ADJUSTMENT ASSEMBLY, LOAD ASSEMBLY COMPRISING SAME, PRESS SYSTEM COMPRISING SAME AND METHOD OF ADAPTING LOAD ASSEMBLY
    71.
    发明申请
    ADJUSTMENT ASSEMBLY, LOAD ASSEMBLY COMPRISING SAME, PRESS SYSTEM COMPRISING SAME AND METHOD OF ADAPTING LOAD ASSEMBLY 审中-公开
    调整组件,包括其的装载组件,包括其的压力系统和适配负载组件的方法

    公开(公告)号:WO2013083643A1

    公开(公告)日:2013-06-13

    申请号:PCT/EP2012/074529

    申请日:2012-12-05

    Inventor: VUKOVIC, Dragan

    CPC classification number: B01J3/065 B30B11/004 B30B15/026 B30B15/065

    Abstract: An adjustment assembly comprising a platform (110) moveably coupled to a base (120), and an adjustment mechanism comprising a deflection member (132, 134) for adjusting the position of the platform (110) laterally relative to the base(120); the adjustment assembly being configured so that the platform (110) can be urged to move laterally in a direction along a first axis responsive to the deflection member (132, 134) being urged to move in a direction along a second axis, the second axis being substantially not parallel to the first direction.

    Abstract translation: 一种调节组件,包括可移动地联接到基座(120)的平台(110)和包括偏转构件(132,134)的调节机构,用于相对于基座(120)侧向地调节平台(110)的位置; 所述调整组件被构造成使得所述平台(110)能够响应于所述偏转构件(132,134)被迫沿沿着第二轴线的方向移动而沿着第一轴线的方向被横向移动,所述第二轴线 基本上不平行于第一方向。

    METHOD FOR PRODUCING A PCD COMPACT
    73.
    发明申请
    METHOD FOR PRODUCING A PCD COMPACT 审中-公开
    生产PCD压缩的方法

    公开(公告)号:WO2009147629A1

    公开(公告)日:2009-12-10

    申请号:PCT/IB2009/052344

    申请日:2009-06-03

    Abstract: A method of producing a composite diamond compact comprising a polycrystalline diamond (PCD) compact bonded to a cemented carbide substrate is provided. The method includes the steps of: providing a PCD table, preferably a PCD table with diamond-to-diamond bonding and a porous microstructure in which the pores are empty of second phase material bringing together the PCD table and a cemented carbide substrate in the presence of a bonding agent to form an unbonded assembly; subjecting the unbonded assembly to an initial compaction at a pressure of at least 4.5 GPa and a temperature below the melting point of the bonding agent for a period of at least 150 seconds; and thereafter subjecting the unbonded assembly to a temperature above the melting point of the bonding agent and a pressure of at least 4.5 GPa for a time sufficient for the bonding agent to become molten and bond the PCD table to the substrate to form a composite diamond compact.

    Abstract translation: 提供了一种制造复合金刚石复合体的方法,其包括结合到硬质合金基底的多晶金刚石(PCD)紧固件。 该方法包括以下步骤:提供PCD表,优选具有金刚石 - 金刚石结合的PCD表和多孔微结构,其中孔隙为空的第二相材料,在存在的情况下将PCD台和硬质合金基底聚集在一起 的粘合剂以形成未结合的组件; 使未结合的组件在至少4.5GPa的压力和低于粘合剂的熔点的温度下进行至少150秒的初始压实; 然后使未结合的组件经受高于粘合剂熔点的温度和至少4.5GPa的压力,持续一段时间足以使粘合剂变得熔融并将PCD工作台结合到衬底上以形成复合金刚石致密体 。

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