to the growth of the particulate assembly 3, a growth end 4 of the assembly 3 is moved to the dispersion liquid 2 side to control the growth direction of the assembly 3. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To realize a screen having less external light noise and high contrast of a video and capable of obtaining a video sinking in the black side. SOLUTION: The screen is constituted by scatteringly disposing reflection surfaces wherein particulate layers 2, 3 and 4 for red color reflection, green color reflection and blue color reflection are laminated in the vertical direction or disposed in the horizontal direction on a substrate 1. The diameters of particulates for red color reflection, green color reflection and blue color reflection are specified to be nearly 280 nm, nearly 235 nm and nearly 212 nm, respectively. The substrate 1 is formed by using a material which can absorb light having a wavelength except the wavelength of three primary colors of red, green and blue. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a method for easily depositing a compound semiconductor containing nitrogen of good crystallinity or a semiconductor of a nitride-based group III-V compound. SOLUTION: When a compound semiconductor containing nitrogen or a semiconductor of a nitride-based group III-V compound is deposited by a vapor deposition method, e.g. an organic metal chemical vapor deposition method, an organic compound which contains at least one nitrogen atom and at least two groups of which a molar weight is at least larger than 36 is bonded to the nitrogen atom, e.g. a diisopropylamine is used as a nitrogen atom.
Abstract:
PROBLEM TO BE SOLVED: To provide a display device in which LEDs can be mounted and wired easily, can be manufactured efficiently, and can display high-quality pictures and a method of manufacturing the device. SOLUTION: In this display device, light emitting diode elements are arranged in a matrix by arranging a plurality of bar-like substrates on each of which a plurality of light emitting diode elements are linearly arranged, in the widthwise direction.
Abstract:
PROBLEM TO BE SOLVED: To provide a cutting method of a resin substrate or resin fiber and a manufacturing method of a liquid crystal device which can prevent a liquid crystal display device from being deteriorated in characteristic and reliability and decreasing in manufacture yield owing to the deformation of a resin sub strate or resin fiber, the deformation and peeling of a transparent electrode film, etc., at in the cutting. SOLUTION: When a resin substrate 10 having an ITO transparent electrode film 12 formed is cut from its top surface side by using a cutter having a hard blade of
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element, which is stable in characteristics and stable with longer life by preventing a p-type impurity from diffusing. SOLUTION: On a substrate 1, with a III-V group buffer layer 2, an n-type conductive layer (a II-VI group buffer layer 3, a first conductive clad layer 4), a first guide layer 5, an active layer 6, a second guide layer 7, and a p-type conductive layer (a second conductive clad layer 8, a first semiconductor layer 9, a second semiconductor layer 10, a superlattice layer 11, and a contact layer 12) are successively laminated. The n-type conductive layer is added with Cl as n-type impurity. The p-type conductive layer is added with an I-group element which is, at least one kind from among K, Rb, and Cs, as p-type impurity. Since the p-type impurity occupies a lattice position of a II-group element, diffusion is mode hard to take place under electrification, with no change in p-n junction position.
Abstract:
PURPOSE:To lower the growth temperature of a Te-based II-VI compound semiconductor in comparison with a conventional technique and obtain a sufficiently high growth rate in practical terms. CONSTITUTION:In growing a Te-based II-VI compound semiconductor layer, such as, a ZnTe layer 2, on a semiconductor substrate, such as, a GaAs substrate 1, by a vapor growth method like a metal organic chemical vapor deposition method, di-tertiary-butyltellurium is used as a Te material. The ratio of a group VI element to a group II element of a growth material is set to 0.7 to 3.7. The growth temperature Tg is set to 275 deg.C
Abstract:
PURPOSE:To obtain an MOCVD method enabling formation of a compound semiconductor layer containing Mg and an MOCVD method enabling easy formation of a grated structure for the compound semiconductor layer. CONSTITUTION:An MOCVD method wherein a II-VI compound semiconductor layer is formed by using an organometallic compound of biscyclopentadienyl magnesium series of which a vapor pressure at 330 deg.CK 15 1.3X10 Pa (0.1 torr) to 1.3X10 Pa (1.0 torr), or an MOCVD method wherein a four-element mixed crystal series compound semiconductor layer constituted of two kinds of group II elements and two kinds of group VI elements is formed and wherein the flow rate of one of two kinds of material gases containing the group VI elements is changed in a state of the flow rates of two kinds of material gases containing the group II elements being held fixed and thereby the compositional rates of the group II elements in the compound semiconductor layer are changed.
Abstract:
PURPOSE:To improve the crystalline property of a p-type clad layer and extend its lifetime characteristics, by causing the carrier concentration of the p-type clad layer adjacent to an active layer to come to a low level in an AlGaInP semiconductor laser. CONSTITUTION:In the case of an AlGaInP semiconductor laser 12, the carrier concentration of a p-type clad layer in a double hetero structure is set below 6X10 cm . In other words, an MOCVD process allows an n-type (Al0.5Ga0.5)0.5 In0.5P clad layer 3, an undopped Ga0.5In0.5P active layer 4, a p-type (Al0.5Ga0.5)0.5 In0.5P clad layer 11 where positive hole concentration is 2X10 cm , and a p-type GaAs cap layer 6 to grow one after another on an n-type GaAs substrate 2. Required ions are implanted in such a way that the ions reaches the p-type AlGaInP clad layer 11 by leaving the center part of the cap layer 6 in a stripe form and the semiconductor laser 12 is made up by forming an ion-implanted high resistance layer 7.
Abstract:
PROBLEM TO BE SOLVED: To improve the image quality of a captured image in a "multilayer type" solid-state imaging device. SOLUTION: A transmission window TM of a green photoelectric conversion unit 201G is formed so that light in a blue wavelength range transmits through a blue photoelectric conversion unit 201B by a larger amount than that of light transmitting through a part other than the transmission window TM. The transmission window TM is formed so that a width D defined by the direction of an imaging plane (an xy plane) of a substrate 101 satisfies formula (1) λc/n≤2D. Thus, a large amount of blue light transmits through the green photoelectric conversion unit 201G based on the "principle of waveguide". COPYRIGHT: (C)2011,JPO&INPIT