公开(公告)号：WO2006053300A9

公开(公告)日：2006-06-15

申请号：PCT/US2005041218

申请日：2005-11-14

Applicant: ELECTRO SCIENT IND INC ,  TYLER MICHAEL ,  COLBY ROBERT W ,  LEONARD JEFFREY W ,  DOTSON LINDSEY M ,  WATT DAVID A ,  HILL CRIS E ,  CAMPBELL LAURA H

Inventor： TYLER MICHAEL ,  COLBY ROBERT W ,  LEONARD JEFFREY W ,  DOTSON LINDSEY M ,  WATT DAVID A ,  HILL CRIS E ,  CAMPBELL LAURA H

IPC: G01L19/00

CPC classification number: H05K3/0026 ,  B23K26/02 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K31/12 ,  B23K2201/42 ,  B23K2203/12 ,  B23K2203/172 ,  B23K2203/42 ,  B23K2203/50 ,  H05K3/225 ,  H05K2201/09936 ,  H05K2203/163

Abstract: A method and system (10) increase processed specimen (4) yield in the laser processing of target material (2) that includes multiple specimens formed on a common substrate. Preferred embodiments implement a feature that enables storage (22) in the laser processing system a list of defective specimens that have somehow been subject to error during laser processing. Once the common substrate has been completely processed, the system alerts an operator to the number of improperly processed specimens and gives the operator an opportunity to run a software routine (12), which in a preferred embodiment uses a laser to scribe a mark on the top surface of each improperly processed specimen.

Abstract translation: 一种方法和系统（10）增加了在包括形成在共同衬底上的多个样本的目标材料（2）的激光处理中的处理样本（4）产量。 优选实施例实现一种特征，该特征使得能够在激光加工系统中存储（22）在激光加工期间以某种方式遭受错误的有缺陷样本的列表。 一旦共同基板已经被完全处理，系统就会向操作员发出不正确处理的样品的数量并且给操作者提供运行软件程序（12）的机会，在最佳实施例中，软件程序（12）使用激光在 每个处理不当的标本的顶部表面。

公开(公告)号：WO2003078353A1

公开(公告)日：2003-09-25

申请号：PCT/DE2003/000708

申请日：2003-03-06

Applicant: SCHULZ-HARDER, Jürgen

Inventor： SCHULZ-HARDER, Jürgen

IPC: C04B37/02

CPC classification number: C04B37/021 ,  B32B2311/12 ,  C04B2237/407 ,  H05K1/0266 ,  H05K1/0306 ,  H05K3/061 ,  H05K3/244 ,  H05K3/3452 ,  H05K3/38 ,  H05K3/383 ,  H05K2201/0355 ,  H05K2201/09909 ,  H05K2201/09936 ,  H05K2203/0369 ,  H05K2203/0571 ,  H05K2203/0588

Abstract: Die Erfindung bezieht sich auf ein neuartiges Verfahren zum Herstellen eines Metall-Keramik-Substrats, insbesondere Kupfer-Keramik-Substrats, bei dem (Verfahren) auf die Oberflächenseiten einer Keramikschicht oder eines Keramik-Substrats mit Hilfe eines Hochtemperatur-Bonding-Verfahrens jeweils wenigstens eine Metall-Folie aufgebracht wird und die Metall-Folie an wenigstens einer Oberflächenseite zur Bildung von Leiterbahnen, Kontaktflächen und dergleichen strukturiert wird.

Abstract translation: 本发明涉及一种新颖的方法，用于制造金属 - 陶瓷基片，特别是铜 - 陶瓷基片，其中（方法）使用高温接合工艺的至少一个相应的陶瓷层或陶瓷基板的表面侧 金属箔被施加和金属膜进行图案化的至少一个表面侧形成导体路径，接触面等。

公开(公告)号：EP1761029B1

公开(公告)日：2011-02-23

申请号：EP06117629.3

申请日：2006-07-21

Applicant: Ricoh Company, Ltd.

Inventor： Kusunose, Noboru Ricoh Company, Ltd.

IPC: H04N1/053 ,  H04N1/113

CPC classification number: H04N1/1135 ,  H04N1/053 ,  H04N2201/04713 ,  H04N2201/04715 ,  H04N2201/04729 ,  H04N2201/04732 ,  H05K1/0274 ,  H05K1/181 ,  H05K2201/0108 ,  H05K2201/09936 ,  H05K2201/10121

Abstract: An image forming apparatus includes an image carrier, a light source, a rotary polygon mirror, an optical scanning mechanism, a synchronous detection sensor and a circuit board. The light source emits a laser beam. The rotary polygon mirror deflects the laser beam into a scanning laser beam. The optical scanning mechanism focuses the scanning laser beam to an image on the image carrier. The synchronous detection sensor is configured to detect the scanning laser beam and to generate a signal representing a write-start position on the image carrier in a main scanning direction. The circuit board is formed of an optically transparent material and includes a first surface an which the synchronous detection sensor is mounted at a predetermined position and a second surface opposite with the first surface. The second surface includes a first mark indicating a position corresponding to the predetermined position on the first surface.

公开(公告)号：EP1888338B1

公开(公告)日：2008-10-29

申请号：EP06754883.4

申请日：2006-04-27

Applicant: Koenig & Bauer Aktiengesellschaft

Inventor： STIEL, Jürgen, Alfred

IPC: B41F17/00 ,  G06K17/00 ,  B41F33/00 ,  H05K3/12

CPC classification number: B41F33/0036 ,  B41F17/00 ,  H05K1/0269 ,  H05K3/12 ,  H05K3/1275 ,  H05K2201/09936 ,  H05K2203/1545 ,  H05K2203/163

Abstract: The invention relates to a printing machine provided with at least one printing unit (01) for printing a printable material (02) by means of a printing ink. The inventive printing machine comprises at least one application device (04) for applying at least one contactless identification characteristic in the form of a RFID-system or the part thereof to the printable material (02) and at least one device for inspecting the printed material, wherein said printing machine comprises at least one first test device (10,11) for testing the identification characteristic or the part thereof.

公开(公告)号：EP1760516B1

公开(公告)日：2008-06-18

申请号：EP06018692.1

申请日：2006-09-06

Applicant: Sharp Kabushiki Kaisha

Inventor： Chikazawa, Hideyuki ,  Moriyasu, Mitsuhiro

IPC: G02F1/13357 ,  G02F1/1333 ,  G02F1/13

CPC classification number: H05K1/0266 ,  G02F1/13336 ,  G02F1/133603 ,  G02F2001/133354 ,  H05K1/142 ,  H05K2201/09936 ,  H05K2201/10106 ,  H05K2203/168

公开(公告)号：EP1487759B1

公开(公告)日：2007-05-23

申请号：EP03718617.8

申请日：2003-03-06

Applicant: Electrovac AG

Inventor： Dr.-Ing. Jürgen Schulz-Harder

IPC: C04B37/02 ,  H05K3/38

CPC classification number: C04B37/021 ,  B32B2311/12 ,  C04B2237/407 ,  H05K1/0266 ,  H05K1/0306 ,  H05K3/061 ,  H05K3/244 ,  H05K3/3452 ,  H05K3/38 ,  H05K3/383 ,  H05K2201/0355 ,  H05K2201/09909 ,  H05K2201/09936 ,  H05K2203/0369 ,  H05K2203/0571 ,  H05K2203/0588

Abstract: The invention relates to a novel method for producing a metal-ceramic substrate, particularly a copper-ceramic substrate, according to which at least one metal film is applied to each surface side of a ceramic layer or ceramic substrate by means of a high-temperature bonding method, and the metal film is structured at least on one surface side in order to form conductor strips, contact areas, and similar.

公开(公告)号：EP1782333A2

公开(公告)日：2007-05-09

申请号：EP05768241.1

申请日：2005-06-28

Applicant: International Barcode Corporation

Inventor： LUBOW, Allen

IPC: G06K7/10 ,  G06K19/06

CPC classification number: G06K19/07769 ,  G06K19/06018 ,  G06K19/07749 ,  G06K19/083 ,  H05K1/0266 ,  H05K1/165 ,  H05K2201/09781 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2201/10098

Abstract: A communication system (15) is provided that includes both an electromagnetic ('EM') communication device (17) and an optical communication device (18) including at least a machine readable symbol where at least a portion of the EM communication device and at least a portion of the machine readable symbol are formed from the same material. This may be, for example, a conductable ink or a conductable foil. If desired, the EM communication device may include an antenna where at least a portion of the antenna includes at least a portion of the machine readable symbol.

公开(公告)号：EP1688810A1

公开(公告)日：2006-08-09

申请号：EP04819392.4

申请日：2004-11-25

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： KOBAYASHI, Tokumi

IPC: G05B19/418

CPC classification number: H01L23/544 ,  H01L2223/54473 ,  H01L2924/0002 ,  H05K1/0266 ,  H05K3/0052 ,  H05K2201/09936 ,  H01L2924/00

Abstract: A circuit substrate production method in which a substrate produced by a substrate manufacturer (1) is delivered to a subsequent mounting manufacturer (2) for mounting electronic components at the mounting manufacturer (2) to thereby produce a circuit substrate. A substrate board (5) is employed which is separated into, via substrate sheets (6), substrate pieces (7) at one or each of a plurality of separation levels. Identification information formed of information related to the entire substrate and information representing relative relationship about the separation at each of the separation levels is recorded on each of information recording portions (8, 9, 10) each of which is provided so as to correspond to each substrate before separation and after separation at each separation level, and then the substrate is delivered from the substrate manufacturer (1) to the mounting manufacturer (2). Since the history of the substrate is traced by referring to the identification information, the production progress status of a circuit substrate which is separated with production efficiency improved by use of a multi-piece substrate is easily traced, and also the production history when a failure occurs is easily traced.

Abstract translation: 在其中由制造商基板（1）所产生的基片被输送到后续的安装制造商（2），用于在安装制造商安装电子部件的电路基板的制造方法（2），从而产生一个电路基片。 衬底板（5），采用其被分离成，通过片材的基材（6），在衬底的一个或每个分离水平的多段（7）。 形成与整个基板和信息表示关于所述分离在每个分离级的相对关系信息的标识信息被记录在每个信息记录部分（8，9，10）的每个的所有其被设置成对应于每个 分离前和在每一级分离分离后的衬底，然后衬底被从制造商基板（1）传送到安装制造商（2）。 由于基片的历史，通过参考该识别信息跟踪，电路的生产进度状态基质的，全部这与生产效率通过使用多片基板的改进的分离很容易跟踪，因此，生产历史当故障 的发生是很容易跟踪。

公开(公告)号：EP1530145A2

公开(公告)日：2005-05-11

申请号：EP04026503.5

申请日：2004-11-09

Applicant: Jot Automation LET GmbH

Inventor： Liposcak, Stefan

IPC: G06K5/00

CPC classification number: H05K1/0269 ,  G06K5/00 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2203/107 ,  H05K2203/161 ,  H05K2203/163

Abstract: Um Markierungen zuverlässig aufzubringen wird ein Adaptionsverfahren zur Erzeugung einer Markierung vorgeschlagen, die im Rahmen dieses Prozesses/dieser Prozesse und in der anschließenden Verwertung prozessbeständig und reproduzierbar lesbar ist, wobei zur Adaption zumindest eine Adaptionsmarkierung (1) auf ein Werkstück (5) aufgebracht wird, die zumindest eine Adaptionsmarkierung von einer Lesevorrichtung (2) gelesen wird, anschließend ausgewertet und mit einer Schwell-Güte (3) verglichen wird, bei Unterschreiten der Schwell-Güte zumindest ein Markierungsparameter (4) im Sinne einer Güteverbesserung angepasst, eine weitere Adaption wiederholt wird, bis die Schwell-Güte (3) erreicht ist und nach Erreichen der Schwell-Güte zumindest eine weitere Markierung unter Verwendung des/der angepassten Markierungsparameter(s) aufgebracht wird.

Abstract translation: 适应方法具有至少一个施加到工件（5）的表面上的适配标记（1），例如。 通过激光器（6），扫描所施加的标记并与质量阈值进行比较，用于当不满足质量阈值时调整至少一个标记参数，重复该过程直到达到质量阈值，再进一步 使用调整后的标记参数进行标记。

公开(公告)号：EP1156706B1

公开(公告)日：2003-10-08

申请号：EP01114977.0

申请日：2000-01-07

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Suetsugu, Kenichiro ,  Hibino, Shunji ,  Hirano, Masato ,  Yamaguchi, Atsushi ,  Nakata, Mikiya

IPC: H05K1/02 ,  H05K13/08 ,  C22B7/00

CPC classification number: C22B25/06 ,  C22B13/00 ,  H01H2009/0077 ,  H05K1/0266 ,  H05K1/18 ,  H05K3/3463 ,  H05K13/0465 ,  H05K2201/09936 ,  H05K2203/178 ,  Y02P10/214 ,  Y02P10/228 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49819 ,  Y10T29/49821 ,  Y10T29/49822