公开(公告)号：US10854954B2

公开(公告)日：2020-12-01

申请号：US15994853

申请日：2018-05-31

Applicant: Apple Inc.

Inventor： Richard Hung Minh Dinh ,  Hao Xu ,  Jayesh Nath ,  Peter I. Bevelacqua ,  Jennifer M. Edwards ,  Daniel W. Jarvis ,  Jared M. Kole ,  Mattia Pascolini ,  Robert W. Schlub ,  Ruben Caballero

IPC: H01Q1/24 ,  H01Q1/08 ,  H01Q1/44

Abstract: A housing for a personal electronic device is described herein. The housing may include at least one modular subassembly configured to be arranged within an internal cavity of the housing. The at least one modular subassembly is aligned with a feature external to the housing, is affixed to an interior surface of the internal cavity, and is configured to function both as an antenna and as an internal support member of the housing. A hybrid antenna is also described herein. The hybrid antenna can include first and second flexible members capable of facilitating wireless communication, where the first and second flexible members are affixed to one another via a metal member.

公开(公告)号：USD895626S1

公开(公告)日：2020-09-08

申请号：US29686166

申请日：2019-04-02

Applicant: Apple Inc.

Designer： Jody Akana ,  Molly Anderson ,  Bartley K. Andre ,  Shota Aoyagi ,  Anthony Michael Ashcroft ,  Marine C. Bataille ,  Jeremy Bataillou ,  Markus Diebel ,  M. Evans Hankey ,  Julian Hoenig ,  Richard P. Howarth ,  Jonathan P. Ive ,  Julian Jaede ,  Daniel W. Jarvis ,  Duncan Robert Kerr ,  Richard H. Koch ,  Robert F. Meyer ,  Michael D. Quinones ,  Peter Russell-Clarke ,  Benjamin Andrew Shaffer ,  Mikael Silvanto ,  Ian Spraggs ,  Sung-Ho Tan ,  Christopher S. Tomasetta ,  Clement Tissandier ,  Eugene Antony Whang ,  Rico Zörkendörfer

公开(公告)号：USD893490S1

公开(公告)日：2020-08-18

申请号：US29648093

申请日：2018-05-18

Applicant: Apple Inc.

Designer： Jody Akana ,  Molly Anderson ,  Bartley K. Andre ,  Shota Aoyagi ,  Anthony Michael Ashcroft ,  Marine C. Bataille ,  Jeremy Bataillou ,  Daniele De Iuliis ,  Markus Diebel ,  Ashley E. Fletcher ,  Douglas G. Fournier ,  M. Evans Hankey ,  Julian Hoenig ,  Richard P. Howarth ,  Jonathan P. Ive ,  Julian Jaede ,  Daniel W. Jarvis ,  Duncan Robert Kerr ,  Robert F. Meyer ,  David A. Pakula ,  Peter Russell-Clarke ,  Benjamin Andrew Shaffer ,  Mikael Silvanto ,  Christopher J. Stringer ,  Joe Sung Ho Tan ,  Tang Yew Tan ,  Clement Tissandier ,  Eugene Antony Whang ,  Rico Zörkendörfer

公开(公告)号：US10455738B2

公开(公告)日：2019-10-22

申请号：US15712071

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： David A. Pakula ,  Daniel W. Jarvis ,  Gregory N. Stephens ,  Ian A. Spraggs ,  Vu Thanh Vo ,  Amir Salehi ,  Dennis R. Pyper ,  Alex J. Crumlin ,  Corey S. Provencher ,  Derek J. Walters ,  Michael V. Yeh

IPC: H05K5/02 ,  H04B1/03 ,  H05K7/20 ,  G06F3/041 ,  H01M2/10 ,  H05K1/02 ,  H05K1/14 ,  G06F1/16 ,  H05K9/00 ,  H01M2/08 ,  H02J7/00 ,  G06F3/044

Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.

公开(公告)号：USD849010S1

公开(公告)日：2019-05-21

申请号：US29655032

申请日：2018-06-29

Applicant: Apple Inc.

Designer： Jody Akana ,  Molly Anderson ,  Bartley K. Andre ,  Shota Aoyagi ,  Anthony Michael Ashcroft ,  Marine C. Bataille ,  Jeremy Bataillou ,  Daniele De Iuliis ,  Markus Diebel ,  M. Evans Hankey ,  Julian Hoenig ,  Lee E. Hooton ,  Richard P. Howarth ,  Jonathan P. Ive ,  Julian Jaede ,  Daniel W. Jarvis ,  Duncan Robert Kerr ,  Robert F. Meyer ,  David A. Pakula ,  Michael D. Quinones ,  Marwan Rammah ,  Peter Russell-Clarke ,  Benjamin Andrew Shaffer ,  Mikael Silvanto ,  Ian Spraggs ,  Christopher J. Stringer ,  Joe Sung Ho Tan ,  Tang Yew Tan ,  Clement Tissandier ,  Eugene Antony Whang ,  Rico Zörkendörfer

公开(公告)号：USD843934S1

公开(公告)日：2019-03-26

申请号：US29612830

申请日：2017-08-04

Applicant: Apple Inc.

Designer： Tang Yew Tan ,  David A. Pakula ,  Daniel W. Jarvis ,  Gregory Nicolaus Stephens

公开(公告)号：US10244659B2

公开(公告)日：2019-03-26

申请号：US15712069

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： Daniel W. Jarvis ,  David A. Pakula ,  David J. Dunsmoor ,  Ian A. Spraggs ,  Lee E. Hooton ,  Marwan Rammah ,  Matthew D. Hill ,  Robert F. Meyer ,  James A. Bertin ,  Eric M. Bennett ,  Simon C. Helmore ,  Melissa A. Wah ,  Jon F. Housour ,  Douglas G. Fournier ,  Christopher S. Tomasetta

IPC: H05K7/20 ,  H05K1/02 ,  G06F3/041 ,  H01M2/10 ,  H05K1/14 ,  G06F1/16 ,  H01M2/08 ,  H02J7/00 ,  G06F3/044

Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.

公开(公告)号：US10219057B2

公开(公告)日：2019-02-26

申请号：US15699064

申请日：2017-09-08

Applicant: Apple Inc.

Inventor： Thomas R. Luce ,  Anthony P. Grazian ,  Hongdan Tao ,  Christopher Wilk ,  Daniel W. Jarvis ,  David A. Pakula

IPC: H04R1/02 ,  H04R1/28 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06

Abstract: An electronic device is disclosed that includes one or more sealed audio modules that are unaffected by changes in the internal pressure within the electronic device. The audio modules can also include one or more features that increase the audible bandwidth of the electronic device.

公开(公告)号：USD832266S1

公开(公告)日：2018-10-30

申请号：US29612831

申请日：2017-08-04

Applicant: Apple Inc.

Designer： Jody Akana ,  Molly Anderson ,  Bartley K. Andre ,  Shota Aoyagi ,  Anthony Michael Ashcroft ,  Marine C. Bataille ,  Jeremy Bataillou ,  Daniele De Iuliis ,  Markus Diebel ,  Douglas G. Fournier ,  M. Evans Hankey ,  Julian Hoenig ,  Richard P. Howarth ,  Jonathan P. Ive ,  Julian Jaede ,  Daniel W. Jarvis ,  Duncan Robert Kerr ,  Robert F. Meyer ,  David A. Pakula ,  Peter Russell-Clarke ,  Benjamin Andrew Shaffer ,  Mikael Silvanto ,  Ian Spraggs ,  Christopher J. Stringer ,  Joe Sung Ho Tan ,  Tang Yew Tan ,  Clement Tissandier ,  Eugene Antony Whang ,  Rico Zörkendörfer

公开(公告)号：US09750152B2

公开(公告)日：2017-08-29

申请号：US14456943

申请日：2014-08-11

Applicant: Apple Inc.

Inventor： Daniel W. Jarvis ,  Benjamin J. Pope ,  Jason S. Sloey ,  Jonathan C. Denby ,  Ian A. Spraggs ,  Shayan Malek

IPC: H04M1/02 ,  H05K7/14 ,  H01R43/20 ,  H05K7/02 ,  H05K7/06 ,  H01H23/04 ,  H01H23/14

CPC classification number: H05K7/14 ,  H01H23/04 ,  H01H23/148 ,  H01R43/205 ,  H04M1/026 ,  H04M1/0274 ,  H04M1/0277 ,  H05K7/026 ,  H05K7/06

Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment a number of insert molded retaining members are utilized to prevent outward deformation of sidewalls of the portable computing device during a drop event. In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.