Abstract:
A tunable component such as a tunable BST (Barium Strontium Titanate) capacitor is added inside the antenna structure, and the input impedance of the antenna is tuned by tuning this tunable component, rather than adding a multiple-component impedance matching network at the feed point of the antenna outside the antenna as in conventional solutions. With this structure, the input impedance of the antenna may be adjusted very precisely and efficiently.
Abstract:
A system and method for resolving an identity includes a security console , which displays security information regarding a secure network. The security information includes at least a first identity used to access the secure network. An operator selects the first identity, and the security console sends it to a resolver. The resolver connects with an identity server to find an access session record with an identity matching the first identity. A second identity is extracted from this record, and the resolver returns a result that includes the second identity. The security console displays the second identity. The first identity can be a user identity of a user, where the second identity is corresponding host identity, or vise versa. In this manner, an efficient interface to security information is provided to an operator, where the operator may resolve a user/host identity to a host/user identity interactively.
Abstract:
The inventive system includes a host, a network including a security gateway, and a public application. Established are an access session between the network and the host and an application session between the public application and the network. An application session record is created for the application session, and includes the user's public user identity used to access the public application, the user's private user identity used to access the network, a host identity, and an application session time. To determine the private user identity for the application session, the security gateway sends a query with the host identity and the application session time. These are compared with the host identity and access session time in an access session record. If they match, then the private user identity in the access session record is returned, and it is stored as the private user identity in the application session record.
Abstract:
A system and method for a distributed multi-processing security gateway establishes a host side session, selects a proxy network address for a server based on network information, and using the proxy network address to establish a server side session. The proxy network address is selected such that a same processing element is assigned to process data packets from the server side session and the host side session. The network information includes a security gateway network address and a host network address. By assigning processing elements in this manner, higher capable security gateways are provided.
Abstract:
A system and method for a distributed multi-processing security gateway establishes a host side session, selects a proxy network address for a server based on network information, and using the proxy network address to establish a server side session. The proxy network address is selected such that a same processing element is assigned to process data packets from the server side session and the host side session. The network information includes a security gateway network address and a host network address. By assigning processing elements in this manner, higher capable security gateways are provided.
Abstract:
Method and system for pumping a hyperthermal neutral beam source (205) is described. The pumping system (230) enables use of the hyperthermal neutral beam source (205) for semiconductor processing applications, such as etching processes. An embodiment is described having a neutral beam source (205) coupled to a processing chamber (210) through a neutralizing grid (248). Control is provided by separately pumping the neutral beam source (205) and the processing chamber (210).
Abstract:
Method and system for pumping a hyperthermal neutral beam source (205) is described. The pumping system (230) enables use of the hyperthermal neutral beam source (205) for semiconductor processing applications, such as etching processes. An embodiment is described having a neutral beam source (205) coupled to a processing chamber (210) through a neutralizing grid (248). Control is provided by separately pumping the neutral beam source (205) and the processing chamber (210).
Abstract:
A method and processing tool are provided for controlling trimming of a gate electrode structure containing a gate electrode layer with a first dimension by determining the first dimension of the gate electrode structure, choosing a target trimmed dimension, feeding forward the first dimension and the target trimmed dimension to a process model to create a set of process parameters, performing a trimming process on the gate electrode structure, including controlling the set of process parameter, trimming the gate electrode structure, and measuring a trimmed dimension of the gate electrode structure. The trimming process may be repeated at least once until the target trimmed dimension is obtained, where the trimmed dimension may be fed backward to the process model to create a new set of process parameters.
Abstract:
A method for heating a substrate between a first process and a second process using a plasma is described. The heating method comprises thermally isolating the substrate on the substrate holder by removing the backside supply of a heat transfer gas and removing the clamping force. Furthermore, an inert gas, such as a Noble gas, is introduced to the plasma processing system and a plasma is ignited. The substrate is exposed to the inert plasma for a period of time sufficient to elevate the temperature of the substrate from a first temperature (i.e., typically less than 100 C) to a second temperature (i.e., typically of order 400 C).
Abstract:
An apparatus and method are described for etching Ni−containing films using gas phase plasma etching. Etching of Ti−Ni alloys is carried out by exposure to plasma comprising hydrogen halide (HX) and carbonyl etching gases. The Ti in the Ti−Ni alloy is etched via an ion−assisted reaction with HX and the Ni is etched by reacting with CO. The method is particularly well suited for anisotropic etching of Ti− Ni metal gates for CMOS applications. Etching of Ni−Fe layers is carried out by exposure to plasma comprising a carbonyl etching gas.