公开(公告)号：EP2628824A1

公开(公告)日：2013-08-21

申请号：EP12155801.9

申请日：2012-02-16

Applicant: Atotech Deutschland GmbH

Inventor： Janssen, Boris Alexander

IPC: C23C18/36 ,  H05K3/24

CPC classification number: H05K1/09 ,  B05D5/12 ,  C23C18/16 ,  C23C18/1633 ,  C23C18/36 ,  C23C18/50 ,  H05K1/028 ,  H05K3/22 ,  H05K3/244 ,  H05K2201/032

Abstract: The present invention relates to a method for electroless deposition of a bendable nickel-phosphorous alloy layer onto flexible substrates such as flexible printed circuit boards and the like. The nickel-phosphorous alloy layer is deposited from an aqueous plating bath comprising nickel ions, hypophosphite ions, at least one complexing agent and a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors. The nickel-phosphorous alloy layers obtained have a columnar microstructure oriented perpendicular to the flexible substrate and are sufficiently bendable.

Abstract translation: 本发明涉及一种将可弯曲的镍 - 磷合金层无电沉积到诸如柔性印刷电路板等柔性基板上的方法。 镍 - 磷合金层由包含镍离子，次亚磷酸根离子，至少一种络合剂和选自甲醛和甲醛前体的晶粒细化添加剂的含水电镀浴沉积。 获得的镍 - 磷合金层具有垂直于柔性基板的柱状微结构，并且是足够弯曲的。

公开(公告)号：WO2015185412A1

公开(公告)日：2015-12-10

申请号：PCT/EP2015/061709

申请日：2015-05-27

Applicant: CONTI TEMIC MICROELECTRONIC GMBH

Inventor： BOCK, Johannes ,  REBELEIN, Andreas ,  SCHULZE, Andreas ,  VÖGERL, Andreas

IPC: H05K1/03 ,  H05K3/28 ,  H05K1/18 ,  H05K3/02 ,  H05K3/34 ,  H05K3/20 ,  H05K3/24

CPC classification number: H05K3/4644 ,  C25D3/12 ,  C25D3/30 ,  C25D3/48 ,  C25D3/562 ,  C25D3/60 ,  C25D3/62 ,  C25D7/0614 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/02 ,  H05K3/025 ,  H05K3/202 ,  H05K3/24 ,  H05K3/241 ,  H05K3/244 ,  H05K3/281 ,  H05K3/285 ,  H05K3/341 ,  H05K3/3447 ,  H05K2201/032 ,  H05K2201/0355 ,  H05K2203/0723

Abstract: Die vorliegende Erfindung betrifft ein Verfahren zum Herstellen einer Folienanordnung (100), wobei das Verfahren die folgenden Verfahrensschritte umfasst: Strukturieren (S1) einer auf einer Trägerfolienoberseite (11) einer Trägerfolie (10) aufgebrachten oder aufzubringenden Leitfolie (20); Beschichten (S2) einer Leitfolienoberseite (21) der strukturierten Leitfolie (20) mit einer Schutzschicht (30); und Auflaminieren (S3) einer Deckfolie (50) auf die Trägerfolienoberseite (11) und auf eine Schutzschichtoberseite (21) der Schutzschicht (30) nach dem Beschichten (S2).

Abstract translation: 本发明涉及一种用于制造薄膜结构（100），所述方法包括以下步骤：施加或（10）施加的导电箔（20）的图案化的（S1）上的载体箔的载体箔上表面（11）; 涂层结构化导电箔（20）的保护层的Leitfolienoberseite的（S2）（21）（30）; 和层压（S3）所述载体箔顶表面（11）和保护层（30）的涂层（S2）后的保护膜的顶侧（21）上的覆盖膜（50）。

公开(公告)号：WO2015144443A1

公开(公告)日：2015-10-01

申请号：PCT/EP2015/055201

申请日：2015-03-12

Applicant: ATOTECH DEUTSCHLAND GMBH

Inventor： NISHIGAWA, Tadahiro ,  HIGUCHI, Jun ,  ISHIKAWA, Hitoshi

IPC: C25D5/34 ,  C25D5/54 ,  H05K3/42 ,  C25D3/38

CPC classification number: C25D5/34 ,  C25D3/38 ,  C25D5/56 ,  H05K1/0296 ,  H05K3/424 ,  H05K3/427 ,  H05K3/467 ,  H05K2201/032 ,  H05K2201/0329 ,  H05K2203/0793 ,  H05K2203/0796

Abstract: In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, said insulator outer surface and said copper layer outer surface are simultaneously subjected to (1) a process comprising treatment with an alkali metal hydroxide solution, (2) a process comprising treatment with an alkaline aqueous solution containing an aliphatic amine, (3) a process comprising treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt% and a pH of 8 to 1, (4) a process comprising treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polysty-renesulphonic acid, and (5) a process comprising copper electroplating, which are implemented sequentially.

Abstract translation: 在包括绝缘体和层叠在绝缘体的一部分上的铜层的印刷电路板的衬底中，所述绝缘体外表面和所述铜层外表面同时经受（1）包括用碱金属氢氧化物溶液处理的工艺， （2）包括用含有脂族胺的碱性水溶液处理的方法，（3）包括用高锰酸盐浓度为0.3-3.5重量％和pH为8-1的碱性水溶液处理的方法，（4） 包括用含有噻吩化合物的酸性微乳液水溶液和聚苯乙烯磺酸的碱金属盐进行处理的方法，以及（5）依次实施铜电镀工艺。

公开(公告)号：WO2015103362A1

公开(公告)日：2015-07-09

申请号：PCT/US2014/072936

申请日：2014-12-31

Applicant: ALPHA METALS, INC. ,  RIBAS, Morgana, De Avila ,  RAUT, Rahul ,  CUCU, Traian, Cornel ,  YONG, Shu, Tai

Inventor： RIBAS, Morgana, De Avila ,  RAUT, Rahul ,  CUCU, Traian, Cornel ,  YONG, Shu, Tai ,  SARKAR, Siuli ,  VENKATAGIRIYAPPA, Ramakrishna, Hosur

IPC: B23K35/362

CPC classification number: B23K35/362 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  H05K1/09 ,  H05K1/111 ,  H05K9/0024 ,  H05K2201/032

Abstract: Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.

Abstract translation: 无松动的热固性助焊剂配方，用于增强焊点的机械可靠性。 根据一个或多个方面，本文所示和描述的焊膏赋予与液滴冲击，热循环，热冲击，剪切强度，弯曲强度性能和/或其它热量中的至少一种相关的改进或增强的焊点性能 机械性能属性。

公开(公告)号：WO2014131071A3

公开(公告)日：2014-10-23

申请号：PCT/AT2014050044

申请日：2014-02-27

Applicant: AUSTRIA TECH & SYSTEM TECH

Inventor： STAHR JOHANNES ,  TUOMINEN MIKAEL

IPC: H05K1/18 ,  H05K3/32 ,  H05K3/46

CPC classification number: H05K3/4611 ,  H05K1/185 ,  H05K1/188 ,  H05K3/30 ,  H05K3/323 ,  H05K3/46 ,  H05K2201/032 ,  H05K2203/063 ,  H05K2203/068

Abstract: In a semi-finished product (1) for the production of a printed circuit board, the semi-finished product (1) comprising a plurality of insulating layers (3) of a prepreg material and conductive layers (2, 2') of a conductive material and further comprising at least one electronic component (4) embedded in at least one insulating layer (3) the at least one electronic component (4) is attached to a corresponding conductive layer (2) by the aid of an Anisotropic Conductive Film (6) and the Anisotropic Conductive Film (6) as well as the prepreg material are in an unprocessed state. The method for producing a printed circuit board comprises the following steps: Providing at least one conductive layer (2), Applying an Anisotropic Conductive Film (6) on the conductive layer (2), Affixing at least one electronic component (4) on the Anisotropic Conductive Film (6), Embedding the electronic component (4) in at least one insulating layer (3) of prepreg material to obtain a semi-finished product (1), Laminating the semi-finished product (1) to process the prepreg material and the Anisotropic Conductive Film (6).

Abstract translation: 在用于生产印刷电路板的半成品（1）中，半成品（1）包括多个预浸料材料的绝缘层（3）和导电层（2,2'）， 导电材料，并且还包括嵌入在至少一个绝缘层（3）中的至少一个电子部件（4），所述至少一个电子部件（4）借助于各向异性导电膜附着到相应的导电层（2） （6）和各向异性导电膜（6）以及预浸料材料处于未加工状态。 制造印刷电路板的方法包括以下步骤：提供至少一个导电层（2），在导电层（2）上施加各向异性导电膜（6），将至少一个电子部件（4） 各向异性导电膜（6）将电子部件（4）嵌入到预浸料坯的至少一个绝缘层（3）中以获得半成品（1），对半成品（1）进行层压以加工预浸料 材料和各向异性导电膜（6）。

公开(公告)号：WO2014161501A1

公开(公告)日：2014-10-09

申请号：PCT/CN2014/074719

申请日：2014-04-03

Applicant: NUOVO FILM INC.

Inventor： POON, Hakfei

IPC: H01B5/14

CPC classification number: H01B13/30 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/02 ,  H01B1/22 ,  H01L31/022466 ,  H01L31/1884 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/09 ,  H05K2201/0302 ,  H05K2201/032

Abstract: Discloses herein is a method to make a surface functionalized metal nanowire. The surface functionalized metal nanowire retains the electrical conductivity but lose the luster. This is a key enabler for making ultra‐low haze (haze

Abstract translation: 本文公开了制备表面官能化金属纳米线的方法。 表面官能化金属纳米线保持导电性，但失去光泽。 这是制造超低雾度（雾度<0.5）银纳米线基导电膜的关键推动因素。

公开(公告)号：WO2013141611A1

公开(公告)日：2013-09-26

申请号：PCT/KR2013/002313

申请日：2013-03-20

Applicant: LG INNOTEK CO., LTD.

Inventor： LIM, Seol Hee

IPC: G06K19/077 ,  H05K1/18

CPC classification number: H05K1/05 ,  C25D3/14 ,  C25D3/16 ,  C25D5/022 ,  C25D5/12 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/11 ,  H05K1/117 ,  H05K1/181 ,  H05K3/244 ,  H05K2201/0104 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/10159 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed circuit board for a memory card according to the embodiment includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on surfaces of the mounting part and the terminal part.

Abstract translation: 根据实施例的用于存储卡的印刷电路板包括绝缘层; 绝缘层的第一表面上的安装部分，所述安装部分电连接到存储装置; 以及在所述绝缘层的第二表面上的端子部分，所述端子部分电连接到外部电子设备，其中在所述安装部分和所述端子部分的表面上形成具有相同特性的相同金属层。

公开(公告)号：WO2013120660A1

公开(公告)日：2013-08-22

申请号：PCT/EP2013/051060

申请日：2013-01-21

Applicant: ATOTECH DEUTSCHLAND GMBH

Inventor： JANSSEN, Boris, Alexander

IPC: C23C18/36 ,  H05K3/24

CPC classification number: H05K1/09 ,  B05D5/12 ,  C23C18/16 ,  C23C18/1633 ,  C23C18/36 ,  C23C18/50 ,  H05K1/028 ,  H05K3/22 ,  H05K3/244 ,  H05K2201/032

Abstract: The present invention relates to a method for electroless deposition of a benda- ble nickel-phosphorous alloy layer onto flexible substrates such as flexible printed circuit boards and the like. The nickel-phosphorous alloy layer is depos- ited from an aqueous plating bath comprising nickel ions, hypophosphite ions, at least one complexing agent and a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors. The nickel- phosphorous alloy layers obtained have a columnar microstructure oriented perpendicular to the flexible substrate and are sufficiently bendable.

Abstract translation: 本发明涉及一种将可见镍 - 磷合金层无电沉积到诸如柔性印刷电路板等柔性基板上的方法。 镍 - 磷合金层从包含镍离子，次亚磷酸根离子，至少一种络合剂和选自甲醛和甲醛前体的晶粒细化添加剂的含水电镀浴中沉积。 获得的镍 - 磷合金层具有垂直于柔性基板的柱状微结构，并且是足够弯曲的。

公开(公告)号：US12089331B2

公开(公告)日：2024-09-10

申请号：US17314131

申请日：2021-05-07

Applicant: Aplus Semiconductor Technologies Co., Ltd.

Inventor： Cheng-Neng Chen ,  Sui-Ho Tsai ,  Yun-Nan Wang ,  Chiao-Hui Wang

IPC: H05K1/14 ,  C23C14/34 ,  C23C14/58 ,  C23C18/16 ,  C23C28/02 ,  C25D5/02 ,  C25D5/10 ,  G03F7/004 ,  G03F7/20 ,  H05K1/11

CPC classification number: H05K1/147 ,  C23C14/34 ,  C23C14/5873 ,  C23C18/1637 ,  C23C28/023 ,  C25D5/022 ,  C25D5/10 ,  G03F7/0041 ,  G03F7/2016 ,  H05K1/11 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0341

Abstract: A metal circuit structure based on a flexible printed circuit (FPC) contains: a substrate, a first metal layer attached on the substrate, a second metal layer formed on the first metal layer, and an intermediate layer defined between the first metal layer and the second metal layer. A first surface of the intermediate layer is connected with the first metal layer, and a second surface of the intermediate layer is connected with the second metal layer. The intermediate layer is made of a first material, the second metal layer is made of a second material, and the first material of the intermediate layer does not act with the second material of the second metal layer.

公开(公告)号：US12016132B2

公开(公告)日：2024-06-18

申请号：US17041158

申请日：2019-03-27

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Kayo Hashizume ,  Masamichi Yamamoto

IPC: H05K3/38 ,  H05K1/03

CPC classification number: H05K3/382 ,  H05K1/03 ,  H05K2201/032 ,  H05K2203/095 ,  H05K2203/1131

Abstract: A base material for a printed circuit board includes a base film having an insulating property, and a sintered body layer including metal particles and layered on at least one surface of the base film. The sintered body layer includes sintered particles that are derived from the metal particles and partially embedded into the surface of the base film. The embedment ratio of the sintered particles is greater than or equal to 10% and less than or equal to 90%.