中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

283 records (took 0.043 seconds)

    FLUID PROPELLING APPARATUS INCLUDING A HEAT SINK
    81.
    发明申请
    FLUID PROPELLING APPARATUS INCLUDING A HEAT SINK 审中-公开
    包括散热片的液体推进装置

    公开(公告)号：WO2017151091A1

    公开(公告)日：2017-09-08

    申请号：PCT/US2016/020041

    申请日：2016-02-29

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： CLARK, Garrett E. ,  CUMBIE, Michael W. ,  CHEN, Chien-Hua

    IPC: B81B7/02 ,  B81B3/00

    Abstract: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.

    Abstract translation: 流体推进装置包括塑料化合物，至少部分地被化合物包围的MEMS以及与MEMS相邻的散热器，以从MEMS传递热量，其中散热器是 至少部分被化合物包围。

    FLUID EJECTION DEVICE INCLUDING INTEGRATED CIRCUIT
    82.
    发明申请
    FLUID EJECTION DEVICE INCLUDING INTEGRATED CIRCUIT 审中-公开
    流体喷射装置包括集成电路

    公开(公告)号：WO2017146699A1

    公开(公告)日：2017-08-31

    申请号：PCT/US2016/019389

    申请日：2016-02-24

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： CUMBIE, Michael W. ,  CHEN, Chien-Hua ,  FULLER, Anthony M.

    IPC: B41J2/14 ,  B41J2/175 ,  B41J2/135

    CPC classification number: B41J2/135 ,  B41J2/14 ,  B41J2/1404 ,  B41J2/14072 ,  B41J2/14145 ,  B41J2/1603 ,  B41J2/1632 ,  B41J2/1637 ,  B41J2/175 ,  B41J2/1753 ,  B41J2/17553

    Abstract: Examples include a fluid ejection device comprising a molded panel, an ejection die molded in the molded panel, and an integrated circuit molded in the molded panel. The ejection die comprises ejection nozzles to selectively dispense printing material. The integrated circuit receives nozzle data and controls the selective dispensation of printing material by the ejection nozzles based at least in part on the nozzle data. The molded panel has a fluid communication channel formed therethrough and fluidly connected to the ejection die.

    Abstract translation: 示例包括流体喷射装置，其包括模制面板，模制在模制面板中的喷射模具以及模制在模制面板中的集成电路。 喷射模具包括喷射喷嘴以选择性地分配印刷材料。 集成电路至少部分地基于喷嘴数据接收喷嘴数据并控制喷嘴对打印材料的选择性分配。 模塑面板具有穿过其形成的流体连通通道并流体连接到喷射模具。

    PRINTER CARTRIDGE WITH MULTIPLE FLUID CHAMBERS IN FLUID COMMUNICATION
    83.
    发明申请
    PRINTER CARTRIDGE WITH MULTIPLE FLUID CHAMBERS IN FLUID COMMUNICATION 审中-公开
    流体通讯中带多个流体室的打印机墨盒

    公开(公告)号：WO2017074339A1

    公开(公告)日：2017-05-04

    申请号：PCT/US2015/057764

    申请日：2015-10-28

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： MACKENZIE, Mark H. ,  CLARK, Garrett E. ,  CUMBIE, Michael W.

    IPC: B41J2/175

    CPC classification number: B41J2/175 ,  B41J2/17513

    Abstract: In one example in accordance with the present disclosure a printer cartridge is described. The printer cartridge includes at least one backpressure chamber to provide backpressure to a fluid during deposition of the fluid onto a print medium. The printer cartridge also includes multiple fluid chambers in fluid communication with the at least one backpressure chamber. A fluid chamber provides fluid to a portion of a printhead. Adjacent fluid chambers are selectively in fluid communication with one another via valves.

    Abstract translation: 在根据本公开的一个示例中，描述了打印机墨盒。 打印机墨盒包括至少一个背压室，以在将流体沉积到打印介质上的过程中为流体提供背压。 打印盒还包括与至少一个背压室流体连通的多个流体室。 流体室向打印头的一部分提供流体。 相邻的流体室通过阀门选择性地相互流体连通。

    PRINTBAR AND METHOD OF FORMING SAME
    89.
    发明申请
    PRINTBAR AND METHOD OF FORMING SAME 审中-公开
    PRINTBAR及其形成方法

    公开(公告)号：WO2015041665A1

    公开(公告)日：2015-03-26

    申请号：PCT/US2013/060828

    申请日：2013-09-20

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： CHEN, Chien-Hua ,  CUMBIE, Michael W.

    IPC: B41J2/04 ,  B41J2/045

    CPC classification number: B41J2/1637 ,  B41J2/1433 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1607 ,  B41J2/162 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2002/14419 ,  B41J2202/19

    Abstract: A printbar module and method of forming the same are described. In an example, a printbar module includes a printed circuit board (PCB), a plurality of printhead die slivers, and a manifold. The printhead die slivers are embedded in molding and attached to the PCB. The molding has a plurality of slots in fluidic communication with fluid feed holes of the printhead die slivers. The manifold is in direct fluidic communication with the slots to supply fluid thereto.

    Abstract translation: 描述了印刷模块及其形成方法。 在一个示例中，打印头模块包括印刷电路板（PCB），多个打印头芯片和歧管。 打印头芯片嵌入模制中并连接到PCB。 模制件具有与打印头芯片的流体供给孔流体连通的多个槽。 歧管与槽直接流体连通以向其供应流体。

Patent Agency Ranking