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    Micromachining method and micromachined structure
    72.
    发明公开
    Micromachining method and micromachined structure 失效
    一种用于生产二维微结构的三维微结构的过程

    公开(公告)号：EP0794562A2

    公开(公告)日：1997-09-10

    申请号：EP97103778.3

    申请日：1997-03-06

    Applicant: SEIKO INSTRUMENTS INC.

    Inventor： Muramatsu, Hiroshi

    IPC: H01L21/26 ,  B21D31/00

    CPC classification number: B81C3/008 ,  B81B2201/0235 ,  B81B2201/13 ,  B81B2203/0118 ,  B81B2203/0353

    Abstract: A minute structure such as a cantilever 11 is formed on a silicon substrate 10 and heated by irradiating a laser beam to a part of the cantilever 11, by which the cantilever 11 is bent. The two bent cantilevers 11 are inserted into through holes 14 in a crystal substrate 10 formed in advance, and the tip end portions 15 thereof are heated. The heated tip end portions 15 become thicker and at the same time shorter, so that the crystal substrate 12 can be fixed to the silicon substrate 10 without play. By heating a part of the minute structure by such a method, plastic deformation is produced, so that bending and deforming can be performed. Thereby, a three-dimensional micromachined structure is constructed and assembled.

    SYSTEM AND METHOD FOR COUPLING MICROCOMPONENTS
    75.
    发明申请
    SYSTEM AND METHOD FOR COUPLING MICROCOMPONENTS 审中-公开
    用于耦合微单元的系统和方法

    公开(公告)号：WO0185599B1

    公开(公告)日：2002-07-04

    申请号：PCT/US0115059

    申请日：2001-05-10

    Applicant: ZYVEX CORP

    Inventor： ELLIS MATTHEW D ,  SKIDMORE GEORGE D

    IPC: B81B7/00 ,  F16B2/20

    CPC classification number: B81C3/008 ,  B81B2201/13 ,  F16B2/20 ,  Y10T24/45581 ,  Y10T403/602

    Abstract: A system and method which provide a general-purpose snap connector suitable for coupling microcomponents are disclosed. A snap connector is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a snap connector is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a snap connector may be pressure fit with a receptacle (or aperture) of a mating component in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the snap connector. A preferred embodiment provides a "preloaded" snap connector that may be utilized to perform general assembly of microcomponents. An alternative embodiment provides a non-preloaded snap connector suitable for performing general assembly of microcomponents. Still a further alternative embodiment provides a "squeeze" snap connector that is suitable for performing general assembly of microcomponents. Such snap connectors may be implemented as an integrated part of a microcomponent, or they may be implemented as separate, stand-alone snap connectors. For example, a dual-ended snap connector is disclosed herein, which may be coupled to a first microcomponent, and then used to couple the first microcomponent to a second microcomponent.

    Abstract translation: 公开了一种提供适用于耦合微型部件的通用卡扣连接器的系统和方法。 公开了一种卡扣连接器，其适于执行大体组装，包括微部件的平面外3-D组装，其中这种微部件可以牢固地耦合在一起。 也就是说，公开了一种卡扣式连接器，其能够以限制所耦合的部件相对于彼此的不希望的运动的方式来耦合微型部件。 优选地，这种卡扣连接器可以以约束配合部件相对于卡扣连接器的平移和旋转自由度的方式与配合部件的插座（或孔）压配合。 优选实施例提供了可用于执行微型部件的通用组装的“预加载”卡扣连接器。 一个替代实施例提供了一种适用于执行微部件的通用组装的非预加载卡扣连接器。 又一替代实施例提供了适用于执行微部件的通用组装的“挤压”卡扣连接器。 这种卡扣连接器可以被实现为微型部件的集成部分，或者它们可以被实现为单独的独立卡扣连接器。 例如，本文公开了双端搭扣连接器，其可以连接到第一微部件，然后用于将第一微部件连接到第二微部件。

    DUAL POSITION LINEAR DISPLACEMENT MICROMECHANISM
    76.
    发明申请
    DUAL POSITION LINEAR DISPLACEMENT MICROMECHANISM 审中-公开
    双位置线性位移微生物学

    公开(公告)号：WO02023606A1

    公开(公告)日：2002-03-21

    申请号：PCT/US2001/028614

    申请日：2001-09-12

    IPC: B81B3/00 ,  G02B6/35 ,  H01H1/00 ,  H01L21/306 ,  H01H3/00

    CPC classification number: B81B3/0008 ,  B81B3/0054 ,  B81B2201/031 ,  B81B2201/13 ,  B81B2203/051 ,  G02B6/3552 ,  G02B6/358 ,  H01H1/0036 ,  H01H2001/0042

    Abstract: An apparatus (1) that is capable of a first stable configuration and a second stable configuration is disclosed. The bistable mechanism (10) has a leg (30, 32) that is coupled on one end by a base member (22, 24) and on the other end by a shuttle (20). The leg (30, 32) stores potential energy as it is deflected. The potential energy stored in the leg (30, 32) has a maximum potential energy position with a low potential energy position on either side of the maximum. An apparatus and method are also disclosed for a latching mechanism (910) and the associated method. The latching mechanism (910) is comprised of a grasping member (932), a lock slider (928), and a detent slider (916). These three members (916, 928, 932) operate together to induce a locked configuration and an unlocked configuration by actuating the lock slider (928) in a single direction.

    Abstract translation: 公开了能够实现第一稳定配置和第二稳定配置的设备（1）。 双稳态机构（10）具有腿部（30,32），其一端由基部构件（22,24）联接，另一端由梭子（20）联接。 腿部（30,32）在其偏转时存储势能。 存储在腿部（30,32）中的势能具有在最大值两侧具有低势能位置的最大势能位置。 还公开了一种用于锁定机构（910）和相关方法的装置和方法。 锁定机构（910）包括把持件（932），锁定滑块（928）和制动滑块（916）。 这三个构件（916,928,932）通过一致地驱动锁定滑块（928）而一起操作以引起锁定构型和解锁构造。

    SYSTEM AND METHOD FOR COUPLING MICROCOMPONENTS
    77.
    发明申请
    SYSTEM AND METHOD FOR COUPLING MICROCOMPONENTS 审中-公开
    用于耦合微型计算机的系统和方法

    公开(公告)号：WO0185599A2

    公开(公告)日：2001-11-15

    申请号：PCT/US0115059

    申请日：2001-05-10

    Applicant: ZYVEX CORP

    Inventor： ELLIS MATTHEW D ,  SKIDMORE GEORGE D

    IPC: B81B7/00 ,  F16B2/20

    CPC classification number: B81C3/008 ,  B81B2201/13 ,  F16B2/20 ,  Y10T24/45581 ,  Y10T403/602

    Abstract: A system and method which provide a general-purpose snap connector suitable for coupling microcomponents are disclosed. A snap connector is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a snap connector is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a snap connector may be pressure fit with a receptacle (or aperture) of a mating component in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the snap connector. A preferred embodiment provides a "preloaded" snap connector that may be utilized to perform general assembly of microcomponents. An alternative embodiment provides a non-preloaded snap connector suitable for performing general assembly of microcomponents. Still a further alternative embodiment provides a "squeeze" snap connector that is suitable for performing general assembly of microcomponents. Such snap connectors may be implemented as an integrated part of a microcomponent, or they may be implemented as separate, stand-alone snap connectors. For example, a dual-ended snap connector is disclosed herein, which may be coupled to a first microcomponent, and then used to couple the first microcomponent to a second microcomponent.

    Abstract translation: 公开了一种提供适用于连接微型部件的通用卡扣连接器的系统和方法。 公开了一种适于执行总体组装的卡扣式连接器，包括微型部件的平面外的3-D组装，其中这种微型部件可以牢固地联接在一起。 也就是说，公开了一种卡扣连接器，其使得能够以限制耦合部件相对于彼此的不期望的运动的方式耦合微部件。 优选地，这种卡扣连接器可以以限制配合部件相对于卡扣连接器的平移和旋转自由度的方式与配合部件的插座（或孔）压配合。 一个优选实施例提供了一种“预加载”卡扣连接器，其可用于执行微型部件的总体组装。 替代实施例提供了适用于执行微型部件的总体组装的非预加载卡扣连接器。 另一替代实施例提供了适用于执行微型部件的总体组装的“挤压”卡扣连接器。 这种快速连接器可以被实现为微型部件的集成部件，或者它们可以被实现为单独的独立卡扣连接器。 例如，本文公开了双端卡扣连接器，其可以耦合到第一微型部件，然后用于将第一微型部件耦合到第二微型部件。

    마이크로어셈블리 소켓
    80.
    发明授权
    마이크로어셈블리 소켓 失效
    微型插件

    公开(公告)号：KR101008797B1

    公开(公告)日：2011-01-14

    申请号：KR1020060021634

    申请日：2006-03-08

    Applicant: 지벡스 랩스, 엘엘씨

    Inventor： 츠이케네스 ,  게이스베르거아론

    IPC: B81B7/02 ,  B81B7/00

    CPC classification number: B81C3/008 ,  B81B2201/13 ,  B81C99/002

    Abstract: 본 발명은 마이크로어셈블리 소켓에 관한 것으로서, 장치는 컴포넌트와 조립체를 형성하는 동안 편향되며, 컴포넌트와 조립된 후 컴포넌트와의 접촉을 유지하도록 각각 구성된 적어도 3개의 편향가능한 부재를 포함하며, 상기 편향가능한 부재와 컴포넌트 중의 적어도 하나는 1000 미크론 이하의 두께를 갖는 것을 특징으로 한다.

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