COUPLING STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS

    公开(公告)号:US20220115770A1

    公开(公告)日:2022-04-14

    申请号:US17555920

    申请日:2021-12-20

    Applicant: Apple Inc.

    Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

    Coupling structures for electronic device housings

    公开(公告)号:US11223105B2

    公开(公告)日:2022-01-11

    申请号:US16740753

    申请日:2020-01-13

    Applicant: Apple Inc.

    Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

    Electronic Devices with Dielectric Resonator Antennas

    公开(公告)号:US20210119338A1

    公开(公告)日:2021-04-22

    申请号:US17111131

    申请日:2020-12-03

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a dielectric resonator antenna. The dielectric resonator antenna may include a dielectric resonating element embedded in a lower permittivity dielectric substrate. The substrate and the resonating element may be mounted to a flexible printed circuit. A slot may be formed in ground traces on the flexible printed circuit and aligned with the resonating element. The slot may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the cover layer. A dielectric matching layer may be interposed between the resonating element and the cover layer. If desired, the slot may radiate additional radio-frequency signals and the matching layer may have a tapered shape. Dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the array.

    COUPLING STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS

    公开(公告)号:US20200153088A1

    公开(公告)日:2020-05-14

    申请号:US16740753

    申请日:2020-01-13

    Applicant: Apple Inc.

    Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

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