Abstract:
본 발명은 반도체 소자의 제조 방법에 관한 것으로, 하전된 금속 입자를 전기력 또는 자기력을 이용해 이동시켜서 비아 홀을 충진하므로 비아 홀의 하부에서부터 위로 충진이 이루어져서 비아 홀의 내부에 공극이 발생하지 않거나 최소화되고, 종래 기술에 따른 구리 전기도금 방식과 비교하면 본 발명은 매우 빠른 시간 내에 크고 깊은 비아 홀을 금속 입자로 채울 수 있어서 실리콘 관통 비아(TSV)의 공정 가격 및 공정 시간을 단축시키며, 수지성분이 많이 포함되어 있는 메탈 페이스트를 사용하는 건식 충진 방식과 비교하면 본 발명은 하전된 금속 입자를 사용함으로서 더 밀한 TSV 금속 배선을 형성할 수 있는 이점이 있다. TSV(through silicon via), 비아 충진(via filling), 3차원 패키징(3D packaging), 금속 입자(metal particle)
Abstract:
PURPOSE: An organic thin film layer, a manufacturing method thereof, and an organic thin film transistor are provided to easily control the thickness of the organic thin film layer by forming a first film and a second film. CONSTITUTION: A first film is formed on a substrate(S11). A recess region is formed on the first film by using a pattern mold(S13). The first film is hardened(S15). The pattern mold is removed from the first film which is hardened(S17). A second film is formed on the first film(S21). The second film is planarized by using a blank mold(S23). The second film is hardened(S25). The blank mold is removed(S27). [Reference numerals] (S11) Form a first film on a substrate; (S13) Form recess regions on the first film by using a pattern mold; (S15) Harden the first film; (S17) Remove the pattern mold; (S21) Form a second film on the first film; (S23) Planarize the second film by using a blank mold; (S25) Harden the second film; (S27) Remove the blank mold
Abstract:
PURPOSE: An intaglio printing plate which includes an auxiliary pattern and a manufacturing method thereof are provided to improve accuracy of a pattern by uniformly filling ink on the edge of the pattern. CONSTITUTION: A pattern to be printed is located on a pattern part(100). A non-pattern part is arranged on a region which excludes the pattern part. An auxiliary pattern part(210) includes a repetition pattern of a predetermined shape formed within the pattern part. A part of the pattern part is divided by a pattern structure formed by the auxiliary pattern part. A cross sectional surface of a repetition pattern part has a mesh structure.
Abstract:
본 발명은 자기 정렬 전계 효과 트랜지스터 구조체에 관한 것이다. 본 발명의 실시예에 따른 자기 정렬 전계 효과 트랜지스터 구조체는 기판 상에 배치된 활성영역패턴, 활성영역패턴을 사이에 두고 서로 대향하는 제1 게이트 전극 및 제2 게이트 전극, 그리고 활성영역패턴에 연결되고 제1 및 제2 게이트 전극들을 연결하는 선에 대하여 대칭되게 배치된 소스 전극 및 드레인 전극을 포함하되, 제1 및 제2 게이트 전극들, 그리고 소스 및 드레인 전극들은 기판의 동일평면상에 배치된다. 트랜지스터, 반도체, 표시소자, 게이트 전극, 기생 캐패시턴스,
Abstract:
PURPOSE: An RFID(Radio Frequency ID) tag device equipped with a charge function is provided to recognize the RFID tag in a long distance and prevent the reducing of the recognition ratio due to the shortage of the electric power supply. CONSTITUTION: A charge unit(220) charges the specified voltage. The DC power supply unit (211) generates the power source from the RF signal. A block unit(214) connects/blocks the power source between the DC power supply and the power supply unit. An over voltage prevention part(215) is connected in the output terminal of the DC power supply and connected in parallel with the charge unit to prevent the over voltage of the charge unit. The power supply unit is connected to the output terminal of the DC power supply. The charge unit is charged with the power source generated from the DC power supply unit and the 'the external power source generated from the power supply unit.
Abstract:
PURPOSE: A method for forming a semiconductor device is provided to move charged metal particles by electric power or magnetic power to fill a via hole, thereby minimizing voids inside the via hole. CONSTITUTION: A via hole is formed in a semiconductor substrate(101). An insulating film is formed on the inner sidewall of the via hole. A diffusion preventing film(109) is formed on the semiconductor substrate and the inner sidewall of the via hole. Electrically charged metal particles are diffused in a solvent(111). The metal particles are moved using electric power or magnetic power so that the via hole is filled with metal particles(113,115).
Abstract:
본 발명은 전기분무법을 이용한 유기박막의 제조방법에 관한 것으로, 본 발명에 따른 유기박막의 제조방법은 증착하고자 하는 유기물질을 용매 중에 용해시켜 전기분무 용액을 준비하는 단계; 상기 전기분무 용액을 전압을 인가한 상태에서 전기분무의 노즐을 통해 분사시키는 단계; 및 전압에 의해 용매와 유기물질이 분리되고, 비행도중 용매는 증발되고, 유기물질은 기체상태의 이온으로 기판 상에 증착되는 단계를 포함한다. 본 발명에 따른 유기박막의 제조방법은 크기에 관계없이 대면적 유기박막이 제작될 수 있으며, 또한 패터닝도 가능하다. 전기분무, 유기박막, 패터닝
Abstract:
PURPOSE: An inorganic light emitting device and a manufacturing method thereof are provided to simplify the manufacturing process and reduce the manufacturing cost by implementing the inorganic light emitting device without using a transparent electrode which requires complex process and high expense. CONSTITUTION: A patterned metal electrode(22) is formed on a substrate(21). An insulating layer(23) is spread on the patterned metal electrode. A fluorescent layer(24) for the emitting light is spread on the insulating layer. A mirror surface(27) for reflecting the light is spread on the fluorescent layer. A passivation layer(26) for the protecting the device is spread on the mirror surface.
Abstract:
PURPOSE: A manufacturing method of a semiconductor device is provided to obtain uniform a leg part by adjusting the length and width of the leg part of a T-shape gate electrode. CONSTITUTION: A first photosensitive pattern is formed on a substrate(100). A second photosensitive layer covering the first photosensitive pattern and a third photosensitive layer covering the second photosensitive layer are formed. A third photosensitive pattern(132) with a first opening is formed. The first photosensitive pattern is exposed by leveling the second photosensitive layer. A second photosensitive layer with a second opening is formed. A T-shape gate electrode including a leg part(142) and a head part(144) which fill the second opening is formed.
Abstract:
A conductive polymer composition, a conductive polymer thin film prepared by using the composition, and an organic electronic device containing the thin film are provided to improve coating property and electrical characteristics. A conductive polymer composition comprises a polythiophene-based conductive polymer aqueous solution; 0.02-5.0 parts by weight of a surface tension controller (surfactant) having both hydrophobicity and hydrophilicity based on the weight of the conductive polymer; and 1-99 parts by weight of a polar solvent. Preferably the polythiophene-based conductive polymer is the poly(3,4-ethylene dioxythiophene) represented by the formula 1 or a mixture of the poly(3,4-ethylene dioxythiophene) represented by the formula 1 and the poly(4-styrene sulfonate) represented by the formula 2, wherein n and m are 5-10,000.