公开(公告)号：JP2000288927A

公开(公告)日：2000-10-17

申请号：JP9994299

申请日：1999-04-07

Applicant: SONY CORP

Inventor： SATO SHUZO

IPC: B24B37/013 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  H01L21/304 ,  B24B37/04

Abstract: PROBLEM TO BE SOLVED: To provide a polished work free from defect by detecting the change in surface reflectance of a work to be polished, recognizing the unpolished part of the work on the basis of the detection value, and automatically generating and feeding back the polishing conditions of the unpolished part and the part except the unpolished part. SOLUTION: A polishing state measurement part 200 is formed of a detecting device 180 and a control device 190 electrically connected to the detecting device 180. The detecting device 180 detects the change of surface reflectance of a wafer 101. The control device 190 recognizes the unpolished part of the wafer 101 on the basis of the detection value from the detecting device 180, and automatically generates and feeds back the polishing conditions of the unpolished part and the part except the unpolished part. According to this, since the wafer 101 is polished while measuring its polished state, the whole surface of the wafer 101 can be polished so as to be free from under-polishing and minimized in over-polishing, and the polishing precision can be improved.

公开(公告)号：JPH10313043A

公开(公告)日：1998-11-24

申请号：JP12188197

申请日：1997-05-13

Applicant: SONY CORP

Inventor： OTORII SUGURU ,  SATO SHUZO

IPC: H01L21/683 ,  H01L21/68

Abstract: PROBLEM TO BE SOLVED: To make it possible to cool a precision component, which has difficulty in preventing cooling water from being leaked therein and is apt to be easily damaged by deformation without a leakage of the cooling water and without being deformed, by a method wherein a cooling water circulating pump is arranged on the side of a drainage path for returning cooling drain to a cooling water container. SOLUTION: A cooling water circulating pump 15 consists of a vacuum pump for liquid use, for example, and by actuating the pump 15, the pump 15 sucks out cooling water through the side of a water inlet 15a and discharges the cooling water through the side of a water outlet 15b. That is, by enabling the pump 15 to position on the side of the drainage path of a heat generating unit 12, a discharge path, which reaches from a cooling water container 11 to the pump 15 using a discharge pipe 14 through the unit 12 which is connected with an introducing path using an introducing tube 13, can be put in the state of a negative pressure. Accordingly, the cooling water L is sucked from the container 11 into the pump 15 via the unit 12 and is discharged from the pump 15 into the container 11. As a result, an object of cooling can be cooled without a leakage of the cooling water and without being deformed.

公开(公告)号：JPH10202457A

公开(公告)日：1998-08-04

申请号：JP1124097

申请日：1997-01-24

Applicant: SONY CORP

Inventor： OTORII SUGURU ,  SATO SHUZO

IPC: B23Q3/12 ,  B24B45/00

Abstract: PROBLEM TO BE SOLVED: To provide a chuck device capable of easily positioning and mounting a tool on the end of a main spindle, and having the capability of being detached. SOLUTION: A sloping groove 46 is formed on the inner surface of the recess 45 of a disc type tool 43, while the tool holder 42 of a main spindle is provided with a taper pin 56 as well as an antirotation pin 64. In this case, a ball 59 is made to become engaged with the sloping groove 46 via the taper pin 56 on the elastic restoring force of a spring 65. Also, the antirotation pin 64 is engaged with an antirotation countersunk hole 47 of the tool 43.

公开(公告)号：JPH10156724A

公开(公告)日：1998-06-16

申请号：JP31767096

申请日：1996-11-28

Applicant: SONY CORP

Inventor： HAYAKAWA HIDEAKI ,  SATO SHUZO ,  KOMURO YOSHIAKI

IPC: B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  B24D3/34 ,  H01L21/304 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To improve uniformity and repeatability of a polishing system by providing a surface layer large in the modulus of longitudinal elasticity, a lower layer small in the modulus of longitudinal elasticity and an intermediate layer larger in the modulus of elasticity than the lower layer. SOLUTION: This abrasive cloth ideally used for a semiconductor substrate polishing process has structure provided with a surface layer A with the large modulus of longitudinal elasticity EA, a lower layer B with the small modulus of longitudinal elasticity EB, and an inter-mediate layer M provided between both layers A, B and having the modulus of longitudinal elasticity EM larger than that of the lower layer B. That is, the surface layer A is so designed that the elastic deformation quantity is reduced to the extent of forming no defect on the surface after polishing, and the lower layer B is so designed as not to lower dynamic compliance of a polishing system. When the thickness of the A-layer, B-layer and M-layer are respectively made lA, lB, lM and the moduli of elasticity are made EA, EB, EM, it is so formed as to satisfy the relation of lM>[lA(E'-EA)/EA+lB(E'-EB)/EB] [(EM-E')/EM].

公开(公告)号：JPH1034528A

公开(公告)日：1998-02-10

申请号：JP18082096

申请日：1996-07-10

Applicant: SONY CORP

Inventor： SATO SHUZO ,  OTORII SUGURU ,  KOMURO YOSHIAKI ,  HAYAKAWA HIDEAKI

IPC: B24B37/07 ,  B24B37/10 ,  H01L21/304 ,  B24B37/04

Abstract: PROBLEM TO BE SOLVED: To simultaneously satisfy flatness of the polished object surface and uniformity of polishing quantity within the polished object surface by holding a polished object by a holding means, and bringing a ring-like polishing pad having a ring-like end face, into sliding contact with the surface of the held polished object while rotating the ring-like polishing pad. SOLUTION: At the time of performing polishing work, a table 6 with a wafer 2 suction-placed thereon is rotated in association with the rotation of a surface table 34 by a spindle motor or the like, and a slider 52 is moved in an X-axis direction so that a polishing pad 8 is positioned above the wafer 2. At this time, slurry is discharged from a nozzle hole formed at the central part of the surface table 34, and fed to the inner peripheral side of the ring-like polishing pad 8 by centrifugal force based on rotation. In the state of the ring- like polishing pad 8 being pressed to the polished object surface of the wafer 2, the slider 52 is reciprocated in a specified cycle and with specified vibration, and the wafer 2 is put in traverse motion in relation to the polishing pad 8 to perform mechanochemical polishing of the polished object surface.

公开(公告)号：JPH0991735A

公开(公告)日：1997-04-04

申请号：JP27059395

申请日：1995-09-25

Applicant: SONY CORP

Inventor： SAITO KIMIHIRO ,  SATO SHUZO ,  KUBO TAKESHI

IPC: G11B7/125 ,  G11B7/135 ,  H01L31/02 ,  H01L31/12 ,  H01S5/00 ,  H01S3/18

Abstract: PROBLEM TO BE SOLVED: To reduce the cost and to stabilize operation by integrally forming a correction means for correcting astigmatism of a light beam on an inner surface of a cover covering an upper surface of a semiconductor substrate, a light emitting element, a microprism and a photodetector unit. SOLUTION: The light beam outgoing from a semiconductor laser element 13C of a light receiving/emitting element 13 is made incident on the slope of the microprism 13d, and a partial beam advances into the microprism 13d, and after it emits from the end surface of the opposite side of the microprism 13d, it is reflected by a third reflection surface 14d to be made incident on a third photodetector unit 13g on a first semiconductor substrate 13a. Thus, the emission light quantity of the semiconductor laser element 13c is monitored. In such a case, since return light from an optical disk 15 isn't made incident on the third photodetector unit 13g, the interference due to the return light is eliminated, and the reproducing operation of the optical pickup 16 is stabilized and improved.

公开(公告)号：JPH091457A

公开(公告)日：1997-01-07

申请号：JP15127095

申请日：1995-06-19

Applicant: SONY CORP

Inventor： SATO SHUZO ,  KOMURO YOSHIAKI

IPC: B24B53/00 ,  B24D7/14

Abstract: PURPOSE: To provide a wheel dresser capable of giving a high truing capacity with large sized grains and a satisfactory dressing effect with small sized grains at the same time. CONSTITUTION: A ring-like grind stone part 3 provided in the end face portion of a rotary wheel 2 is composed of a first ring grind stone 3a and a second ring grind stone 3b provided inside the first ring grind stone 3a. Also, the sizes of abrasive grains of the respective ring grind stones 3a, 3b are made different from each other.

公开(公告)号：JPH06328336A

公开(公告)日：1994-11-29

申请号：JP14424393

申请日：1993-05-24

Applicant: SONY CORP

Inventor： SATO SHUZO

IPC: B23Q3/02 ,  B23Q3/08 ,  B23Q3/154

Abstract: PURPOSE:To precisely control the accuracy of a work chucking face by providing a position regulating means for making a chucking device float to a base plate to regulate its position. CONSTITUTION:Three supporting members 16, 16, 18 compose a position regulating means for making a chucking device float to a magnet chuck table 40 functioning as a base plate to regulate its position. The two supporting members 16 severally have a jack bolt 16b and an operation section 16a to operate the jack bolt 16b, and moreover the lower end of the jack bolt 16a is formed as a semi-spherical supporting end 16c. An operator manually rotates the operation section 16a to regulate the inclination of a main body 12 on the basis of the upper face 47 of the magnet chuck table 40.

公开(公告)号：JPH06304866A

公开(公告)日：1994-11-01

申请号：JP12078093

申请日：1993-04-23

Applicant: SONY CORP

Inventor： ZUSHI KINYA ,  SATO SHUZO

IPC: B24B53/00

Abstract: PURPOSE:To provide performing stable grinding work without deteriorating grinding efficiency even in the case of grinding work over a long time. CONSTITUTION:In a grinding device 10 provided with electrolytic dressings so that a grinding wheel 14 is driven to be rotated by a motor 13, to perform grinding work of a workpiece and also dressing thereof by the electrolytic dressings 15, 16, 17, the grinding device 10 is constituted so as to control a dressing current based on a motor current.

公开(公告)号：JPH05309566A

公开(公告)日：1993-11-22

申请号：JP12827392

申请日：1992-04-21

Applicant: SONY CORP

Inventor： SATO SHUZO

IPC: B24B55/02

Abstract: PURPOSE:To feed a sufficient coolant between a workpiece and a cup wheel on a finishing machine using the cup wheel. CONSTITUTION:A coolant pipe 24 is penetrated in a rotary main shaft 4, and a coolant nozzle 25 opening to the inner circumference of a cup wheel 5 is provided in a radial form at the tip of the collant pipe 24. And a wheel cover 26 is provided surrounding the cup wheel 5, and the coolant is injected between the coolant cover 26 and the cup wheel 5 from a coolant feeding port 27 formed on the wheel cover 26.