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公开(公告)号：DE3689881T2
公开(公告)日：1995-01-05
申请号：DE3689881
申请日：1986-06-30
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OHTA MASAHIRO , KAWASHIMA SABURO , SONOBE YOSHIHO , TAMAI SHOJI , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO
Abstract: This new flexible copper-clad circuit board consists of a copper foil bonded firmly and directly without an adhesive to a polyimide (1) film which is fluid at high temperature, the bonding being carried out at high temp.. The polyimide (1) has a repeat unit qwith the general formulae (I), (II), (III), etc. where R; nC-alkyl, nC-cycloalkyl, nC-aromatic, nC-condensed ring aromatic etc. n at least 2.
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公开(公告)号：DE3889380T2
公开(公告)日：1994-12-15
申请号：DE3889380
申请日：1988-05-31
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OHTA MASAHIRO , IIYAMA KATSUAKI , KAWASHIMA SABURO , TAMAI SHOJI , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO
Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin composition of this invention consists of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high temperature engineering polymer. The polyimide consists of recurring units of the following formula: wherein X is a sulfonyl radical or a carbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, The high temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: aromatic polysulfone consisting of recurring units of the formula: or aromatic polyetherimide consisting of recurring units of the formula: l
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公开(公告)号：DE68918397D1
公开(公告)日：1994-10-27
申请号：DE68918397
申请日：1989-10-25
Applicant: MITSUI TOATSU CHEMICALS
Inventor： TAMAI SHOJI , KAWASHIMA SABURO , OHTA MASAHIRO , IIYAMA KATSUAKI , OIKAWA HIDEAKI , OHKOSHI KOUJI , YAMAGUCHI AKIHIRO
IPC: C08G73/10
Abstract: The present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carring out condensation of 4,4 min - bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a diamine compound and/or tetracarboxylic acid dianhydride. The polyimides have a non-crystalline structure and exhibit excellent thermal resistance and processability.
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公开(公告)号：DE3888869D1
公开(公告)日：1994-05-11
申请号：DE3888869
申请日：1988-05-27
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OHTA MASAHIRO , KAWASHIMA SABURO , IIYAMA KATSUAKI , TAMAI SHOJI , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO
Abstract: The invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention consist of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high-temperature engineering polymer. The polyimide consists of recurring units of the following formula: wherein X is direct bond, thio radical, or o- or p-phenylene dicarbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, The high-temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: aromatic polysulfone consisting of recurring units of the formula: or aromatic polyetherimide consisting of recurring units of the formula:
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公开(公告)号：DE3788937D1
公开(公告)日：1994-03-10
申请号：DE3788937
申请日：1987-11-12
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OIKAWA HIDEAKI , KOGA NOBUHITO , IIYAMA KATSUAKI , KAWASHIMA SABURO , TAMAI SHOJI , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
IPC: C08G73/10
Abstract: Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability. The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives. The polyimide has recurring units of the following formula (I): wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage. The polyimide of this invention is prepared by reacting 4,4'-(p-phenylenedioxy)diphthalic dianhydride with an ether diamine having the following general formula (V): and successively imidizing the resultant polyamic acid. e
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Patent Agency Ranking
公开(公告)号：DE68905225D1
公开(公告)日：1993-04-15
申请号：DE68905225
申请日：1989-05-04
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OHTA MASAHIRO , IIYAMA KATSUAKI , KAWASHIMA SABURO , TAMAI SHOJI , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO
IPC: C08L79/08
Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of aromatic polyamideimide.The polyimide consists essentially of recurring units of the following formula: wherein X is and R is, for example, o
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公开(公告)号：DE68903181T2
公开(公告)日：1993-03-25
申请号：DE68903181
申请日：1989-03-13
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OHTA MASAHIRO , IIYAMA KATSUAKI , KAWASHIMA SABURO , TAMAI SHOJI , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO
IPC: C08L79/08
Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of polyphenylene sulfide and/or aromatic polysulfone and/or aromatic polyetherimide high-temperature engineering polymer. The polyimide consists essentially of recurring units of the following formula: y
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公开(公告)号：AU609898B2
公开(公告)日：1991-05-09
申请号：AU2471588
申请日：1988-11-04
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OHTA MASAHIRO , KAWASHIMA SABURO , TAMAI SHOJI , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO , KOBA TOMOHITO , NAKAKURA TOSHIYUKI , SAKAI HIDEO , MASUDA MISAO , KISHI SATORU , MARUKO CHIAKI
Abstract: This invention relates to a method for preparing polyimide having good heat-stability and excellent flowability in a molten state. The polymide is prepared by reacting aromatic diamines such as 4,4 min -bis(3-aminophenoxy)biphenyl, bis[4-(3-aminophenoxy)phenyl] ketone and bis [4-(3-aminophenoxy)phenyl] sulfone; tetracarboxylic dianhydrides such as pyromellitic dianhydride, 3,3 min ,4,4 min -benzophenonetetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl) ether dianhydride; and monoamines such as n-hexylamine, cyclohexylamine, aniline, 4-aminobenzophenone. The molar ratio of tetracarboxylic dianhydride : aromatic diamine : monoamine is 1:(0.9 to 1.0):(0.001 to 1.0). Another invention relates to polyimide composite materials which are excellent in mechanical strengths and processability. The materials contain the polyimide above prepared and fibrous reinforcing materials such as yarn, roving, tow, fabrics, mats and felts of glass fiber, carbon fibers or aromatic polyamide fibers.
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公开(公告)号：AU599325B2
公开(公告)日：1990-07-19
申请号：AU6122186
申请日：1986-06-30
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OHTA MASAHIRO , KAWASHIMA SABURO , SONOBE YOSHIHO , TAMAI SHOJI , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO
Abstract: This new flexible copper-clad circuit board consists of a copper foil bonded firmly and directly without an adhesive to a polyimide (1) film which is fluid at high temperature, the bonding being carried out at high temp.. The polyimide (1) has a repeat unit qwith the general formulae (I), (II), (III), etc. where R; nC-alkyl, nC-cycloalkyl, nC-aromatic, nC-condensed ring aromatic etc. n at least 2.
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公开(公告)号：AU597494B2
公开(公告)日：1990-05-31
申请号：AU1736388
申请日：1988-06-03
Applicant: MITSUI TOATSU CHEMICALS
Inventor： OHTA MASAHIRO , KAWASHIMA SABURO , TAMAI SHOJI , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO , IIYAMA KATSUAKI
IPC: C08L79/08
Abstract: Resin composition composed of 99.9 to 50 % by weight of a polyimide having a repeating unit of the formula as defined below and 0.1 to 50 % by weight of an aromatic polyamideimide are improved in heat resistance and mechanical strength and have the inherent properties of polyimide; where X indicates a direct bond or is -S- or and R is a tetravalent radical selected from the group consisting of aliphatic radicals having at least 2 carbon atoms, cycloaliphatic radicals, monocycloaromatic radicals and condensed polycycloaromatic radicals, and uncondensed polycycloaromatic radicals including aromatic radicals interconnected directly or through a cross-linkage.
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