公开(公告)号：US11119333B2

公开(公告)日：2021-09-14

申请号：US16560871

申请日：2019-09-04

Applicant: Apple Inc.

Inventor： Scott W. Miller ,  Nicholas D. Smyth ,  Hao Zheng ,  Shujun Tang ,  Zachary W. Birnbaum

IPC: G02B27/64 ,  H04N5/225 ,  G02B7/09

Abstract: A damper arrangement may be used in a camera module that includes a first (e.g., stationary) and a second (e.g., dynamic) component. The second component may hold a lens such that the lens moves together with the second component. The damper arrangement may include an interface member that extends from the first or the second component to at least partially into a viscoelastic material within a volumetric space configured in the first component, the second component, or both. The interface member may include a mounting portion having a thickness and a viscoelastic material section, having a different thickness, that interacts with viscoelastic material to dampen motion of the second component, for example, during operation of a lens actuator to move the second component along an optical axis of the lens. The interface member may be a two-piece interface member, such as a pin soldered into a hole in a plate, for example.

公开(公告)号：US11681158B2

公开(公告)日：2023-06-20

申请号：US17472437

申请日：2021-09-10

Applicant: Apple Inc.

Inventor： Scott W. Miller ,  Nicholas D. Smyth ,  Hao Zheng ,  Shujun Tang ,  Zachary W. Birnbaum

IPC: G02B27/64 ,  H04N23/51 ,  H04N23/54 ,  H04N23/55 ,  G02B7/09

CPC classification number: G02B27/646 ,  H04N23/51 ,  H04N23/54 ,  H04N23/55 ,  G02B7/09

Abstract: A damper arrangement may be used in a camera module that includes a first (e.g., stationary) and a second (e.g., dynamic) component. The second component may hold a lens such that the lens moves together with the second component. The damper arrangement may include an interface member that extends from the first or the second component to at least partially into a viscoelastic material within a volumetric space configured in the first component, the second component, or both. The interface member may include a mounting portion having a thickness and a viscoelastic material section, having a different thickness, that interacts with viscoelastic material to dampen motion of the second component, for example, during operation of a lens actuator to move the second component along an optical axis of the lens. The interface member may be a two-piece interface member, such as a pin soldered into a hole in a plate, for example.

公开(公告)号：US11272082B2

公开(公告)日：2022-03-08

申请号：US17023938

申请日：2020-09-17

Applicant: Apple Inc.

Inventor： Scott W. Miller ,  Brian A. Argyres ,  Lindsay M. Alanen ,  Matthew D. Hill ,  Nicholas D. Smyth ,  Shujun Tang

IPC: H04N5/225 ,  G03B13/36

Abstract: Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.

公开(公告)号：US11750900B2

公开(公告)日：2023-09-05

申请号：US17687497

申请日：2022-03-04

Applicant: Apple Inc.

Inventor： Scott W. Miller ,  Brian A. Argyres ,  Lindsay M. Alanen ,  Matthew D. Hill ,  Nicholas D. Smyth ,  Shujun Tang

IPC: H04N23/51 ,  G03B13/36 ,  H04N23/57

CPC classification number: H04N23/51 ,  G03B13/36 ,  H04N23/57

Abstract: Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.

公开(公告)号：US20210092261A1

公开(公告)日：2021-03-25

申请号：US17023938

申请日：2020-09-17

Applicant: Apple Inc.

Inventor： Scott W. Miller ,  Brian A. Argyres ,  Lindsay M. Alanen ,  Matthew D. Hill ,  Nicholas D. Smyth ,  Shujun Tang

IPC: H04N5/225 ,  G03B13/36

Abstract: Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.

公开(公告)号：US20250085400A1

公开(公告)日：2025-03-13

申请号：US18830624

申请日：2024-09-11

Applicant: Apple Inc.

Inventor： Xiaoyin Zhu ,  Ali M. Khan ,  Andrea Manavella ,  Andrej Halabica ,  April D. Schriker ,  Austin Y. Seol ,  Bhavin J. Bijlani ,  Caihua Chen ,  Chin Han Lin ,  Cristiano L. Niclass ,  David Sicard ,  Eric D. Aspnes ,  Hazel A. McInnes ,  Henry M. Daghighian ,  Igor Raginski ,  Jiayang Cao ,  Jibum Cha ,  Jili Liu ,  Jose M. Infante Herrero ,  Julien Sarry ,  Karen A. Cabrera ,  Lorenzo Ferrari ,  Niv Gilboa ,  Noriaki Saika ,  Pietro R. Binetti ,  Pushkar Pandit ,  Reema Shalan ,  Scott T. Smith ,  Shifa Xu ,  Shingo Mandai ,  Shujun Tang ,  Sibi Sutty ,  Susan A. Thompson ,  Teimour T. Maleki ,  Thierry Oggier ,  Vikrant Dhamdhere ,  Yohai Zmora ,  Yuanlin Xie ,  Wee Keat Chong

IPC: G01S7/481 ,  G01S17/894 ,  G03B30/00 ,  H04N13/239 ,  H04N23/51 ,  H04N23/56 ,  H04N23/74

Abstract: An optoelectronic assembly includes: (i) a substrate having a cavity, (ii) an optoelectronic device, which is disposed over the cavity and includes an array of multiple emitters configured to emit a predefined number of light beams in response to receiving one or more electrical signals, and (iii) an integrated circuit (IC), which is mounted within the cavity, between the substrate and the optoelectronic device, and is configured to drive the one or more electrical signals to the optoelectronic device.

公开(公告)号：US20220191356A1

公开(公告)日：2022-06-16

申请号：US17687497

申请日：2022-03-04

Applicant: Apple Inc.

Inventor： Scott W. Miller ,  Brian A. Argyres ,  Lindsay M. Alanen ,  Matthew D. Hill ,  Nicholas D. Smyth ,  Shujun Tang

IPC: H04N5/225 ,  G03B13/36

Abstract: Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.

公开(公告)号：US20210405387A1

公开(公告)日：2021-12-30

申请号：US17472437

申请日：2021-09-10

Applicant: Apple Inc.

Inventor： Scott W. Miller ,  Nicholas D. Smyth ,  Hao Zheng ,  Shujun Tang ,  Zachary W. Birnbaum

IPC: G02B27/64 ,  H04N5/225

Abstract: A damper arrangement may be used in a camera module that includes a first (e.g., stationary) and a second (e.g., dynamic) component. The second component may hold a lens such that the lens moves together with the second component. The damper arrangement may include an interface member that extends from the first or the second component to at least partially into a viscoelastic material within a volumetric space configured in the first component, the second component, or both. The interface member may include a mounting portion having a thickness and a viscoelastic material section, having a different thickness, that interacts with viscoelastic material to dampen motion of the second component, for example, during operation of a lens actuator to move the second component along an optical axis of the lens. The interface member may be a two-piece interface member, such as a pin soldered into a hole in a plate, for example.

公开(公告)号：US20200096782A1

公开(公告)日：2020-03-26

申请号：US16560871

申请日：2019-09-04

Applicant: Apple Inc.

Inventor： Scott W. Miller ,  Nicholas D. Smyth ,  Hao Zheng ,  Shujun Tang ,  Zachary W. Birnhaum

IPC: G02B27/64 ,  H04N5/225

Abstract: A damper arrangement may be used in a camera module that includes a first (e.g., stationary) and a second (e.g., dynamic) component. The second component may hold a lens such that the lens moves together with the second component. The damper arrangement may include an interface member that extends from the first or the second component to at least partially into a viscoelastic material within a volumetric space configured in the first component, the second component, or both. The interface member may include a mounting portion having a thickness and a viscoelastic material section, having a different thickness, that interacts with viscoelastic material to dampen motion of the second component, for example, during operation of a lens actuator to move the second component along an optical axis of the lens. The interface member may be a two-piece interface member, such as a pin soldered into a hole in a plate, for example.