公开(公告)号：US5813595A

公开(公告)日：1998-09-29

申请号：US737183

申请日：1997-03-07

Applicant: Hans-Jurgen Albrecht ,  Gunter-Werner Strick

Inventor： Hans-Jurgen Albrecht ,  Gunter-Werner Strick

IPC: B23K31/02 ,  B23K1/08 ,  B23K3/08 ,  H05K3/34

CPC classification number: B23K3/085 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/081 ,  H05K2203/086 ,  H05K2203/1121

Abstract: A method is provided for wave-soldering printed circuit boards. In order to obtain wave-soldered printed circuit boards with smallest possible number of solder globules, after the passage on the wave of solder, the printed circuit boards are further artificially cooled at an approximately constant time-temperature gradient of 20 K/sec.

Abstract translation: PCT No.PCT / DE95 / 00441 Sec。 371日期1997年3月7日 102（e）1997年3月7日PCT 1995年3月22日PCT PCT。 WO95 / 30509 PCT公开号 日期1995年11月16日提供了一种用于波峰焊印刷电路板的方法。 为了获得具有最小可能数量的焊球的波焊焊接印刷电路板，在焊料波通过之后，将印刷电路板进一步人为地以20K /秒的恒定时间温度梯度人为地冷却。

公开(公告)号：US5792814A

公开(公告)日：1998-08-11

申请号：US906316

申请日：1997-08-05

Applicant: Tetsuya Oishi ,  Kazuo Sugazaki ,  Jin Suzuki

Inventor： Tetsuya Oishi ,  Kazuo Sugazaki ,  Jin Suzuki

IPC: C08F8/00 ,  C08F8/08 ,  C08F8/28 ,  C08F8/30 ,  C08G12/00 ,  C08G59/06 ,  C08G61/00 ,  C08G63/91 ,  C08G65/48 ,  C08G69/48 ,  C08K5/00 ,  C08L23/26 ,  C08L63/00 ,  C08L67/02 ,  C08L71/12 ,  H05K3/34

CPC classification number: C08L71/126 ,  C08F8/00 ,  C08F8/08 ,  C08F8/28 ,  C08F8/30 ,  C08F8/40 ,  C08G12/00 ,  C08G59/063 ,  C08G61/00 ,  C08G63/914 ,  C08G65/485 ,  C08G69/48 ,  C08K5/0066 ,  C08L23/26 ,  C08L63/00 ,  C08L67/02 ,  B23K2201/42 ,  H05K2201/10734 ,  H05K2203/081 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K2203/176 ,  H05K3/3436 ,  H05K3/3494

Abstract: There are herein disclosed a method for preparing a modified resin which comprises thermal/reaction by the use of a norbornenyl group-containing compound typified by norbornenecarboguanamine or its derivative, a method for preparing an epoxy-modified resin which comprises the step of reacting the above-mentioned modified resin and an epoxide, a flame-retarding method, a thermal stabilization method, a compatibilizing method and a surface modification method which comprise utilizing the modified resin, as well as a coating resin composition and an adhesive resin composition containing the modified resin. According to the preparation methods of the present invention, the deterioration of a material scarcely occurs, and a functional group which is excellent in flame retardancy, thermal stability, compatibility and the like can be introduced to the resins. By the utilization of these techniques, there can be obtained a flame-retardant material having a good char formability, a thermally stable material whose molded articles can inhibit heat deterioration, a material excellent in miscibility between different kinds of resins, a surface-modified material which is excellent in adhesion and coating properties and the like.

公开(公告)号：US5770835A

公开(公告)日：1998-06-23

申请号：US779523

申请日：1997-01-07

Applicant: Seiki Sakuyama ,  Hiroki Uchida ,  Isao Watanabe

Inventor： Seiki Sakuyama ,  Hiroki Uchida ,  Isao Watanabe

IPC: B23K1/005 ,  B23K1/08 ,  B23K35/02 ,  B23K35/36 ,  H05B3/28 ,  H05K3/34 ,  F27B9/06 ,  F27D11/02 ,  H05B3/20

CPC classification number: B23K1/0053 ,  B23K1/08 ,  B23K35/025 ,  B23K35/3612 ,  H05B3/28 ,  H05B3/283 ,  H05B3/286 ,  H05K3/3494 ,  B23K2201/42 ,  Y10T29/49083

Abstract: In accordance with the present invention, there is provided a soldering process comprising the steps of: providing in a furnace first and second heaters each adapted to emit infrared energy; setting a printed circuit boad, which has a solder paste and an electronic component thereon, in the furnace; heating the printed circuit boad with the first heater; and heating the electronic component with the second heater; wherein the first and second heaters have different radiation spectra such that infrared energy irradiated by the first heater is more absorbed by the printed circuit board and less absorbed by the electronic component than that irradiated by the second heater. The present invention also provides a soldering apparatus for use in such soldering process.

Abstract translation: 根据本发明，提供了一种焊接方法，其包括以下步骤：在炉中设置每个适于发射红外能量的第一和第二加热器; 在炉中设置印刷电路板，其上具有焊膏和电子部件; 用第一个加热器加热印刷电路; 以及用所述第二加热器加热所述电子部件; 其中所述第一加热器和所述第二加热器具有不同的辐射光谱，使得由所述第一加热器照射的红外能量被所述印刷电路板吸收，并且比由所述第二加热器照射的红外能量被电子部件吸收的吸收少。 本发明还提供一种用于这种焊接工艺的焊接装置。

公开(公告)号：US5713997A

公开(公告)日：1998-02-03

申请号：US513396

申请日：1995-08-10

Applicant: Takeo Kuramoto ,  Masataka Watabe ,  Satoshi Noda ,  Takashi Shoji ,  Takekazu Sakai

Inventor： Takeo Kuramoto ,  Masataka Watabe ,  Satoshi Noda ,  Takashi Shoji ,  Takekazu Sakai

IPC: B23K3/06 ,  B23K35/02 ,  B23K35/36 ,  H01L23/495 ,  H05K3/28 ,  H05K3/34 ,  C09D5/00

CPC classification number: H05K3/282 ,  B23K3/0607 ,  B23K3/0623 ,  B23K35/0244 ,  B23K35/3613 ,  B23K35/3615 ,  H01L23/49582 ,  H05K3/3484 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2924/0002 ,  H05K2201/10984 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/0522 ,  H05K2203/0557 ,  H05K2203/0591 ,  H05K2203/124 ,  Y10T428/12556

Abstract: A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

Abstract translation: 在诸如印刷电路板的金属电路板的焊盘和电子部件的引线框架的金属表面上形成焊料膜的方法，其能够形成精确和精细的图案，并且包括仅选择性地赋予粘合性 通过粘性层形成溶液将金属表面的预定部分粘附到所得粘性部分上，然后通过加热熔化焊料从而形成焊料膜。

公开(公告)号：US5704535A

公开(公告)日：1998-01-06

申请号：US801996

申请日：1997-02-18

Applicant: Curtis C. Thompson, Sr.

Inventor： Curtis C. Thompson, Sr.

IPC: B23K3/06 ,  H05K3/34 ,  B23K3/00

CPC classification number: B23K3/0653 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/0557 ,  H05K3/3452

Abstract: A shield (50) for use in wave soldering processes to selectively affix solder to an area of circuit board (20), having one or more electronic components (21) on the solder side of the board, is disclosed. Shield (50) includes a generally planar base member (51) of low thermal conductivity which forms the foundation of shield (50). Marginally disposed registration ridges (54) are formed on the upper surface (52). Registration ridges (54) serve to hold circuit board (20) against shield (50) in a fixed position. Ridges (54) are positioned to closely receive the peripheral edges of circuit board (20). One or more solder flow openings (56) are formed through base member (51) extending from upper side (52) to lower side (53). Solder flow openings (56) are positioned to align with the selected areas of circuit board (20) to which solder is to be affixed. One or more recesses (55) are provided in the upper surface (52) of base member (51) to receive and shield electronic components (21).

Abstract translation: 公开了一种用于波峰焊工艺的屏蔽件（50），用于选择性地将焊料粘贴到电路板（20）的区域上，在电路板的焊料侧具有一个或多个电子部件（21）。 屏蔽（50）包括形成屏蔽（50）的基础的低热导率的大致平面的基底构件（51）。 在上表面（52）上形成有边缘布置的配准脊（54）。 对齐脊（54）用于将电路板（20）抵靠屏蔽件（50）固定在固定位置。 定位脊（54）以紧密接收电路板（20）的外围边缘。 一个或多个焊剂流动开口（56）形成为从上侧（52）向下侧（53）延伸的基底构件（51）。 焊接流动开口（56）被定位成与要被固定焊料的电路板（20）的选定区域对齐。 一个或多个凹部（55）设置在基部构件（51）的上表面（52）中，以接纳和屏蔽电子部件（21）。

公开(公告)号：US5702051A

公开(公告)日：1997-12-30

申请号：US640758

申请日：1996-05-07

Applicant: Helmut Walter Leicht

Inventor： Helmut Walter Leicht

IPC: B25J7/00 ,  B23K1/018 ,  B23K3/00 ,  H05K3/34 ,  B23K1/015

CPC classification number: B23K1/018 ,  B23K2201/42

Abstract: The invention provides a device for moving an object by means of thermal change in shape or volume, such that the object is moved when a predetermined process temperature has been reached. Preferably the device can be used in a soldering system on a printed circuit board. The advantage of the invention lies in a temperature-controlled movement of the object with a high-level precision that, for example, ensures a very sparing unsoldering.

Abstract translation: PCT No.PCT / EP94 / 03645 Sec。 371日期：1996年5月30日 102（e）日期1996年5月30日PCT 1994年11月7日PCT PCT。 公开号WO95 / 13161 日期1995年5月18日本发明提供一种通过形状或体积的热变化来移动物体的装置，使得当达到预定的工艺温度时物体被移动。 优选地，该装置可以用在印刷电路板上的焊接系统中。 本发明的优点在于以高精度的物体的温度控制运动，例如，确保非常节省的绝缘。

公开(公告)号：US5699951A

公开(公告)日：1997-12-23

申请号：US577157

申请日：1995-12-22

Applicant: Hideaki Miyoshi

Inventor： Hideaki Miyoshi

IPC: H01L21/60 ,  B23K20/00 ,  H01L21/00

CPC classification number: H01L24/85 ,  B23K20/004 ,  H01L24/78 ,  B23K2201/42 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/78308 ,  H01L2224/78344 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14

Abstract: The present invention discloses a wire bonder that does not require bonding tool replacement to be performed by an experienced worker, is not bothersome and can be completed in an extremely short time, while also enabling time management of the degree of wear of the bonding tool and so forth to be performed reliably, so as to realize improved work efficiency and yield, as well as being able to demonstrate various other effects. In addition, the present invention also discloses a bonding arm and bonding tool that contribute to the achieving of these effects. The above effects are obtained by adding a tool replacement device that removes a used bonding tool (capillary) installed in a bonding arm and installs a new bonding tool. In addition, the above effects are obtained with respect to the bonding arm and bonding tool by forming a tapered surface that guides their mutual insertion.

Abstract translation: 本发明公开了一种不需要由经验丰富的工人进行的焊接工具更换的引线接合机，不麻烦，可以在极短的时间内完成，同时还能够对焊接工具的磨损程度进行时间管理， 能够可靠地进行，从而能够提高工作效率和产量，并且能够表现出各种其他效果。 此外，本发明还公开了一种有助于实现这些效果的接合臂和接合工具。 上述效果是通过添加去除粘合臂中使用的已使用的粘合工具（毛细管）的工具更换装置并安装新的粘合工具而获得的。 此外，通过形成引导其相互插入的锥形表面，相对于接合臂和接合工具获得上述效果。

公开(公告)号：US5630542A

公开(公告)日：1997-05-20

申请号：US341199

申请日：1994-12-05

Applicant: Adrianus J. M. Hendrikx

Inventor： Adrianus J. M. Hendrikx

IPC: B23K3/06 ,  H05K3/34

CPC classification number: H05K3/3468 ,  B23K3/0653 ,  B23K2201/42 ,  H05K2201/2027

Abstract: The invention relates to a soldering apparatus, comprising a solder vessel; at least one soldering tower located in said solder vessel; transport means for transporting objects to be soldered over said soldering tower; solder wave generating means for generating a solder wave emerging from the apex of the soldering tower and contacting the objects to be soldered, the soldering tower comprising a weir such that at least a part of the solder wave flows parallel to the direction of movement of the objects to be soldered over said weir; and guide means for guiding said part of the solder wave such that the solder wave leaves the soldered object substantially abruptly. As a consequence of said feature the stream of solder is abruptly guided away from the printed circuit board, so that the possibilities for developing short circuits on the printed circuit board are substantially reduced.

Abstract translation: 本发明涉及一种焊接装置，包括焊料容器; 位于所述焊料容器中的至少一个焊接塔; 用于运输通过所述焊接塔焊接的物体的运输装置; 焊接波产生装置，用于产生从焊接塔的顶点出现并与待焊接的物体接触的焊波，所述焊接塔包括堰，使得焊波的至少一部分平行于所述焊料的移动方向流动 对象要焊接在所述堰上; 以及引导装置，用于引导焊波的所述部分，使得焊波基本上突然离开焊接对象。 作为所述特征的结果，焊料流突然地被引导离开印刷电路板，使得在印刷电路板上发展短路的可能性显着降低。

公开(公告)号：US5617988A

公开(公告)日：1997-04-08

申请号：US608544

申请日：1996-02-28

Applicant: Lambertus P. C. Willemen

Inventor： Lambertus P. C. Willemen

IPC: B23K3/06 ,  H05K3/34

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: The invention relates to a device for measuring the height of a solder wave in a soldering apparatus which comprises a solder bath and which is provided with at least one solder tower for generating a solder wave and a pump connected to the solder tower, wherein the measuring device comprises: means for measuring the liquid pressure in the connection between the pump and the solder tower. As a result of these steps it is possible to measure accurately the pressure of the solder moving out of the pump to the solder tower. This pressure is in any case a good measure for the height of the solder wave. According to a first preferred embodiment the means for measuring the liquid pressure comprise a measuring vessel joined to the connection between pump and tower and communicating at its top with the atmosphere, the upper edge of which vessel is located higher than the outflow opening of the solder tower.

Abstract translation: 本发明涉及一种用于测量焊接装置中的焊波高度的装置，其包括焊料槽，并且设置有至少一个用于产生焊波的焊料塔和连接到焊料塔的泵，其中测量 装置包括：用于测量泵和焊料塔之间的连接中的液体压力的装置。 作为这些步骤的结果，可以精确地测量从泵流出到焊料塔的焊料的压力。 这种压力在任何情况下都是焊波高度的一个很好的测量。 根据第一优选实施例，用于测量液体压力的装置包括连接到泵和塔架之间的连接并且在其顶部与大气连通的测量容器，其上边缘位于高于焊料的流出开口 塔。

公开(公告)号：US5593080A

公开(公告)日：1997-01-14

申请号：US489616

申请日：1995-06-12

Applicant: Yasuhiro Teshima ,  Tetsuo Kurokawa

Inventor： Yasuhiro Teshima ,  Tetsuo Kurokawa

IPC: B41N1/24 ,  B23K3/06 ,  B41M1/12 ,  H05K3/12 ,  H05K3/34 ,  B23K37/06

CPC classification number: B23K3/0638 ,  H05K3/1225 ,  H05K3/3484 ,  B23K2201/42 ,  H05K2201/09727 ,  H05K2201/10689 ,  H05K2203/0545 ,  H05K3/1216 ,  H05K3/3457 ,  Y10T29/49144

Abstract: A mask for printing solder paste includes a mask plate, and first mask holes which are formed in the mask plate and have a first size, and second mask holes which are formed in the mask plate and have a second size smaller than the first size. The mask plate has a first region having the first mask holes, and a second region having the second mask holes. The mask plate has a first thickness in the first region, and a second thickness in the second region. The second thickness is smaller than the first thickness.

Abstract translation: 用于印刷焊膏的掩模包括掩模板和形成在掩模板中并具有第一尺寸的第一掩模孔和形成在掩模板中并且具有小于第一尺寸的第二尺寸的第二掩模孔。 掩模板具有具有第一掩模孔的第一区域和具有第二掩模孔的第二区域。 掩模板在第一区域具有第一厚度，在第二区域具有第二厚度。 第二厚度小于第一厚度。