公开(公告)号：US6126060A

公开(公告)日：2000-10-03

申请号：US238494

申请日：1999-01-27

Applicant: Young-Zoon Moon

Inventor： Young-Zoon Moon

IPC: B23K1/00 ,  B23K1/08 ,  B23K3/00 ,  H05K3/34 ,  B23K31/00 ,  B23K31/02

CPC classification number: B23K1/08 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/0763 ,  H05K3/3447

Abstract: A soldering device adaptable to dipping method for preventing neighboring leads (L) from being mixed in molten lead (Pb) even though spaces between leads (L) of parts mounted to a PCB substrate (P) are relatively narrow, the device having a lead tub where molten lead is filled up to an upper end thereof and maintained at a predetermined temperature, the device comprising a receiving plate disposed at an upper surface of the lead tub and formed with a receiving unit for soldered parts of PCB substrate to contact the molten lead, a fixing unit mounted at the receiving plate for the PCB substrate to be accommodated with, detached from and fixed to the receiving unit, and an elevation arranged to elevate the receiving plate horizontally and slantingly.

Abstract translation: 一种适用于浸渍方法的焊接装置，即使安装到PCB基板（P）的部件的引线（L）之间的空间相对较窄，防止相邻引线（L）不熔融在铅（Pb）中，该器件具有引线 其中熔融铅被填充到其上端并保持在预定温度，所述装置包括设置在引导槽的上表面处的接收板，并形成有用于与PCB基板的焊接部分接触的接收单元， 引线，安装在用于PCB基板的接收板上的固定单元，其被容纳，从接收单元分离并固定到接收单元，以及设置成水平和倾斜地升高接收板的高度。

公开(公告)号：US6119927A

公开(公告)日：2000-09-19

申请号：US27042

申请日：1998-02-18

Applicant: Richard Ramos ,  Paul W. Barnes

Inventor： Richard Ramos ,  Paul W. Barnes

IPC: B23K3/06 ,  B23K35/14 ,  B23K35/12 ,  B23K3/02 ,  B23K28/00 ,  B23K31/02 ,  B23K35/38

CPC classification number: B23K3/0623 ,  B23K2201/42 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/082

Abstract: A method and apparatus for placing and attaching solder balls to a substrate having conductive pads in a predetermined pattern is disclosed. The substrate is placed on a carrier plate. An alignment plate having holes corresponding to the predetermined pattern is mated to the carrier plate with its holes aligned with the predetermine pattern on the substrate. Solder balls are loaded into each hole of the alignment plate. The solder balls may be loaded with a vacuum plate which uses vacuum to pick up solder balls in the predetermined pattern and place them over the holes on the alignment plate. The vacuum is released for dropping the balls in the holes of the alignment plate. Alternatively a shutter plate having holes corresponding to the holes on the alignment plate is fitted on the alignment plate and afforded slidable movement between an offset position and an aligned position. A ball is loaded in each hole in the shutter plate when it is in its offset position. The shutter plate is then slid its aligned position wherein its holes are aligned with the holes on the alignment plate causing the balls to drop into the holes on the alignment plate and onto a conductive pad of the substrate. The assembly of carrier and alignment plate is then heated in a non-oxidizing atmosphere in a furnace causing the solder balls to reflow and attach to the pads on the substrate.

Abstract translation: 公开了一种用于将焊球放置并附着到具有预定图案的导电焊盘的基板的方法和装置。 将基板放置在载体板上。 具有对应于预定图案的孔的对准板与载体板配合，其孔与衬底上的预定图案对准。 焊球装载到对准板的每个孔中。 焊球可以装有真空板，该真空板使用真空来以预定图案拾取焊球，并将它们放置在对准板上的孔上。 释放真空以将球落在对准板的孔中。 或者，具有对应于对准板上的孔的孔的快门板装配在对准板上，并在偏移位置和对准位置之间提供可滑动运动。 当挡板处于其偏移位置时，球被装载在挡板中的每个孔中。 然后将快门板滑动其对准位置，其中其孔与对准板上的孔对齐，使得球落入对准板上的孔和衬底的导电垫上。 然后将载体和对准板的组件在炉中的非氧化气氛中加热，使得焊球回流并附着到衬底上的焊盘。

公开(公告)号：US6099681A

公开(公告)日：2000-08-08

申请号：US131819

申请日：1998-08-10

Applicant: Kazuo Arikado ,  Shinichi Nakazato

Inventor： Kazuo Arikado ,  Shinichi Nakazato

IPC: B23K3/06 ,  H01L21/60 ,  H05K3/34 ,  B32B31/00

CPC classification number: B23K3/0623 ,  H05K3/3478 ,  B23K2201/42 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/163 ,  H05K3/3489

Abstract: When applying a flux 2 kept in a container 16 onto a conductive ball 1, the flux 2 is first applied by a squeegee unit 17 on a bottom 16a of container 16 in the form of layer having a certain predetermined layer thickness. Then, a suction head 20 holding a solder ball 1 is lowered towards the container 16. As soon as a touch sensor 43 detects a touching of the solder ball 1 to the bottom 16a, the suction head 20 is lifted, and the solder ball 1 held to the suction head 20 is transferred onto a workpiece. Thus a solder ball 1 may be transferred onto a workpiece after being applied with a certain specific amount of flux 2 with precision.

Abstract translation: 当将保持在容器16中的助焊剂2施加到导电球1上时，首先通过刮板单元17将容器16以具有一定预定层厚度的层的形式施加在容器16的底部16a上。 然后，保持焊球1的吸头20朝向容器16降低。一旦触摸传感器43检测到焊球1与底部16a的接触，抽吸头20被提起，并且焊球1 保持在吸头20上的工件被转移到工件上。 因此，可以在精确地施加一定量的焊剂2之后将焊球1转印到工件上。

公开(公告)号：US06076726A

公开(公告)日：2000-06-20

申请号：US108482

申请日：1998-07-01

Applicant: Mark Kenneth Hoffmeyer ,  Phillip Duane Isaacs

Inventor： Mark Kenneth Hoffmeyer ,  Phillip Duane Isaacs

IPC: B23K1/00 ,  H01R12/04 ,  H05K3/34 ,  B23K31/02

CPC classification number: H05K3/3436 ,  B23K1/0016 ,  H05K3/3463 ,  B23K2201/42 ,  H05K2201/09481 ,  H05K2201/09572 ,  H05K2201/10992 ,  H05K2201/2081 ,  H05K2203/043 ,  H05K2203/0455 ,  H05K3/3452 ,  H05K3/3484 ,  Y02P70/613

Abstract: Fine pitch area array packaging is achieved using a via-in-pad design within the area array attach portion of a printed circuit board (PCB). The limitation of the design is the wicking action, whereby solder applied to the capture pad contact surface is depleted by capillary action into the via hole when reflowed, causing insufficient solder to be present at the contact surface to effect reliable and repeatable electrical connections. In one implementation, an initial application of solder is applied to plug the via hole with a material having a higher final melting temperature than eutectic solder, thereby providing a stable plug. This plug is formed by the initial solder application that may be either a eutectic solder containing a third metal that forms intermetallic compounds, when reflowed, that elevate the liquidus temperature or a solder having a different formulation with an inherent higher melting temperature. An alternative implementation is to plate the via hole with a material, such as nickel, which prevents eutectic solder, applied to the via capture pad contact surface, from wetting the hole surface and being drawn away from the contact surface by capillary action. Thus, the solder, applied to the via capture pad and used to establish an electrical connection is not depleted.

Abstract translation: 使用在印刷电路板（PCB）的区域阵列附着部分内的通孔焊盘设计实现细间距区域阵列封装。 设计的限制是芯吸作用，由此当回流时，施加到捕获垫接触表面的焊料被毛细管作用通入通孔中，导致在接触表面处存在不足的焊料以实现可靠和可重复的电连接。 在一个实施方案中，施加焊料的初始应用以用比共晶焊料更高的最终熔融温度的材料堵塞通孔，从而提供稳定的插塞。 该插头由初始焊料应用形成，其可以是包含形成金属间化合物的第三金属的共晶焊料，当回流时，提高液相线温度的焊料或具有固有的较高熔融温度的不同配方的焊料。 另一种实施方案是用诸如镍的材料对通孔进行平板化，其防止施加到通孔捕获垫接触表面的共晶焊料润湿孔表面并通过毛细管作用从接触表面拉出。 因此，施加到通孔捕获垫并用于建立电连接的焊料不会耗尽。

公开(公告)号：US6045025A

公开(公告)日：2000-04-04

申请号：US014567

申请日：1998-01-28

Applicant: Masayoshi Muramatsu ,  Kenichi Watanabe

Inventor： Masayoshi Muramatsu ,  Kenichi Watanabe

IPC: B23K1/00 ,  H05K1/11 ,  H05K3/34 ,  H05K3/00

CPC classification number: B23K1/0016 ,  H05K1/116 ,  H05K3/3447 ,  B23K2201/42 ,  H05K2201/09463 ,  H05K2201/09854 ,  H05K2201/10969 ,  H05K3/3468

Abstract: A pair of soldering irons are fixed to a sliding plate at a predetermined interval. The soldering irons are integrally moved so as to reciprocate in a rectangular direction relative to a conveyor belt. One of the soldering irons is conveyed to a working position of the conveyor belt and the other of them is separated from the conveyor belt. While one of the soldering irons solders a circuit board, the other is cleaned. The circuit board has a slit into which a metal plate is inserted and soldered. For the slit, a soldering land constituted of a main-land and a sub-land is provided. The main-land is formed along one of longer sides of the slit. The sub-land is elongated from the main-land along a shorter side of the slit. The soldering land is not formed all around the slit so that the slit is not closed by solder when the circuit board is dip-soldered.

公开(公告)号：US6042648A

公开(公告)日：2000-03-28

申请号：US892983

申请日：1997-07-15

Applicant: Dave O. Corey ,  David J. Dye

Inventor： Dave O. Corey ,  David J. Dye

IPC: B23K3/06 ,  H05K3/34 ,  B05C3/00

CPC classification number: B23K3/0669 ,  B23K2201/42 ,  H05K3/3468 ,  Y10S269/903

Abstract: A vertical circuit board soldering apparatus for soldering printed circuit boards by immersing them in a molten solder bath. Air knives are employed to remove excess solder from boards leaving the bath. A displacement mechanism vertically dips the circuit boards. The mechanism comprises a parallelepiped frame that comprises two spaced apart parallel rails securing a sliding chassis therebetween. The chassis comprises three parallel spaced apart members. An upper member transversely extends between the rails while captivating a portion of each rail adjacent its ends. A parallel lower member depends from the upper member with an adjustable intermediate member therebetween. The intermediate member also transversely extends between the rails while captivating another portion of the rails. The intermediate member is coupled to the upper member by a screw jack that moves the intermediate member upwardly or downwardly to vary the distance therebetween to accommodate various board sizes. The intermediate member supports a pneumatic clamp that grasps the upper edge of an inserted circuit board. A holder on the lower member grasps the opposite lower edge of the circuit board to cooperatively stabilize it therebetween. The lower member comprises an elongated bar extending across the top of the bath penetrated by several regularly spaced, threaded holes. The holes enable the bar to quickly shed molten solder entrained thereon. The holder may be either a grooved bracket or a J-shaped hook. An intermediate member shaft moves between spaced apart rollers to ensure alignment. An alignment assembly ensures front-to-back solder uniformity.

Abstract translation: 一种垂直电路板焊接装置，用于通过将印刷电路板浸入熔融焊料浴中来焊接印刷电路板。 使用气刀从离开浴槽的板上除去多余的焊料。 位移机构垂直汲取电路板。 该机构包括平行六面体框架，该平行六面体框架包括两个间隔开的平行轨道，其将滑动底盘固定在其间。 底盘包括三个平行间隔开的​​构件。 上部构件在轨道之间横向延伸，同时吸引每个轨道的邻近其端部的一部分。 平行的下部构件从上部构件在其间具有可调节的中间构件。 中间构件还在轨道之间横向延伸，同时吸引轨道的另一部分。 中间构件通过螺钉千斤顶联接到上部构件，螺钉千斤顶使中间构件向上或向下移动以改变其间的距离以适应各种板尺寸。 中间构件支撑抓住插入的电路板的上边缘的气动夹具。 下部构件上的保持器夹持电路板的相对的下边缘以在它们之间协同稳定。 下部构件包括延伸穿过由几个规则间隔开的螺纹孔穿过的浴槽的顶部的细长杆。 这些孔使得棒能够快速地夹带夹带在其上的熔融焊料。 支架可以是带槽支架或J形钩。 中间构件轴在间隔开的辊之间移动以确保对准。 对准组件确保了前后焊料均匀性。

公开(公告)号：US6015966A

公开(公告)日：2000-01-18

申请号：US32795

申请日：1998-03-02

Applicant: Johannes Rehm

Inventor： Johannes Rehm

IPC: B23K1/012 ,  F26B15/10 ,  F27B9/06

CPC classification number: F26B15/10 ,  B23K1/012 ,  B23K2201/42

Abstract: In reflow soldering systems the circuit boards are conventionally transported in horizontal direction from a feed portion through a preheating portion, a main heat-treatment portion, a cooling portion and a discharge portion in linear fashion in the longitudinal direction of the system. Such reflow systems, however, are relatively long and therefore require a lot of space. According to the invention, a heating apparatus, in particular for a reflow solder system, for heating circuit boards is provided with a feed portion for feeding the circuit boards in a substantially horizontal direction, at least one heating portion following in transportation direction downstream of said feed portion, a discharge portion for discharging circuit boards supplied from the heating portion in a substantially horizontal direction, and with a transportation device connecting feed portion, heating portion and discharge portion, characterized in that a transportation path of the transportation device extends in the heating portion in a plane substantially in a direction transverse to the horizontal feed or discharge direction, and the transportation path connects feed and discharge portions in a substantially ring-like configuration.

Abstract translation: 在回流焊接系统中，电路板通常沿着系统的纵向以线性方式从供电部分经过预热部分，主热处理部分，冷却部分和排出部分沿水平方向传输。 然而，这种回流系统相对较长，因此需要很大的空间。 根据本发明，用于加热电路板的加热装置，特别是用于回流焊料系统的加热装置设置有用于沿大致水平的方向供给电路板的进给部分，至少一个加热部分，其沿着运输方向在所述 馈电部分，用于从大致水平方向从加热部分供应的电路板放电的放电部分，以及连接馈电部分，加热部分和放电部分的输送装置，其特征在于，输送装置的输送路径在加热 基本上在横向于水平进给或排出方向的方向上的平面部分，并且输送路径将进给部和排出部以大致环形的形状连接。

公开(公告)号：US4654502B1

公开(公告)日：1999-12-14

申请号：US77600185

申请日：1985-09-13

Applicant: VITRONICS CORP

Inventor： FURTEK EDWARD J

IPC: B23K1/005 ,  B23K1/008 ,  B23K1/19 ,  H05B3/62 ,  H05K3/34 ,  B23K1/00 ,  B23K31/02 ,  F27B9/36

CPC classification number: B23K1/0053 ,  B23K1/008 ,  B23K2201/42

Abstract: A multi-zone thermal process system utilizing nonfocused infrared panel emitters. An insulated housing has a plurality of zones each having separate panel emitters which heat a product load traveling through the zone and in close proximity to said panel(s) at different peak wavelengths in each zone. The panel emitters emit infrared wavelengths in the middle and far regions. The temperature differences across each zone and between the panel and product are held to a minimum. A specific application of the system is for accomplishing reflow soldering of surface mount devices to printed circuit boards.

公开(公告)号：US5977512A

公开(公告)日：1999-11-02

申请号：US875722

申请日：1997-07-31

Applicant: Ghassem Azdasht ,  Martin Lange

Inventor： Ghassem Azdasht ,  Martin Lange

IPC: B23K1/06 ,  B23K1/005 ,  B23K1/20 ,  H01L21/60 ,  H01L23/12 ,  H05K3/24 ,  H05K3/34 ,  B23K26/00

CPC classification number: H05K3/3478 ,  B23K1/0056 ,  B23K1/206 ,  B23K2201/42 ,  H01L2224/11334 ,  H05K2203/0126 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/086 ,  H05K2203/107 ,  H05K2203/108 ,  H05K3/3489 ,  H05K3/3494

Abstract: In a method and an apparatus for the flux-free application of a solder to a substrate or a chip an area on the surface of the substrate or on the pad of the chip, to which the solder is applied, is cleaned, to produce a sace which is suitable for soldering. Subsequently, the cleaned area is isolated from the surroundings by means of a protective gas, and finally the solder is applied to the cleaned, isolated area and remelted.

Abstract translation: PCT No.PCT / EP96 / 04067 Sec。 371日期1997年7月31日 102（e）日期1997年7月31日PCT提交1996年9月17日PCT公布。 公开号WO97 / 20654 日期：1997年6月12日在将焊料无焊剂施加到衬底或芯片上的方法和装置中，衬底表面上或衬底上施加焊料的区域是 清洁，以产生适合焊接的表面。 随后，通过保护气体将清洁的区域与周围环境隔离，最后将焊料施加到清洁的隔离区域并重新熔化。

公开(公告)号：US4565917B1

公开(公告)日：1999-06-08

申请号：US57216384

申请日：1984-01-18

Applicant: VITRONICS CORP

Inventor： FURTEK EDWARD J

IPC: B23K1/005 ,  B23K1/008 ,  B23K1/19 ,  H05B3/62 ,  H05K3/34 ,  F27B9/06

CPC classification number: B23K1/0053 ,  B23K1/008 ,  B23K2201/42

Abstract: A multi-zone thermal process system utilizing nonfocused infrared panel emitters. An insulated housing has a plurality of zones each having separate panel emitters which heat a product load traveling through the zone and in close proximity to said panel(s) at different peak wavelengths in each zone. The panel emitters emit infrared wavelengths in the middle and far regions. The temperature differences across each zone and between the panel and product are held to a minimum. A specific application of the system is for accomplishing reflow soldering of surface mount devices to printed circuit boards.