公开(公告)号：WO2018125241A1

公开(公告)日：2018-07-05

申请号：PCT/US2016/069622

申请日：2016-12-30

Applicant: INTEL CORPORATION

Inventor： KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  OSTER, Sasha N.

IPC: H01L23/00 ,  H01L23/488 ,  H01L23/522

Abstract: Embodiments of the invention include a microelectronic device that includes a substrate having transistor layers and interconnect layers including conductive layers to form connections to transistor layers. A capacitive bump is disposed on the interconnect layers. The capacitive bump includes a first electrode, a dielectric layer, and a second electrode. In another example, an inductive bump is disposed on the interconnect layers. The inductive bump includes a conductor and a magnetic layer that surrounds the conductor.

公开(公告)号：WO2018125227A1

公开(公告)日：2018-07-05

申请号：PCT/US2016/069540

申请日：2016-12-30

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios ,  OSTER, Sasha ,  KAMGAING, Telesphor

IPC: H01P3/16 ,  H01P3/12 ,  H01P5/107

Abstract: Embodiments of the invention include a dispersion reduced dielectric waveguide and methods of forming such devices. In an embodiment, the dispersion reduced dielectric waveguide may include a first dielectric material that has a first Dk-value, and a second dielectric material that has a second Dk-value that is greater than the first Dk-value. In an embodiment, the dispersion reduced dielectric waveguide may also include a conductive layer formed around the first and second dielectric materials. According to an embodiment, a first portion of a bandwidth of a signal that is propagated along the dispersion reduced dielectric waveguide is primarily propagated along the first dielectric material, and a second portion of a bandwidth of the signal that is propagated along the dispersion reduced dielectric waveguide is primarily propagated along the second dielectric material.

公开(公告)号：WO2018063676A1

公开(公告)日：2018-04-05

申请号：PCT/US2017/049173

申请日：2017-08-29

Applicant: INTEL CORPORATION

Inventor： ELSHERBINI, Adel A. ,  OSTER, Sasha N. ,  SWAN, Johanna M. ,  DOGIAMIS, Georgios C. ,  LIFF, Shawna M. ,  ALEKSOV, Aleksandar ,  KAMGAING, Telesphor

IPC: H01P1/16 ,  H01P3/00 ,  H01Q13/02

CPC classification number: H01P5/1007 ,  H01P5/10 ,  H01P5/107 ,  H01P11/00 ,  H01Q13/02

Abstract: The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a first plate and a second plate that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide.

Abstract translation: 这里描述的系统和方法提供了一种行波发射器系统，其物理和可通信地耦合到半导体封装和波导。 行波发射器系统包括一个槽线信号转换器和一个锥形槽发射器。 槽线信号转换器可以与半导体封装整体形成并且包括将微带信号转换为槽线信号的平衡 - 不平衡转换器结构。 锥形槽发射器可通信地耦合到槽线信号转换器并且包括形成槽的第一板和第二板。 锥形槽发射器将槽线信号转换成传播到波​​导的行波信号。

公开(公告)号：WO2018063560A1

公开(公告)日：2018-04-05

申请号：PCT/US2017/047299

申请日：2017-08-17

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios C. ,  OSTER, Sasha N. ,  KAMGAING, Telesphor ,  ELSHERBINI, Adel A. ,  SWAN, Johanna M. ,  LIFF, Shawna M. ,  ALEKSOV, Aleksandar ,  RAWLINGS, Brandon M. ,  DISCHLER, Richard J.

IPC: G02B6/10 ,  G06F13/18 ,  G02B6/12

CPC classification number: H01P3/122 ,  G06F1/182 ,  H01P3/14 ,  H01P3/16 ,  H01P11/006

Abstract: An apparatus comprises a plurality of waveguides, wherein the waveguides include a dielectric material; an outer shell; and a supporting feature within the outer shell, wherein the waveguides are arranged separate from each other within the outer shell by the supporting feature.

Abstract translation: 一种设备包括多个波导，其中波导包括电介质材料; 外壳; 以及在外壳内的支撑特征，其中波导通过支撑特征彼此分离地布置在外壳内。

公开(公告)号：WO2018063341A8

公开(公告)日：2018-04-05

申请号：PCT/US2016/054832

申请日：2016-09-30

Applicant: INTEL CORPORATION

Inventor： ELSHERBINI, Adel A. ,  OSTER, Sasha, N. ,  DOGIAMIS, Georgios C. ,  KAMGAING, Telesphor ,  LIFF, Shawna M. ,  ALEKSOV, Aleksandar ,  SWAN, Johanna M. ,  RAWLINGS, Brandon M. ,  DISCHLER, Richard, J.

IPC: H01P3/02 ,  H01P3/127 ,  H01P3/12 ,  H01P3/16

Abstract: An apparatus comprises a waveguide including: an elongate waveguide core including a dielectric material, wherein the waveguide core includes at least one space arranged lengthwise along the waveguide core that is void of the dielectric material; and a conductive layer arranged around the waveguide core.

公开(公告)号：WO2018063238A1

公开(公告)日：2018-04-05

申请号：PCT/US2016/054417

申请日：2016-09-29

Applicant: INTEL CORPORATION ,  OSTER, Sasha ,  DOGIAMIS, Georgios ,  KAMGAING, Telesphor ,  ELSHERBINI, Adel ,  LIFF, Shawna ,  ALEKSOV, Aleksandar ,  SWAN, Johanna

Inventor： OSTER, Sasha ,  DOGIAMIS, Georgios ,  KAMGAING, Telesphor ,  ELSHERBINI, Adel ,  LIFF, Shawna ,  ALEKSOV, Aleksandar ,  SWAN, Johanna

IPC: H01L25/16 ,  H01L25/065 ,  H01L25/10 ,  H01L23/66 ,  H01L23/00

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L25/0655 ,  H01L25/117 ,  H01L25/16 ,  H01L25/165 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/10545

Abstract: A millimeter wave (mm-wave) communication interface includes a first semiconductor package coupled to a first substrate and a second semiconductor package coupled to a second substrate. The second substrate may be coupled at approximately a 90° angle to the first substrate. The second semiconductor package may include a mm-wave die that modulates digital data on a high frequency microwave signal and a mm-wave launcher that launches the modulated high-frequency microwave signal into a waveguide member operably coupled to the second substrate. In such an implementation, the waveguide member may beneficially exit the second substrate along a longitudinal axis parallel to the principal plane of the first substrate. Advantageously, all high-frequency components are close coupled to the second substrate without the use of an intervening interface.

Abstract translation: 毫米波（毫米波）通信接口包括耦合到第一衬底的第一半导体封装和耦合到第二衬底的第二半导体封装。 第二衬底可以以大约90°的角度耦合。 与第一衬底成角度。 第二半导体封装可以包括在高频微波信号上调制数字数据的毫米波管芯和将调制的高频微波信号发射到可操作地耦合到第二基板的波导部件中的毫米波发射器。 在这样的实施方式中，波导构件可以沿着平行于第一基板的主平面的纵向轴线有利地离开第二基板。 有利的是，所有的高频部件都紧密耦合到第二衬底而不使用介入界面。

公开(公告)号：WO2017172059A1

公开(公告)日：2017-10-05

申请号：PCT/US2017/017226

申请日：2017-02-09

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios C. ,  EID, Feras ,  ELSHERBINI, Adel A. ,  NAIR, Vijay K. ,  KAMGAING, Telesphor ,  RAO, Valluri R. ,  SWAN, Johanna M.

IPC: H01H57/00 ,  H01L41/09 ,  H01L41/047 ,  H01L41/083

CPC classification number: B81C1/0015 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04

Abstract: Embodiments of the invention include a switching device that includes an electrode, a piezoelectric material coupled to the electrode, and a movable structure (e.g., cantilever, beam) coupled to the piezoelectric material. The movable structure includes a first end coupled to an anchor of a package substrate having organic layers and a second released end positioned within a cavity of the package substrate.

Abstract translation: 本发明的实施例包括开关装置，其包括电极，耦合到电极的压电材料以及耦合到压电材料的可移动结构（例如，悬臂梁）。 可移动结构包括耦合到具有有机层的封装衬底的锚的第一端和位于封装衬底的空腔内的第二释放端。

公开(公告)号：WO2017111910A1

公开(公告)日：2017-06-29

申请号：PCT/US2015/067157

申请日：2015-12-21

Applicant: INTEL CORPORATION

Inventor： ELSHERBINI, Adel A. ,  MANUSHAROW, Mathew J. ,  BHARATH, Krishna ,  LAMBERT, William J. ,  SANKMAN, Robert L. ,  ALEKSOV, Aleksandar ,  RAWLINGS, Brandon M. ,  EID, Feras ,  SOTO GONZALEZ, Javier ,  JIAO, Meizi ,  NAD, Suddhasattwa ,  KAMGAING, Telesphor

IPC: H01F17/00 ,  H01F19/04 ,  H01L27/08

CPC classification number: H01F27/40 ,  H01F17/0006 ,  H01L28/00

Abstract: Embodiments of the invention include an electrical package and methods of forming the package. In one embodiment, a transformer may be formed in the electrical package. The transformer may include a first conductive loop that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first conductive loop from a second conductive loop that is formed in the package. Additional embodiments of the invention include forming a capacitor formed in the electrical package. For example, the capacitor may include a first capacitor plate that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first capacitor plate form a second capacitor plate that is formed in the package. The thin dielectric spacer material in the transformer and capacitor allow for increased coupling factors and capacitance density in electrical components.

Abstract translation: 本发明的实施例包括电封装和形成封装的方法。 在一个实施例中，可以在电气封装中形成变压器。 变压器可以包括形成在第一电介质层上的第一导电回路。 薄的电介质间隔件材料可以用于将第一导电环与形成在封装中的第二导电环分开。 本发明的另外的实施例包括形成形成在电封装中的电容器。 例如，电容器可以包括形成在第一电介质层上的第一电容器板。 可使用薄的电介质间隔件材料来将第一电容器板分离以形成在封装中形成的第二电容器板。 变压器和电容器中的薄绝缘间隔材料可以提高电气元件的耦合系数和电容密度。

公开(公告)号：WO2017111768A1

公开(公告)日：2017-06-29

申请号：PCT/US2015/000159

申请日：2015-12-22

Applicant: INTEL CORPORATION

Inventor： NAIR, Vijay, K. ,  DOGIAMIS, Georgios, C. ,  KAMGAING, Telesphor

IPC: H01L23/66 ,  H01L25/065 ,  H01L23/48

CPC classification number: H01L25/065 ,  H01L23/66 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225

Abstract: Embodiments of the invention include a microelectronic device that includes a transceiver coupled to a first substrate and a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. An interposer substrate can provide a spacing between the first and second substrates.

Abstract translation: 本发明的实施例包括微电子器件，其包括耦合到第一衬底的收发器和耦合到第一衬底的第二衬底。 第二基板包括用于以大约4GHz或更高的频率发送和接收通信的天线单元。 内插基板可以在第一和第二基板之间提供间隔。

公开(公告)号：WO2017052660A1

公开(公告)日：2017-03-30

申请号：PCT/US2015/052496

申请日：2015-09-25

Applicant: INTEL CORPORATION

Inventor： ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  OSTER, Sasha N. ,  RAWLINGS, Brandon M. ,  DOGIAMIS, Georgios C.

IPC: H01Q1/22 ,  H01Q9/04

CPC classification number: H01Q1/2283 ,  H01Q9/0457 ,  H01Q13/02

Abstract: Antennas are described for platform level wireless interconnects. In one example, a substantially flat package substrate has an attached radio. A conductive transmission line on the package substrate is electrically connected to the radio and an antenna is attached to the package substrate connected to the conductive transmission line, the antenna radiating to the side of the package.

Abstract translation: 天线被描述为平台级无线互连。 在一个示例中，基本平坦的封装衬底具有连接的无线电装置。 封装衬底上的导电传输线电连接到无线电装置，并且天线附接到连接到导电传输线的封装衬底，天线辐射到封装的侧面。