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    SYSTEM AND METHOD FOR COUPLING MICROCOMPONENTS
    1.
    发明申请
    SYSTEM AND METHOD FOR COUPLING MICROCOMPONENTS 审中-公开
    用于耦合微单元的系统和方法

    公开(公告)号：WO0185599B1

    公开(公告)日：2002-07-04

    申请号：PCT/US0115059

    申请日：2001-05-10

    Applicant: ZYVEX CORP

    Inventor： ELLIS MATTHEW D ,  SKIDMORE GEORGE D

    IPC: B81B7/00 ,  F16B2/20

    CPC classification number: B81C3/008 ,  B81B2201/13 ,  F16B2/20 ,  Y10T24/45581 ,  Y10T403/602

    Abstract: A system and method which provide a general-purpose snap connector suitable for coupling microcomponents are disclosed. A snap connector is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a snap connector is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a snap connector may be pressure fit with a receptacle (or aperture) of a mating component in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the snap connector. A preferred embodiment provides a "preloaded" snap connector that may be utilized to perform general assembly of microcomponents. An alternative embodiment provides a non-preloaded snap connector suitable for performing general assembly of microcomponents. Still a further alternative embodiment provides a "squeeze" snap connector that is suitable for performing general assembly of microcomponents. Such snap connectors may be implemented as an integrated part of a microcomponent, or they may be implemented as separate, stand-alone snap connectors. For example, a dual-ended snap connector is disclosed herein, which may be coupled to a first microcomponent, and then used to couple the first microcomponent to a second microcomponent.

    Abstract translation: 公开了一种提供适用于耦合微型部件的通用卡扣连接器的系统和方法。 公开了一种卡扣连接器，其适于执行大体组装，包括微部件的平面外3-D组装，其中这种微部件可以牢固地耦合在一起。 也就是说，公开了一种卡扣式连接器，其能够以限制所耦合的部件相对于彼此的不希望的运动的方式来耦合微型部件。 优选地，这种卡扣连接器可以以约束配合部件相对于卡扣连接器的平移和旋转自由度的方式与配合部件的插座（或孔）压配合。 优选实施例提供了可用于执行微型部件的通用组装的“预加载”卡扣连接器。 一个替代实施例提供了一种适用于执行微部件的通用组装的非预加载卡扣连接器。 又一替代实施例提供了适用于执行微部件的通用组装的“挤压”卡扣连接器。 这种卡扣连接器可以被实现为微型部件的集成部分，或者它们可以被实现为单独的独立卡扣连接器。 例如，本文公开了双端搭扣连接器，其可以连接到第一微部件，然后用于将第一微部件连接到第二微部件。

    SYSTEM AND METHOD FOR COUPLING MICROCOMPONENTS
    2.
    发明申请
    SYSTEM AND METHOD FOR COUPLING MICROCOMPONENTS 审中-公开
    用于耦合微型计算机的系统和方法

    公开(公告)号：WO0185599A2

    公开(公告)日：2001-11-15

    申请号：PCT/US0115059

    申请日：2001-05-10

    Applicant: ZYVEX CORP

    Inventor： ELLIS MATTHEW D ,  SKIDMORE GEORGE D

    IPC: B81B7/00 ,  F16B2/20

    CPC classification number: B81C3/008 ,  B81B2201/13 ,  F16B2/20 ,  Y10T24/45581 ,  Y10T403/602

    Abstract: A system and method which provide a general-purpose snap connector suitable for coupling microcomponents are disclosed. A snap connector is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a snap connector is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a snap connector may be pressure fit with a receptacle (or aperture) of a mating component in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the snap connector. A preferred embodiment provides a "preloaded" snap connector that may be utilized to perform general assembly of microcomponents. An alternative embodiment provides a non-preloaded snap connector suitable for performing general assembly of microcomponents. Still a further alternative embodiment provides a "squeeze" snap connector that is suitable for performing general assembly of microcomponents. Such snap connectors may be implemented as an integrated part of a microcomponent, or they may be implemented as separate, stand-alone snap connectors. For example, a dual-ended snap connector is disclosed herein, which may be coupled to a first microcomponent, and then used to couple the first microcomponent to a second microcomponent.

    Abstract translation: 公开了一种提供适用于连接微型部件的通用卡扣连接器的系统和方法。 公开了一种适于执行总体组装的卡扣式连接器，包括微型部件的平面外的3-D组装，其中这种微型部件可以牢固地联接在一起。 也就是说，公开了一种卡扣连接器，其使得能够以限制耦合部件相对于彼此的不期望的运动的方式耦合微部件。 优选地，这种卡扣连接器可以以限制配合部件相对于卡扣连接器的平移和旋转自由度的方式与配合部件的插座（或孔）压配合。 一个优选实施例提供了一种“预加载”卡扣连接器，其可用于执行微型部件的总体组装。 替代实施例提供了适用于执行微型部件的总体组装的非预加载卡扣连接器。 另一替代实施例提供了适用于执行微型部件的总体组装的“挤压”卡扣连接器。 这种快速连接器可以被实现为微型部件的集成部件，或者它们可以被实现为单独的独立卡扣连接器。 例如，本文公开了双端卡扣连接器，其可以耦合到第一微型部件，然后用于将第一微型部件耦合到第二微型部件。

    SYSTEM AND METHOD FOR CONSTRAINING TOTALLY RELEASED MICROCOMPONENTS
    3.
    发明申请
    SYSTEM AND METHOD FOR CONSTRAINING TOTALLY RELEASED MICROCOMPONENTS 审中-公开
    用于限制完全释放的微组分的系统和方法

    公开(公告)号：WO0206152B1

    公开(公告)日：2002-08-08

    申请号：PCT/US0121899

    申请日：2001-07-12

    Applicant: ZYVEX CORP

    Inventor： ELLIS MATTHEW D ,  PARKER ERIC G ,  SKIDMORE GEORGE D

    IPC: B81B3/00 ,  B81B7/00

    CPC classification number: B81B3/0051 ,  B81B2203/053 ,  B81B2203/055

    Abstract: A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent. To further aid in post-fabrication handling of totally released microcomponents, a preferred embodiment may be implemented as a "pallet" having one or more microcomponents constrained thereto. Moreover, constraining members of a preferred embodiment enable the totally released microcomponent to be removed from such constraints when desired, but prevents the totally released microcomponent from inadvertently escaping such constraints.

    Abstract translation: 公开了一种系统和方法，其限制从基板完全释放的用于处理这种完全释放的微型部件的微型部件。 一个优选的实施例提供了约束构件，该约束构件用于将微部件约束到基底，因为这种微部件完全从这种基底释放。 因此，在制造期间，在这种微部件从其基板释放期间，这种约束部件可以帮助保持微部件与其基板。 此外，优选实施例提供了适合于将完全释放的微部件约束到基部以便微加工部件的制造后处理的约束构件。 为了进一步辅助完全释放的微部件的制造后处理，优选实施例可以实施为具有一个或多个受其限制的微部件的“托盘”。 此外，优选实施例的约束元件能够在需要时将完全释放的微元件从这种约束中移除，但是防止完全释放的微元件无意中逃离这种约束。

    RIBBON CABLE AND ELECTRICAL CONNECTOR FOR USE WITH MICROCOMPONENTS
    4.
    发明申请
    RIBBON CABLE AND ELECTRICAL CONNECTOR FOR USE WITH MICROCOMPONENTS 审中-公开
    RIBBON电缆和电气连接器与微型计算机一起使用

    公开(公告)号：WO0186662A3

    公开(公告)日：2002-03-28

    申请号：PCT/US0115032

    申请日：2001-05-10

    Applicant: ZYVEX CORP

    Inventor： ELLIS MATTHEW D ,  SKIDMORE GEORGE D

    IPC: H01B7/00 ,  H01R12/00

    CPC classification number: H01R12/91 ,  H01R12/79 ,  Y10S439/953

    Abstract: A system, apparatus, and method which enable microcomponents to be electrically coupled in a desired manner are disclosed. More specifically, electrical coupling mechanisms are disclosed, which are suitable for providing an electrical coupling between two or more microcomponents. One electrical coupling mechanism provided herein, which may be utilized to provide a flexible coupling between two or more microcomponents, is a ribbon cable. Such a ribbon cable may include one or more electrically isolated conducting "rows", which may enable communication of electrical signals between two or more microcomponents coupled to such ribbon cable. An electrical connector, such as an electrical snap connector, is also provided herein, which is suitable for electrically coupling two or more microcomponents. Such an electrical connector may be utilized to couple a ribbon cable to a microcomponent or it may be utilized to directly couple two microcomponents in a manner that enables electrical communication therebetween. Furthermore, a "Z clamp" electrical connector is provided which allows for an engageable/disengageable electrical connection to be achieved between two or more microcomponents.

    Abstract translation: 公开了一种允许微组件以期望的方式电耦合的系统，装置和方法。 更具体地，公开了电耦合机构，其适于提供两个或更多个微组件之间的电耦合。 本文提供的一种电耦合机构可用于提供两个或多个微组件之间的柔性耦合，其为带状电缆。 这种带状电缆可以包括一个或多个电隔离的导电“行”，其可以实现耦合到这种带状电缆的两个或更多个微组件之间的电信号的通信。 此处还提供了电连接器，例如电扣接头，其适用于电耦合两个或多个微元件。 这种电连接器可以用于将带状电缆耦合到微组件，或者可以用于以能够在其间进行电连通的方式直接耦合两个微组件。 此外，提供了一种“Z夹紧”电连接器，其允许在两个或更多个微型部件之间实现可接合/可分离的电连接。

    SYSTEM AND METHOD FOR CONSTRAINING TOTALLY RELEASED MICROCOMPONENTS
    6.
    发明申请
    SYSTEM AND METHOD FOR CONSTRAINING TOTALLY RELEASED MICROCOMPONENTS 审中-公开
    用于约束全面释放的微型计算机的系统和方法

    公开(公告)号：WO0206152A3

    公开(公告)日：2002-07-11

    申请号：PCT/US0121899

    申请日：2001-07-12

    Applicant: ZYVEX CORP

    Inventor： ELLIS MATTHEW D ,  PARKER ERIC G ,  SKIDMORE GEORGE D

    IPC: B81B3/00 ,  B81B7/00

    CPC classification number: B81B3/0051 ,  B81B2203/053 ,  B81B2203/055

    Abstract: A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent. To further aid in post-fabrication handling of totally released microcomponents, a preferred embodiment may be implemented as a "pallet" having one or more microcomponents constrained thereto. Moreover, constraining members of a preferred embodiment enable the totally released microcomponent to be removed from such constraints when desired, but prevents the totally released microcomponent from inadvertently escaping such constraints.

    Abstract translation: 公开了限制从基板完全释放以处理这种完全释放的微型部件的微组件的系统和方法。 优选的实施方案提供了限制构件，其用于将微组件约束至基底，因为这样的微量组分完全从这种基底释放。 因此，这样的约束构件可以在制造期间从其衬底释放这种微组件期间有助于保护微组件与其衬底。 此外，优选实施例提供了约束构件，其适用于将完全释放的微组件约束到基座以用于微组件的后制造处理。 为了进一步帮助完全释放的微型部件的后制造处理，优选实施例可以被实现为具有一个或多个微部件约束的“托盘”。 此外，优选实施例的约束构件使得当需要时可以从完全释放的微组件从这种约束中移除，但是防止完全释放的微元件不经意地逃避这样的约束。

    7.
    发明专利
    未知

    公开(公告)号：AT344784T

    公开(公告)日：2006-11-15

    申请号：AT01951048

    申请日：2001-07-12

    Applicant: ZYVEX CORP

    Inventor： ELLIS MATTHEW D ,  PARKER ERIC G ,  SKIDMORE GEORGE D

    IPC: B81B3/00 ,  B81B7/00

    Abstract: A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides a system and method which constrain a totally released microcomponent to a base (e.g., another microcomponent or a substrate). For example, a preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent. To further aid in post-fabrication handling of totally released microcomponents, a preferred embodiment may be implemented as a "pallet" having one or more microcomponents constrained thereto. Moreover, constraining members of a preferred embodiment enable the totally released microcomponent to be removed from such constraints when desired, but prevents the totally released microcomponent from inadvertently escaping such constraints. For instance, in one embodiment, the constraining members are implemented as moveable members that can be moved to unconstrain the totally released microcomponent from its base.

    Ribbon cable and electrical connector for use with microcomponents
    9.
    发明专利
    Ribbon cable and electrical connector for use with microcomponents 未知

    公开(公告)号：AU6133901A

    公开(公告)日：2001-11-20

    申请号：AU6133901

    申请日：2001-05-10

    Applicant: ZYVEX CORP

    Inventor： ELLIS MATTHEW D ,  SKIDMORE GEORGE D

    IPC: H01B7/00 ,  H01R12/00

    Abstract: A system, apparatus, and method which enable microcomponents to be electrically coupled in a desirable manner are disclosed. More specifically, electrical coupling mechanisms are disclosed, which are suitable for providing an electrical coupling between two or more microcomponents. One electrical coupling mechanism provided herein, which may be utilized to provide a flexible coupling between two or more microcomponents, is a ribbon cable. Such a ribbon cable may include one or more electrically isolated conducting "rows," which may enable communication of electrical signals between two or more microcomponents coupled to such ribbon cable. An electrical connector, such as an electrical snap connector, is also provided herein, which is suitable for electrically coupling two or more microcomponents. Such an electrical connector may be utilized to couple a ribbon cable to a microcomponent or it may be utilized to directly couple two microcomponents in a manner that enables electrical communication therebetween. Furthermore, a "Z clamp" electrical connector is provided which allows for an engageable/disengageable electrical connection to be achieved between two or more microcomponents.

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