Abstract:
PROBLEM TO BE SOLVED: To provide a prove finger structure which can be used for the various testing structures, and to provide a manufacturing method for the probe finger structure. SOLUTION: The manufacturing method of the probe finger structure comprises a preparation step, consisting of an upper layer, an under layer and a wafer or a wafer part having an insulation or an etching stop layer which is located between the upper layer and the under layer. The method includes a step which performs underlayer etching for forming a mounting part and further a step which performs an upper layer etching for forming the plural prove fingers. Furthermore, a step in which a conductive material is mounted in each probe finger is included. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
An angle of attack sensor includes a housing having an open end and a closed end. A faceplate is positioned on the open end of the housing. The faceplate comprises an integral bearing support cage that extends into the housing and is configured to accept a first bearing and a second bearing, a periphery at an outer edge of the faceplate, a central opening, and an exterior surface extending from the periphery to the central opening. A vane assembly extends through the central opening of the faceplate. A vane shaft extends into the housing and is connected to the vane assembly, and a rotational position sensor is connected to the vane shaft.
Abstract:
An angle of attack sensor includes a housing having an open end and a closed end, a faceplate positioned on the open end of the housing, the faceplate comprising a periphery at an outer edge of the faceplate, a central opening, and an exterior surface extending from the periphery to the central opening, and a vane assembly extending through the central opening of the faceplate. The exterior surface of the faceplate has a sloped profile from the periphery to the central opening.
Abstract:
An angle of attack sensor includes a housing and a faceplate. A vane assembly extends through a central opening of the faceplate and includes a vane. The vane comprises a root, a tip, a leading edge, a trailing edge, a first lateral face, and a second lateral face. The first lateral face and the second lateral face are symmetric about a chord of the vane and each have a forward section with an outer surface profile that is nonlinear and geometrically convex from the leading edge to a transition point at a tangent to the widest point of the geometrically convex outer surface profile and each have an aft section with an outer surface profile that extends out to form a diverging wedge shape from the transition point to the trailing edge.
Abstract:
The invention provides a sensor (100, 200) for determining when a latch (104) for securing an engine cowl (102) on an aircraft is secured by detecting the proximity of a latch hook (106) and a latch pin (108). The sensor includes a resonant circuit configured and adapted to transmit a status signal when the latch is in, a secured state. The sensor also includes a means for conveying status information of the latch to a location remote from the latch based on the status signal, the conveying means being operably connected to the resonant circuit. The invention also provides a method of determining when a latch is open or secured by detecting the proximity of a latch hook and a latch pin.
Abstract:
A total air temperature sensor includes a probe secured to a first side of a vehicle surface. The probe includes an air inlet and a temperature sensing element. Air flows into the air inlet and passes by the temperature sensing element. The temperature sensing element produces a temperature sensing element electrical signal as a function of a temperature of the air. The total air temperature sensor also includes an electronics package secured to a second side of the vehicle surface. Electronics in the electronics package receive the temperature sensing element electrical signal from the temperature sensing element and determine a total air temperature as a function of the temperature sensing element electrical signal.
Abstract:
A harsh environment transducer including: - a substrate (14) having a first surface and a second surface, the latter being exposed to the environment - a device layer sensor means (12) on the substrate (14) for measuring a parameter associated with the environment, including a single crystal semiconductor material having a thickness of less than about 0.5 microns - an output (50) contact on the substrate (14) and in electrical communication with the sensor means (12) - a package having an internal space communicating with the environment and receiving the substrate (14) such that its first surface is substantially isolated from the environment and its second surface is substantially exposed to the environment - a connecting component (22) coupled to the package - a wire (24) electrically connecting the connecting component (22) and the output contact (50) such that an output of the sensor means can be communicated. The external surface of the wire (24) and at least one of the output contact (50) and the connecting component (22) is substantially platinum.
Abstract:
An aircraft device power supply is capable of connecting to either an AC or a DC power bus provided on an aircraft. When connected to an aircraft's AC power bus, an AC power signal is EMI-filtered, stepped down in voltage to the same voltage as that of the DC power bus, and then rectified. When connected to an aircraft's DC power bus, a DC power signal is EMI-filtered before it is merged with the rectified AC power signal via an AC/DC switchover subcircuit. The output of the AC/DC switchover subcircuit is input to a power factor correction subcircuit which outputs a boosted DC voltage, regardless of which of the AC or DC aircraft power buses is connected to the power supply. A step down converter reduces the boosted DC voltage to a lower, system voltage which may then be further reduced or modified, as appropriate for device to be powered.
Abstract:
An aircraft device power supply is capable of connecting to either an AC or a DC power bus provided on an aircraft. When connected to an aircraft's AC power bus, an AC power signal is EMI-filtered, stepped down in voltage to the same voltage as that of the DC power bus, and then rectified. When connected to an aircraft's DC power bus, a DC power signal is EMI-filtered before it is merged with the rectified AC power signal via an AC/DC switchover subcircuit. The output of the AC/DC switchover subcircuit is input to a power factor correction subcircuit which outputs a boosted DC voltage, regardless of which of the AC or DC aircraft power buses is connected to the power supply. A step down converter reduces the boosted DC voltage to a lower, system voltage which may then be further reduced or modified, as appropriate for device to be powered.
Abstract translation:飞机设备电源能够连接到飞机上提供的AC或DC电源总线。 当连接到飞机的交流电源总线时,对交流电源信号进行EMI滤波,降压至与直流电源总线相同的电压,然后进行整流。 当连接到飞机的直流电源总线时,直流电源信号经过AC / DC切换子电路与整流的交流电源信号合并之前被EMI滤波。 AC / DC切换子电路的输出被输入到输出升压的DC电压的功率因数校正子电路,而不管AC或DC飞行器电源总线中哪一个连接到电源。 降压转换器将升压的直流电压降低到较低的系统电压,然后可以进一步减小或修改,以适用于要供电的设备。
Abstract:
A wireless tire pressure sensing system for an aircraft comprises: dual resonant circuits mounted to a wheel of the aircraft, each resonant circuit comprising: a variable capacitance sensor (16) and a wire loop (12) of a predetermined inductance coupled thereto, one capacitance sensor for monitoring the pressure of a tire mounted to the wheel, and the other capacitance sensor operative as a reference to the one capacitance sensor; an interrogating circuit (18) magnetically coupleable to the dual resonant circuits and operative to induce magnetically a variable frequency current in the dual resonant circuits, the one resonant circuit responding to the induced current with an E-field signal at a first resonant frequency commensurate with the capacitance of the one sensor, and the other resonant circuit responding to the induced current with an E-field signal at a second resonant frequency commensurate with the capacitance of the other sensor; a receiving circuit (20) E-field coupleable to the dual resonant circuits and operative to receive the E-field signals at the first and second resonant frequencies and to generate first and second signals representative thereof; and a processing circuit coupled to the receiving circuit for processing the first and second signals to generate a compensated pressure reading of the tire. The pressure sensing system may be modified to provide and/or include wheel speed sensing.