Abstract:
An apparatus for scanning a laser beam to examine the surface of a semiconductor wafer comprises a stage (20) onto which a semiconductor wafer (11) is mounted and a laser beam scanning unit (26, 28, 30) for repeatedly rectilinearly scanning a laser beam in a predetermind direction on the semiconductor wafer (11). This scanning apparatus further has a drive unit (22, 24, 33) for rotating the semiconductor wafer (11) and for moving the semiconductor wafer (11) by only a predetermined distance in the predetermined direction every rotation of the wafer. The laser beam scanning unit (26, 28, 30) rectilinearly scans the laser beam at a swing width of a predetermined amount.
Abstract:
An apparatus for scanning a laser beam to examine the surface of a semiconductor wafer comprises a stage (20) onto which a semiconductor wafer (11) is mounted and a laser beam scanning unit (26, 28, 30) for repeatedly rectilinearly scanning a laser beam in a predetermind direction on the semiconductor wafer (11). This scanning apparatus further has a drive unit (22, 24, 33) for rotating the semiconductor wafer (11) and for moving the semiconductor wafer (11) by only a predetermined distance in the predetermined direction every rotation of the wafer. The laser beam scanning unit (26, 28, 30) rectilinearly scans the laser beam at a swing width of a predetermined amount.
Abstract:
Irregularities of a coating on a substrate in which the coating includes optical scattering centers can be detected by irradiating the coating with polarized light and examining light from the coating through a filter which removes light having the same polarization as the initial beam. Light scattered by the optical scattering centers is transmitted through the filter, while specularly reflected light from the top surface of the coating, from the substrate exposed by gaps in the coating, or reflected by alien material on the coating is filtered out. As a result irregularities can be detected as intensity minima of the transmitted radiation.
Abstract:
Irregularities of a coating on a substrate in which the coating includes optical scattering centers can be detected by irradiating the coating with polarized light and examining light from the coating through a filter which removes light having the same polarization as the initial beam. Light scattered by the optical scattering centers is transmitted through the filter, while specularly reflected light from the top surface of the coating, from the substrate exposed by gaps in the coating, or reflected by alien material on the coating is filtered out. As a result irregularities can be detected as intensity minima of the transmitted radiation.
Abstract:
PURPOSE:To perform the quantitative detection of a flaw at a high speed with high accuracy, by scanning an object to be inspected in a concentric circular pattern and condensing the scattered light thereof by an integrating sphere while comparing the peak value thereof with a specific level at every definite period. CONSTITUTION:An object 8 to be inspected is sucked to the turntable 14 pivotally supported by a bearing body 15 by a sucking part 20 and the table 14 is rotated by a motor 16 while the bearing body 15 is provided so as to be capable of advancing and retracting in the diameter direction by a feed part 18 and a laser beam oscillation part 28 is connected to the integrating sphere 27 arranged in close vicinity to the object 8 to be inspected to make it possible to irradiate the object 8 to be inspected. The scattered reflected light thereof is received by a photoelectric converter 29 to be converted photoelectrically and irradiates the predetermined radius position of the object 8 to be inspected on the rotating table 14 to calculate the average valve VA of the output of the converter 29 at every predetermined rotary angle while a threshold level is set on the basis of this average value VA by CPU40 and compared with the peak value by a peak detection part 33 at every definite period to detect a flaw.
Abstract:
A laser scattering defect inspection system includes: a stage unit that rotates a workpiece W and transports the workpiece W in one direction; a laser light source that emits a laser beam LB toward the workpiece W mounted on the stage unit; an optical deflector that scans the laser beam LB emitted from the laser light source on the workpiece W; an optical detector that detects the laser beam LB scattered from the surface of the workpiece W; a storage unit that stores defect inspection conditions for each inspection step of a manufacturing process of the workpiece W, where the conditions include the rotation speed and the moving speed of the workpiece W by the stage unit, the scan width on the workpiece W and the scan frequency by the optical deflector; and a control unit that reads the defect inspection conditions stored for each inspection step in the storage unit and controls the driving of the stage unit and the optical deflector under the conditions.