Abstract:
PROBLEM TO BE SOLVED: To enhance flame retardancy without deteriorating the heat resistance and high temperature reliability of a molded resin article.SOLUTION: A resin composition comprising a phosphazene ring-having unsaturated carboxylate compound represented by formula (1) [wherein (n) is an integer of 1 to 6, at least one of groups A is an unsaturated carbonyloxy-2-hydroxypropoxy group-containing aryloxy group, and the others are each 1 to 8C alkoxy or a 6 to 20C aryloxy] and a resin component is produced, and then molded.
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition which is a photosensitive resin composition containing an additive-type flame retardant and does not cause problems (such as bleed out) owing to phase separation between a resin matrix and the flame retardant when used commonly as a material for printed boards. SOLUTION: The resin composition for electronic materials contains (A) the phenoxy phosphazene flame retardant and (B) a compound having a photopolymerizable unsaturated double bond. The melting point of (A) the phenoxy phosphazene flame retardant is ≤100°C and the average number of functional groups each having an unsaturated bond per one molecule of the phenoxy phosphazene flame retardant is ≤0.1. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a hydroxy group-containing phosphazene compound which can enhance the flame retardance of resin molded products and hardly deteriorates the mechanical characteristics and reliability of the resin molded products at high temperature. SOLUTION: Provided is the hydroxy group-containing cyclic phosphazene compound represented by formula (1), wherein, (n) is an integer of 3 to 8; A is a group selected from the group consisting of the following A1 group, A2 group, and A3 group, and at least one of 2n A groups is the A3 group. A1 group: a 1-8C alkoxy group which may be substituted with a 1-6C alkyl group or the like. A2 group: a 6-20C aryloxy group which may be substituted with a 1-6C alkyl group or the like. A3 group: at least one selected from the group consisting of 2-methyl-4-hydroxy-phenyloxy group, 3-methyl-4-hydroxy-phenyloxy group and 4-hydroxy-3,5-dimethyl-phenyloxy group. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a resin producing a highly flame retardant resin molded product by using a phosphazene flame retarder without deteriorating heat resistance and high-temperature reliability. SOLUTION: A resin component contains a cyclic aryloxy phosphazene compound. The cyclic aryloxy phosphazene compound has an aryloxy group, which has a substituent having a Hammett substituent constant of 3.0 or more and no active hydrogen, and is represented by a specific formula. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a phosphazene compound effectively improving the flame retardancy of a molded resin article without deteriorating the mechanical properties of the article, keeping the high-temperature reliability of the molded resin article and having high adhesiveness. SOLUTION: The phosphazene compound is expressed by formula (1) (in the formula, n is an integer of 3-15; and A is a specific substituted phenyloxy group having allyl group and hydroxy group). COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To obtain a phosphazene compound which effectively increases the flame retardance of a resin molding without impairing its mechanical properties and hardly impairs the high-temperature reliability of resin molding. SOLUTION: The phosphazene compound is represented by formula (1) [n is an integer of 3-15; one example of A is a substituted phenyloxy group represented by formula (2)]. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To obtain a phosphazene compound which effectively increases the flame retardancy of a resin molding without impairing its mechanical properties and hardly impairs the high-temperature reliability of resin molding. SOLUTION: The phosphazene compound is represented by formula (1) [n is an integer of 3-15; one example of A is a hydroxyphenyl-substituted phenyloxy group represented by formula (2)]. COPYRIGHT: (C)2007,JPO&INPIT