公开(公告)号：US20040248437A1

公开(公告)日：2004-12-09

申请号：US10453119

申请日：2003-06-03

Inventor： Marvin Glenn Wong

IPC: H01R012/00

CPC classification number: H05K3/3405 ,  H01R12/721 ,  H01R43/205 ,  H05K1/0306 ,  H05K1/117 ,  H05K3/0061 ,  H05K2201/10386 ,  H05K2201/10856

Abstract: Devices and methods are disclosed for reinforcing substrates having edge-mount connectors. In one embodiment, the device comprises a fragile substrate, a reinforcement plate bonded to the substrate, and an edge-mount connector mated with the substrate and the reinforcement plate.

Abstract translation: 公开了用于加强具有边缘安装连接器的基板的装置和方法。 在一个实施例中，该装置包括易碎基板，与基板结合的加强板，以及与基板和加强板配合的边缘安装连接器。

公开(公告)号：US06750396B2

公开(公告)日：2004-06-15

申请号：US09737303

申请日：2000-12-15

Applicant: Apurba Roy

Inventor： Apurba Roy

IPC: H05K500

CPC classification number: H01R12/57 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10666 ,  H05K2201/10856 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49211 ,  H01L2924/00

Abstract: A low impedance surface-mount connector includes a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of low resistance, low inductance, mechanical compliance and ease of manufacture. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.

Abstract translation: 低阻表面安装连接器包括具有I形横截面的圆柱形杆的长度。 该器件允许通过拾取和放置技术进行互连，并且互连具有低电阻，低电感，机械符合性和易于制造的优点。 具有一个或多个电路部件的第一电路装置通过将这种连接器表面安装在第一电路装置上而与第二电路装置互连，在第二电路装置上提供相应的焊盘，并将第一电路装置的连接器安装到焊盘 的第二。

公开(公告)号：US20030114027A1

公开(公告)日：2003-06-19

申请号：US10023181

申请日：2001-12-17

Inventor： Woody Wurster

IPC: H05K001/00

CPC classification number: H01R12/52 ,  H01R12/585 ,  H01R12/716 ,  H01R12/718 ,  H01R12/737 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/10424 ,  H05K2201/1059 ,  H05K2201/10856 ,  Y10S439/943

Abstract: A pair of circuit boards (60, 62) with holes (50, 56), are connected by right angle contacts (10) that are each formed of a single piece of metal with a 90null bend forming first and second elongated contact portions (20, 22) extending along perpendicular axes (24, 26). Each elongated portion has a resiliently compressible pin end (30, 32) for pushing into a circuit board hole, and has a distal end at the bend. A slot (70) at the bend extends into each distal end, with each end of the slot forming a push surface (80, 82) that lies on the corresponding axis. Each pin end of the connector can be installed by a tool projection that enters one end of a slot and pushes the corresponding pin end (20) along its axis. One of the elongated portions (22) can be longer than the other one (20), and an insulative body (64) is attached to the longer elongated portion.

Abstract translation: 具有孔（50,56）的一对电路板（60,62）通过直角接触件（10）连接，每个直角接触件（10）由具有90°弯曲形成的第一和第二细长接触部分的单个金属构成 20,22）沿垂直轴线（24,26）延伸。 每个细长部分具有可弹性压缩的销端（30,32），用于推入电路板孔中，并且在弯曲处具有远端。 弯曲处的狭槽（70）延伸到每个远端，槽的每个端部形成位于相应轴线上的推动表面（80,82）。 连接器的每个销端可以通过进入槽的一端并沿其轴线推动相应销端（20）的工具突起来安装。 细长部分（22）中的一个可以比另一个（20）长，并且绝缘体（64）附接到较长的细长部分。

公开(公告)号：US20020131255A1

公开(公告)日：2002-09-19

申请号：US10138173

申请日：2002-05-02

Inventor： Apurba Roy

IPC: H01R012/14

CPC classification number: H01R12/57 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10666 ,  H05K2201/10856 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49211 ,  H01L2924/00

Abstract: In accordance with the invention, a low impedance surface-mount connector comprises a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of low resistance, low inductance, mechanical compliance and ease of manufacture. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.

公开(公告)号：US06428329B2

公开(公告)日：2002-08-06

申请号：US09753986

申请日：2001-01-03

Applicant: Kazuya Orui ,  Yasuhiro Nagashima ,  Toshiaki Harigaya ,  Manabu Shimizu ,  Chiharu Nunokawa

Inventor： Kazuya Orui ,  Yasuhiro Nagashima ,  Toshiaki Harigaya ,  Manabu Shimizu ,  Chiharu Nunokawa

IPC: H01R458

CPC classification number: H05K3/368 ,  H01L2924/00013 ,  H01R12/523 ,  H01R12/585 ,  H01R43/205 ,  H05K3/308 ,  H05K2201/09827 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10863 ,  H05K2201/2036 ,  H01L2224/29099

Abstract: An interposition structure interposed between substrates and capable of guiding the insertion of a connection pin for electrically connecting the substrates to each other, whereby the connection pin can be inserted properly even in cases where the substrates to be connected or other members have a dimensional error caused during production thereof, a positioning error or the like. The interposition structure has an interposition body in which a through hole is formed such that connection pin inlet and outlet portions thereof each have an inner diameter gradually increasing in a direction from the inner part to the corresponding outer open end thereof, and also has a positioning protuberance provided on the underside of the interposition body. The interposition structure is interposed between upper and lower substrates with the positioning protuberance received in a recess formed in the upper surface of the lower substrate, and the connection pin is inserted through a hole in the upper substrate, the through hole, and a hole in the lower substrate.

Abstract translation: 插入在基板之间并且能够引导用于将基板彼此电连接的连接销的插入结构，从而即使在要连接的基板或其他构件具有尺寸误差的情况下也可以适当地插入连接销 在其生产期间，定位误差等。 插入结构具有插入体，其中形成通孔，使得连接针入口和出口部分的内径在从内部到其对应的外部开口端的方向上具有逐渐增加的内径，并且还具有定位 设置在插入体下面的凸起。 插入结构插入在上下基板之间，定位突起容纳在形成在下基板的上表面中的凹部中，并且连接销穿过上基板，通孔和孔中的孔 下基板。

公开(公告)号：US06388208B1

公开(公告)日：2002-05-14

申请号：US09360002

申请日：1999-07-23

Applicant: Sepehr Kiani ,  Mikhail Khusid

Inventor： Sepehr Kiani ,  Mikhail Khusid

IPC: H01R909

CPC classification number: H05K1/0222 ,  H01R12/523 ,  H05K1/112 ,  H05K1/115 ,  H05K3/043 ,  H05K3/308 ,  H05K3/3421 ,  H05K3/403 ,  H05K3/429 ,  H05K2201/09645 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10893 ,  H05K2201/10969 ,  H05K2203/0455

Abstract: An interconnection circuit and related techniques are described. The interconnection circuit includes a plated through hole having a plurality of electrically isolated segments with at least one of the plurality of electrically isolated segments coupled to a signal path and at least one of the electrically isolated segments coupled to ground. With this arrangement, the circuit provides a signal path between a first and a second different layers of a multilayer. By providing one segment as a signal segment and another segment as a ground segment the size and shape of the electrically isolated segments can be selected to provide the interconnection circuit having a predetermined impedance characteristic. The interconnection circuit can thus be impedance matched to circuit board circuits, devices and transmission lines, such as striplines, microstrips and co-planar waveguides. This results in an interconnection circuit which maintains the integrity of relatively high-frequency signals propagating through the interconnection circuit from the first layer to the second layer. The interconnect circuits can be formed by creating distinct conductor paths within the cylindrical plated through-holes using variety of manufacturing techniques including, but not limited to, broaching techniques, electrostatic discharge milling (EDM) techniques and laser etching techniques.

Abstract translation: 描述了互连电路及相关技术。 互连电路包括具有多个电隔离段的电镀通孔，其中多个电隔离段中的至少一个耦合到信号路径以及耦合到地的电隔离段中的至少一个。 利用这种布置，电路提供了多层的第一和第二不同层之间的信号路径。 通过将一个段作为信号段，另一个段作为接地段，可以选择电隔离段的大小和形状，以提供具有预定阻抗特性的互连电路。 因此，互连电路可以与电路板电路，器件和传输线（例如带状线，微带和共面波导）阻抗匹配。 这导致互连电路，其维持通过互连电路从第一层传播到第二层的相对高频信号的完整性。 互连电路可以通过使用各种制造技术（包括但不限于拉削技术，静电放电铣削（EDM）技术和激光蚀刻技术）在圆柱形电镀通孔内产生不同的导体路径来形成。

公开(公告)号：US5922989A

公开(公告)日：1999-07-13

申请号：US711963

申请日：1996-09-06

Applicant: Akimasa Tsunoda ,  Yuichi Nagase ,  Seiichi Katagiri ,  Shigeo Suzuki ,  Kiyohumi Nakayama ,  Kenji Hirota ,  Noboru Sato ,  Tatsuya Tsukagoshi

Inventor： Akimasa Tsunoda ,  Yuichi Nagase ,  Seiichi Katagiri ,  Shigeo Suzuki ,  Kiyohumi Nakayama ,  Kenji Hirota ,  Noboru Sato ,  Tatsuya Tsukagoshi

IPC: H05K1/18 ,  H01H1/58 ,  H01R4/02 ,  H01R12/55 ,  H05K3/30 ,  H05K3/34 ,  H01L23/02

CPC classification number: H01R4/028 ,  H05K3/3447 ,  H01H1/5805 ,  H01R12/58 ,  H05K2201/10053 ,  H05K2201/10856 ,  H05K2203/1147 ,  H05K2203/304 ,  H05K3/308

Abstract: An electronic part capable of preventing a flux from intruding thereinto without using a sealing material can be provided. In the electronic part 1, terminals 3 to be inserted through electrode holes of a circuit board are projected from a casing 1a. In the terminals 3, there are provided cut-in portions 8 extending to a space formed between the casing 1a and the circuit board when the terminals 3 are inserted through the electrode holes.

Abstract translation: 可以提供一种能够防止焊剂在不使用密封材料的情况下侵入其中的电子部件。 在电子部件1中，从电路基板的电极孔插入的端子3从壳体1a突出。 在端子3中，当端子3插入通过电极孔时，设置有延伸到形成在壳体1a和电路板之间的空间的切口部分8。

公开(公告)号：US3764955A

公开(公告)日：1973-10-09

申请号：US3764955D

申请日：1972-05-17

Applicant: AMP INC

Inventor： WARD J

IPC: H01R12/71 ,  H05K3/30 ,  H05K3/36 ,  H05K1/07 ,  H01R13/62

CPC classification number: H05K3/366 ,  H01R12/716 ,  H05K3/308 ,  H05K2201/10386 ,  H05K2201/10424 ,  H05K2201/1059 ,  H05K2201/10856

Abstract: Connecting and mounting means for substrates comprises an elongated mounting bar having connecting devices mounted therein at spaced intervals. The connecting devices have aligned spring receptacles which receive and support the substrate and have posts which are adapted to enter holes in a printed circuit board.

Abstract translation: 用于基板的连接和安装装置包括细长的安装杆，其具有以间隔的间隔安装在其中的连接装置。 连接装置具有对准的弹簧容器，其接收和支撑衬底并具有适于进入印刷电路板中的孔的柱。

公开(公告)号：US20150044889A1

公开(公告)日：2015-02-12

申请号：US14318851

申请日：2014-06-30

Applicant: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED ,  LITE-ON TECHNOLOGY CORP.

Inventor： CHUNG-FU WANG ,  NIEN-HUNG YAO ,  HSIN-YU YANG ,  YU-SHAN KAO

IPC: H01R4/02 ,  H05K1/11 ,  H01R12/57

CPC classification number: H01R4/02 ,  H01R12/57 ,  H01R12/585 ,  H01R12/707 ,  H01R12/716 ,  H05K1/11 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10856 ,  H05K2201/10878

Abstract: An electrical connector includes an insulating body having a bottom surface, a receiving groove formed in the bottom surface, and at least one support block projecting downwardly from the bottom surface for connection with a circuit board and cooperating with the bottom surface to define a venting space that communicates with the receiving groove and a solder hole in the circuit board. A conductive terminal includes a first positioning portion extending into and positioned in the receiving groove, and a second positioning portion connected to the first positioning portion and extending through the venting space and adapted to be positioned in the solder hole.

Abstract translation: 电连接器包括具有底表面的绝缘体，形成在底表面中的接收槽，以及从底表面向下伸出的至少一个支撑块，用于与电路板连接并与底表面配合以形成通气空间 其与电路板中的接收槽和焊接孔连通。 导电端子包括延伸到接收槽中并定位在接收槽中的第一定位部分和连接到第一定位部分并延伸穿过通气空间并适于定位在焊料孔中的第二定位部分。

公开(公告)号：US20130316551A1

公开(公告)日：2013-11-28

申请号：US13481176

申请日：2012-05-25

Applicant: James A. Day, JR. ,  Zachary B. Durham ,  Luke D. Remis ,  Tony C. Sass ,  Gregory D. Sellman

Inventor： James A. Day, JR. ,  Zachary B. Durham ,  Luke D. Remis ,  Tony C. Sass ,  Gregory D. Sellman

IPC: H01R12/58 ,  H05K3/30

CPC classification number: H05K13/04 ,  H01R12/585 ,  H05K1/115 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/09845 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10878

Abstract: A universal press-fit connection allows a component having a connector pin to be connected to a compatible plated through hole of a circuit board regardless of circuit board thickness. The connector pin includes a proximate end adjacent the component, a distal end with a fork lock, and a compliant portion between the proximate and distal ends. A multi-width through hole includes a first portion partially extending through the circuit board and a second, wider portion extending beyond the first portion. The fork lock initially moves radially inward upon insertion into the first portion via flexing of the compliant portion, and re-expands when entering the second portion. The compliant portion engages the through hole and the fork lock secures the connector pin in the through hole.

Abstract translation: 通用压配合连接允许具有连接器引脚的部件连接到电路板的兼容的电镀通孔，而与电路板厚度无关。 连接器销包括邻近部件的近端，具有叉锁的远端以及近端和远端之间的柔顺部分。 多宽度通孔包括部分延伸穿过电路板的第一部分和延伸超过第一部分的第二较宽部分。 当通过柔性部分的弯曲插入到第一部分中时，叉锁首先向内径向移动，并且当进入第二部分时，叉锁重新膨胀。 柔性部分接合通孔，叉锁将连接器销固定在通孔中。