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    PENDULOUS ACCELEROMETER WITH BALANCED GAS DAMPING
    1.
    发明专利
    PENDULOUS ACCELEROMETER WITH BALANCED GAS DAMPING 未知

    公开(公告)号：IL194864A

    公开(公告)日：2012-10-31

    申请号：IL19486408

    申请日：2008-10-23

    Applicant: ROSEMOUNT AEROSPACE INC ,  GUO SHUWEN

    Inventor： GUO SHUWEN

    Abstract: A pendulous capacitive accelerometer including a substrate having a substantially planar upper surface with an electrode section, and a sensing plate having a central anchor portion supported on the upper surface of the substrate to define a hinge axis. The sensing plate includes a solid proof mass on a first side of the central anchor portion and a substantially hollow proof mass on a second side of the central anchor portion, providing for reduced overall chip size and balanced gas damping. The solid proof mass has a first lower surface with a first electrode element thereon, and the substantially hollow proof mass has a second lower surface with a second electrode element thereon. Both the solid proof mass and the hollow proof mass have the same capacitive sensing area. The sensing plate rotates about the hinge axis relative to the upper surface of the substrate in response to an acceleration.

    PENDULOUS ACCELEROMETER WITH BALANCED GAS DAMPING
    2.
    发明专利
    PENDULOUS ACCELEROMETER WITH BALANCED GAS DAMPING 未知

    公开(公告)号：IL194864D0

    公开(公告)日：2009-08-03

    申请号：IL19486408

    申请日：2008-10-23

    Applicant: ROSEMOUNT AEROSPACE INC ,  GUO SHUWEN

    IPC: G01P20100101

    Abstract: A pendulous capacitive accelerometer including a substrate having a substantially planar upper surface with an electrode section, and a sensing plate having a central anchor portion supported on the upper surface of the substrate to define a hinge axis. The sensing plate includes a solid proof mass on a first side of the central anchor portion and a substantially hollow proof mass on a second side of the central anchor portion, providing for reduced overall chip size and balanced gas damping. The solid proof mass has a first lower surface with a first electrode element thereon, and the substantially hollow proof mass has a second lower surface with a second electrode element thereon. Both the solid proof mass and the hollow proof mass have the same capacitive sensing area. The sensing plate rotates about the hinge axis relative to the upper surface of the substrate in response to an acceleration.

    HIGH TEMPERATURE RESISTANT SOLID STATE PRESSURE SENSOR
    4.
    发明申请
    HIGH TEMPERATURE RESISTANT SOLID STATE PRESSURE SENSOR 审中-公开
    耐高温固体压力传感器

    公开(公告)号：WO2008036701A2

    公开(公告)日：2008-03-27

    申请号：PCT/US2007078831

    申请日：2007-09-19

    Applicant: ROSEMOUNT AEROSPACE INC ,  GUO SHUWEN ,  ERIKSEN ODD HARALD STEEN ,  POTASEK DAVID P

    Inventor： GUO SHUWEN ,  ERIKSEN ODD HARALD STEEN ,  POTASEK DAVID P

    CPC classification number: C23C14/021 ,  C23C14/022 ,  C23C14/025 ,  C23C14/0682 ,  C23C14/5806 ,  C23C14/5846 ,  C23C14/5873 ,  G01L9/0042 ,  G01L19/0061 ,  G01L19/0609 ,  G01L19/147 ,  H01L2224/48472

    Abstract: A harsh environment transducer including a substrate having a first surface and a second surface, wherein the second surface is in communication with the environment. The transducer includes a device layer sensor means located on the substrate for measuring a parameter associated with the environment. The sensor means including a single crystal semiconductor material having a thickness of less than about 0.5 microns. The transducer further includes an output contact located on the substrate and in electrical communication with the sensor means. The transducer includes a package having an internal package space and a port for communication with the environment. The package receives the substrate in the internal package space such that the first surface of the substrate is substantially isolated from the environment and the second surface of the substrate is substantially exposed to the environment through the port. The transducer further includes a connecting component coupled to the package and a wire electrically connecting the connecting component and the output contact such that an output of the sensor means can be communicated. An external surface of the wire is substantially platinum, and an external surface of at least one of the output contact and the connecting component is substantially platinum.

    Abstract translation: 一种恶劣环境换能器，包括具有第一表面和第二表面的基底，其中第二表面与环境连通。 换能器包括位于基板上的用于测量与环境有关的参数的装置层传感器装置。 传感器装置包括厚度小于约0.5微米的单晶半导体材料。 换能器还包括位于基板上并与传感器装置电连通的输出触点。 换能器包括具有内部封装空间和用于与环境通信的端口的封装。 该封装件在内部封装空间中容纳衬底，使得衬底的第一表面基本上与环境隔离，并且衬底的第二表面基本上通过端口暴露于环境中。 换能器还包括耦合到封装件的连接部件和将连接部件和输出触头电连接的导线，使得可以传送传感器装置的输出。 导线的外表面基本上是铂，并且输出触点和连接部件中的至少一个的外表面基本上是铂。

    HIGH TEMPERATURE RESISTANT SOLID STATE PRESSURE SENSOR
    5.
    发明申请
    HIGH TEMPERATURE RESISTANT SOLID STATE PRESSURE SENSOR 审中-公开

    公开(公告)号：WO2008036701A3

    公开(公告)日：2008-03-27

    申请号：PCT/US2007/078831

    申请日：2007-09-19

    Applicant: ROSEMOUNT AEROSPACE INC. ,  GUO, Shuwen ,  ERIKSEN, Odd Harald, Steen ,  POTASEK, David, P. ,  CHILDRESS, Kimiko J.

    Inventor： GUO, Shuwen ,  ERIKSEN, Odd Harald, Steen ,  POTASEK, David, P. ,  CHILDRESS, Kimiko J.

    IPC: G01L9/00

    Abstract: A harsh environment transducer including: - a substrate (14) having a first surface and a second surface, the latter being exposed to the environment - a device layer sensor means (12) on the substrate (14) for measuring a parameter associated with the environment, including a single crystal semiconductor material having a thickness of less than about 0.5 microns - an output (50) contact on the substrate (14) and in electrical communication with the sensor means (12) - a package having an internal space communicating with the environment and receiving the substrate (14) such that its first surface is substantially isolated from the environment and its second surface is substantially exposed to the environment - a connecting component (22) coupled to the package - a wire (24) electrically connecting the connecting component (22) and the output contact (50) such that an output of the sensor means can be communicated. The external surface of the wire (24) and at least one of the output contact (50) and the connecting component (22) is substantially platinum.

    TRANSDUCER FOR USE IN HARSH ENVIRONMENTS
    6.
    发明申请
    TRANSDUCER FOR USE IN HARSH ENVIRONMENTS 审中-公开

    公开(公告)号：WO2008036705A3

    公开(公告)日：2008-03-27

    申请号：PCT/US2007/078837

    申请日：2007-09-19

    Applicant: ROSEMOUNT AEROSPACE INC. ,  ERIKSEN, Odd Harald, Steen ,  CHILDRESS, Kimiko, J. ,  GUO, Shuwen

    Inventor： ERIKSEN, Odd Harald, Steen ,  CHILDRESS, Kimiko, J. ,  GUO, Shuwen

    IPC: G01L9/00

    Abstract: A pressure sensor (10) for use in a harsh environment including a substrate (14) and a sensor die (12) directly coupled to the substrate (14) by a bond frame (70) positioned between the substrate (14) and the sensor die (12). The sensor die (12) includes a generally flexible diaphragm (16) configured to flex when exposed to a sufficient differential pressure thereacross. The sensor (10) further includes a piezoelectric or piezoresistive sensing element (46) at least partially located on the diaphragm (16) such that the sensing element (46) provides an electrical signal upon flexure of the diaphragm (16). The sensor (10) also includes an connecting component (22) electrically coupled to the sensing element (46) at a connection location that is fluidly isolated from the diaphragm (16) by the bond frame (70). The bond frame (70) is made of materials and the connecting component (22) is electrically coupled to the sensing element (46) by the same materials of the bond frame (70).

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