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    OSTOMY DEVICE
    84.
    发明授权
    OSTOMY DEVICE 有权

    公开(公告)号：EP3253341B1

    公开(公告)日：2018-12-12

    申请号：EP16703053.5

    申请日：2016-02-02

    Applicant: Coloplast A/S

    Inventor： STROEBECH, Esben ,  HANSEN, Michael

    IPC: A61F5/443 ,  A61F5/445 ,  A61F5/448 ,  A61L24/00 ,  A61L24/04

    CPC classification number: A61L24/043 ,  A61F5/443 ,  A61F5/448 ,  A61L24/001 ,  A61L2400/14

    Abstract: Disclosed is an ostomy device with an adhesive wafer for attachment to a skin surface (S) of a user and a collecting bag (8) or collecting output from a stoma. The collecting bag is connected to the adhesive wafer, and the adhesive wafer has a through-going hole (6) for accommodating the stoma (7) of the user. The adhesive wafer includes a backing layer (3), a first switchable adhesive composition (2), a second absorbent adhesive composition (1), and a release liner, and the second adhesive layer has a central portion with a first thickness and an edge portion with a second thickness, the first thickness being larger than the second thickness.

    BODY SIDE MEMBER OF AN OSTOMY APPLIANCE
    85.
    发明公开
    BODY SIDE MEMBER OF AN OSTOMY APPLIANCE 审中-公开

    公开(公告)号：EP3364922A1

    公开(公告)日：2018-08-29

    申请号：EP16788422.0

    申请日：2016-10-19

    Applicant: Coloplast A/S

    Inventor： HANSEN, Michael ,  ANDERSEN, Birthe Vestbo

    IPC: A61F5/445 ,  A61F5/449 ,  B32B3/30

    Abstract: An ostomy appliance comprising a body side member (20) for attachment to a skin surface of a user. The body side member includes a backing layer (22), an adhesive layer (24), and at least one release liner (38). The release liner is at least partly embossed (40) to form interconnected cavities (42) between the release liner and the adhesive surface. When fluid is distributed into the cavities, the adhesive surface is wetted.

    TO CONTROL BENDING IN A SKIN PLATE FOR USE IN AN OSTOMY APPLIANCE
    88.
    发明公开
    TO CONTROL BENDING IN A SKIN PLATE FOR USE IN AN OSTOMY APPLIANCE 有权
    控制皮肤弯曲用于家庭电器

    公开(公告)号：EP2974702A3

    公开(公告)日：2016-05-18

    申请号：EP15179512.7

    申请日：2009-11-12

    Applicant: Coloplast A/S

    Inventor： ANDERSEN, Birthe Vestbo ,  HANSEN, Michael

    IPC: A61F5/445 ,  A61F5/448

    CPC classification number: A61F5/445 ,  A61F2005/4483

    Abstract: The present invention relates to a convex shell for use in a base plate of an ostomy appliance. The convex shell (1) comprises an annular ring (5) defined by an outer edge (6) and an inner edge (7) defining a through-going hole (8). The annular ring has a higher flexibility around a first axis which is perpendicular to the centre axis of the through-going hole relative to the flexibility around a second axis having an angle to the first axis and being perpendicular to the centre axis of the through-going hole.

    Abstract translation: 本发明涉及一种用于造口术器具的基板的凸面外壳。 凸壳（1）包括由外边缘（6）和限定贯通孔（8）的内边缘（7）限定的环形圈（5）。 环形环围绕垂直于通孔的中心轴线的第一轴线相对于围绕与第一轴线成一定角度的第二轴线的柔性具有较高的柔性，该第二轴线垂直于通孔的中心轴线， 进洞。

    OSTOMY WAFER
    90.
    发明公开
    OSTOMY WAFER 有权

    公开(公告)号：EP2651350A1

    公开(公告)日：2013-10-23

    申请号：EP11799356.8

    申请日：2011-12-16

    Applicant: Coloplast A/S

    Inventor： LAM, Peter Kwok Hing ,  LAWS, Matthew ,  O'BRIEN, Liam ,  HANSEN, Michael ,  ANDERSEN, Birthe Vestbo ,  HANSEN, Kristoffer ,  LARSEN, Steffen Kongensbjerg

    IPC: A61F5/443

    CPC classification number: A61F5/4404 ,  A61F5/443

    Abstract: An ostomy wafer (1) comprising a proximal surface in an axial direction facing the user during use provided with an adhesive layer (7), a distal surface (5) in the axial direction facing away from the user during use provided with a backing layer, coupling means for attaching a collection bag, an opening having an inner radial boundary defining a stoma receiving opening, and an outer radial boundary defining the peripheral edge of the ostomy wafer. Furthermore, the wafer is provided with a reinforcement structure (6).

    Abstract translation: 包括在面对使用时的用户的轴向方向上的近端表面的造口术晶片（1）withan粘合剂层（7）设置，一个远端表面（5）设置有背衬层在使用期间面向远离用户的轴向方向 用于附接收集袋的联接装置，具有限定造口接收开口的内部径向边界的开口以及限定造口术晶片的外围边缘的外部径向边界。 此外，晶片设有加强结构（6）。

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