Abstract:
PROBLEM TO BE SOLVED: To provide an actuator that stably releases a latch state of being held by an engagement unit, and an optical device. SOLUTION: The actuator comprises: central electrode units 13, 14 displaceable in first and second directions; the engagement unit 2a that is held in at least one state out of first and second displaced states and a central state by being engaged with the central electrode unit; a first side electrode unit 18 that applies stress to the central electrode unit in the first direction and releases the second displaced state that the engagement unit is held by being displaced in the second direction; and a second side electrode unit 21 that imparts stress to the central electrode unit in the second direction and releases the first displaced state that the engagement unit is held by being displaced in the first direction. When the first side electrode unit starts the release operation of the second displaced state or the central state, the second side electrode unit imparts stress to the central electrode unit in the second direction. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an actuator and optical device capable of displacing a movable part to a plurality of states by voltage application for a short time and holding the states. SOLUTION: This actuator and optical device have a central electrode unit capable of displacing in each of a first direction and a second direction opposed to the first direction, a fitting unit for holding the central electrode unit in at least one state of the first displacement state for displacing the central electrode unit in the first direction, the second displacement state for displacing the unit in the second direction, a center state in which the unit does not displace in either one of the first and second directions, a first side electrode unit for releasing the second displacement state or the center state held by the fitting unit by displacement in the second direction, and a second side electrode unit for releasing the first displacement state or the center state held by the fitting unit by displacement in the first direction. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To prevent side etching at both longitudinal ends of a plate-like structure to carry out integration. SOLUTION: A semiconductor substrate (a silicon substrate) is wet-etched to form the plate-like structure with the side faces formed as (111) faces almost perpendicular to the main surface of the substrate. At this time, etching is performed to form compensation parts 22 at both longitudinal ends of the plate-like structure. The compensation part is composed of an extended part 23 extending each end of the plate-like structure, and a (111) face structure part 24 extending in a (111) face direction intersecting the plate-like structure. Side etching occurs at the (111) face structure part. There is therefore no need to take side etching into consideration when setting the length of the plate-like structure. The formed plate-like structure is used as a mirror in an optical switching device. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a small and highly yielding drive device and optical device. SOLUTION: This drive device is arranged in a first layer and a second layer overlapped on a first layer through an intermediate and has a drive part having a fixed electrode and a movable electrode arranged in the first layer and meshing with each other, a movable plate arranged in the second layer and a flexible supporting part connected to the movable electrode and the movable plate. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an optical fiber fixing structure capable of positioning an optical fiber with high accuracy even when foreign matters, such as dust and contaminant, are present in manufacturing environment, to provide an optical device provided with the same, and to provide a manufacturing method of the optical device. SOLUTION: In the optical fiber fixing structure S for inserting an optical fiber F into a fiber insertion part 2 formed in the shape of groove on the surface 1a of a substrate 1 and fix it, a foreign matter removal part 3 storing foreign matters is arranged so as to be open toward the fiber insertion part 2 and to occupy the most part of the part 2 in the groove direction by the opening. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a small electrostatic actuator suitable for an optical switch, particularly a large-scale matrix optical switch. SOLUTION: The small electrostatic actuator comprises a fixed member 1, a driving member 2 and a rotary supporting member 3. The fixed member 1 has a fixed frame section 11 and a fixed electrode section 12 comprising a fixed comb-shaped electrode part 121 and a fixed comb-shaped connection part 122. The driving member 2 moved by electrostatic power against the fixed electrode section has a movable electrode section 21 comprising a movable comb-shaped electrode part 211 and a movable comb-shaped connection part 212 and being insulated electrically from the fixed electrode section, a working section 23 which moves for a distance longer than the stroke of the movable electrode section in conjunction with the move of the movable electrode section, and a displacement section 22 connecting the movable electrode section and the working section. The rotary supporting member 3 connects, with the fixed frame section, a portion nearer to the movable electrode section than the center position of a straight line linking the working section of the driving member to the movable electrode section, and supports the displacement section oscillating with the move of the movable electrode section. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device where irregularities of the characteristics are reduced, and stable yield can be obtained. SOLUTION: A field oxide film 3 is formed on a surface of an N type active layer 2. The field oxide film 3 in a part, where an N type source region of high concentration and an N type drain region of high concentration are formed, is eliminated by a photolithographic process and an etching process, and aperture parts 4a, 4b are formed. In this case, a plurality of mask patterns of the photolithographic process are prepared. A mask pattern, whose drift length Ld is short is used for each wafer of one lot where the average value of thickness of active layers 1c, is at least a specified value. A mask pattern, whose drift length Ld is long is used for each wafer of one lot where the average value of thickness of the active layers 1c is less than the specified value.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device improving reliability and its manufacturing method. SOLUTION: A light shielding film 14 is arranged opposite to a protection film 13 covering a semiconductor device in the main surface side of a substrate 1, and a gap between the protection film 13 and the light shielding film 14 is held a prescribed distance by a support part 15 consisting of the same metal material as the light shielding film 14. The light shielding film 14 is rectangularly formed in a face orthogonal to the thickness direction of the substrate 1, and the support part 15 is formed along one side of the light shielding film 14. The light shielding film 14 and the support part 15 are continuously integrally formed. Thus, the gap is formed between the light shielding film 14 and the protection film 13, and the light shielding film 14 and the protection film 13 are continued to only the support part 15 formed by the same metal material as the light shielding film 14.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device which has a small element area and can suppress damages caused by wire bonding, and a method for manufactur ing the device. SOLUTION: In a semiconductor device, an n+-type drain diffusion areas 4 which is formed as an impurity diffusion layer is formed in the n-type silicon layer (silicon active layer) of an SOI substrate constituted by forming the silicon layer 3 on a single-crystal silicon substrate 1 through a silicon oxide insulating layer 2. The surface-side part of the portion overlapping the diffusion area 4 of a drain electrode 7 constituting metallic wiring becomes a drain pad 17 serving as a bonding pad. An impact relieving section 9 composed of a silicon oxide film is provided between the drain pad 17 and the diffusion area 4 so as to relieve the impact given to the diffusion area 4 at the time of performing wire bonding. The impact relieving section 9 is formed on the portion overlapping the drain pad 17 of the diffusion area 4.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of forming an aluminum wiring good in surface condition. SOLUTION: In a method of forming an aluminum wiring comprising the step of forming an insulation layer 2 on one main surface of a semiconductor substrate 1, the step of removing a part of the insulation layer 2 to expose the surface of the semiconductor substrate 1 surface the step of, forming an Al wiring 3 with a specified pattern on the exposed surface of the substrate 1 and the insulation layer 2, and the step of forming a passivation film 4 on the insulation layer 2 and the Al wiring 3, silicon 34 is implanted only at positions corresponding to the exposed part of the substrate 1 in at least either the Al wiring 3 or the semiconductor substrate 1.