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公开(公告)号：JPWO2005041220A1
公开(公告)日：2007-11-29
申请号：JP2005514914
申请日：2004-09-17
Applicant: 箕輪興亜株式会社
CPC classification number: H01C17/28 , H01C17/006
Abstract: セラミック基板(1)面に回路素子(3)が形成され、導電性ボール(2)を電子部品端子とする電子部品の製造法において、セラミック基板(1)と導電性ボール(2)との固着部分に過大な応力を集中させないことを課題とする。そのためには、表面に縦横に設けられた分割用溝(4)を有する大型のセラミック基板(1)面に回路素子3を形成する第1の工程と、前記分割用溝(4)を開くように上記基板(1)に応力付与することで上記基板(1)を単位電子部品小片(10)に分割する第2の工程と、分割後の単位電子部品小片(10)の回路素子(3)端子部(7)に導電性ボール(2)を固着させる第3の工程とを有し、上記第1、第2及び第3の工程をこの順に実施する。このとき、複数の単位電子部品小片(10)を容器(11)を用いて並べる工程を第2の工程終了後、第3の工程開始前に実施することが好ましい。
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2.发明专利Method for manufacturing electronic component using conductive ball as terminal 审中-公开使用导电球作为终端制造电子元件的方法
公开(公告)号：JP2006196579A
公开(公告)日：2006-07-27
申请号：JP2005005012
申请日：2005-01-12
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： INOUE TOMOAKI
IPC: H01L23/48
Abstract: PROBLEM TO BE SOLVED: To provide an electronic component using a conductive ball 3 as a terminal wherein a substrate 1 and the conductive ball 3 are adhered appropriately.
SOLUTION: An electronic component can be obtained by forming the circuit element 6 on the surface of a substrate 1 and adhering the conductive ball 3 to the electrode 2 of the circuit element 6. The manufacturing method thereof includes a first step to divide the large substrate 1 where the circuit element 6 is formed on its surface at the size of a unit electronic component, a second step to provide a conductive fitting member 4 at the electrode 2 of the circuit element 6 in the substrate 1 having the size of the unit electronic component, a third step to mount the conductive ball 3 to the placement position of the conductive fitting member 4, and a fourth step to adhere the conductive fitting member 4 to the conductive ball 3. The first, second, third, and fourth steps are conducted in order.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：提供一种使用导电球3作为终端的电子部件，其中基板1和导电球3被适当地粘合。 解决方案：通过在基板1的表面上形成电路元件6并将导电球3粘附到电路元件6的电极2上，可以获得电子部件。其制造方法包括：第一步骤 其中电路元件6在其表面上以单位电子部件的尺寸形成的大基板1，第二步骤，在基板1中的电路元件6的电极2处提供导电配合构件4，第二步是具有尺寸 单元电子部件，将导电球3安装到导电配件4的放置位置的第三步骤，以及将导电配件4粘附到导电球3的第四步骤。第一，第二，第三和第 第四步按顺序进行。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2006128884A
公开(公告)日：2006-05-18
申请号：JP2004312213
申请日：2004-10-27
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： YAMAMOTO SHIZUO
Abstract: PROBLEM TO BE SOLVED: To provide an ultrasonic probe which can be easily assembled regarding the ultrasonic probe used for an ultrasonic inspection device or the like.
SOLUTION: The manufacturing method for the ultrasonic probe has a process in which a rod-like terminal 3 is inserted to the through-hole 2 of a backing block material 1 having a plurality of the through-holes 2 extended in the substantially same direction so that one tip of the terminal 3 is located on the substantially same plane as the outer face of the backing block material 1, the backing block material 1 and the rod-like terminal 3 are fixed, and a plate-like ultrasonic vibrator 6 is fixed at a position corresponding to the terminal 3 on the substantially same plane.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：提供可以容易地组装用于超声波检查装置等的超声波探头的超声波探头。 解决方案：超声波探头的制造方法具有将棒状端子3插入到背衬块材1的通孔2中的工艺，该背衬块材料1具有多个贯通孔2， 端子3的一个端部位于与背衬块材1的外表面基本相同的平面上，背衬块材料1和棒状端子3被固定，并且板状超声波振动器 6固定在与实质上相同的平面上的端子3对应的位置上。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2006120990A
公开(公告)日：2006-05-11
申请号：JP2004309669
申请日：2004-10-25
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： HOKIBARA SHIGERU , MORIOKA MAKOTO
Abstract: PROBLEM TO BE SOLVED: To provide a ceramic resistor wherein strength of a ceramic resistance object 1 which sets talc to one of the sources can be maintained highly. SOLUTION: Mean particle diameter of talc is set to at most 11 μm, so that dimension of air gaps 2 installed in whole region of the ceramic resistance object 1 becomes at most 0.5 mm of the maximum diameter in the respective air gaps, and the air gaps 2 exist also in the surface layer region of the ceramic resistor 1. As a result, an effect is obtained wherein sampling inspection for confirming existence of large air gaps can be simplified. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：提供一种陶瓷电阻器，其中可以高度地保持将滑石与其中一个源设置的陶瓷电阻对象1的强度。 解决方案：滑石的平均粒径设定为至多11μm，使得安装在陶瓷电阻体1的整个区域中的气隙2的尺寸在各个气隙中的最大直径的至多0.5mm处， 并且气隙2也存在于陶瓷电阻器1的表层区域中。结果，获得了可以简化用于确认大气隙的存在的取样检查的效果。 版权所有（C）2006，JPO＆NCIPI
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Patent Agency Ranking
公开(公告)号：JP2005166857A
公开(公告)日：2005-06-23
申请号：JP2003402434
申请日：2003-12-02
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： TAKAYAMA TOSHIJI
Abstract: PROBLEM TO BE SOLVED: To efficiently improve wettability between a material of an electrode 2 and a bonding member in a method for manufacturing a thermoelement module 10 comprising a process wherein a large thermoelement plate 6 is divided into individual thermoelements 3, and the electrode 2 containing Cu and arranged on a substrate 1 and an individual thermoelement 3 are bonded to each other by the bonding member.
SOLUTION: Cu-plated layer 5 are formed on both surfaces of a large thermoelement plate 6, and then the thermoelement plate 6 is divided into individual thermoelements 3. The Cu-plated layer 5 of each individual thermoelement 3 is bonded to an electrode 2 and/or to a bonding member that does not substantially contain Sn.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题：为了有效地提高热电元件模块10的制造方法中的电极2和接合构件的材料之间的润湿性，其包括将大型热电隔离板6分割为单独的热电偶3的工序， 配置在基板1和各个热电偶3上的含有Cu的电极2通过接合部件彼此接合。 解决方案：在大型热电偶板6的两个表面上形成Cu镀层5，然后将热电板6分成单独的热电偶3。每个单独的热电偶3的Cu镀层5与 电极2和/或不基本上包含Sn的接合部件。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2005128024A
公开(公告)日：2005-05-19
申请号：JP2004332848
申请日：2004-11-17
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： OBA ETSUO , INUKAI ATSUOMI , KARASAWA FUMIAKI , YAJIMA HIROSHI
Abstract: PROBLEM TO BE SOLVED: To suppress dispersion in the shape of respective resistors 2 in a stress sensor that can grasp the direction and magnitude of the stress imparted to a post 6 firmly fixed to or united with the surface of an insulating substrate 3 from the changes of the resistance value of a plurality of resistance elements 8 caused by stimuli given to the elements 8 when the stress is imparted to the post 6. SOLUTION: The resistance elements 8 are respectively constituted of resistors (4) formed among circuit pattern electrodes 1 which are electrodes for resistance element arranged on the surface of the insulating substrate 3 in paired states and formed by the screen printing method. The electrodes 1 are connected to a substrate terminal section 5 provided at one end of the substrate 3 through conductors 9. The electrodes 1 and conductors 9 or printing accuracy adjusting members 7 have fixed heights from the surface of the substrate 3. In addition, the arrangement of the conductors 9 or the electrodes 1 near the resistance elements 8 or the printing accuracy adjusting members 7 is made equal or similar to that of the resistance elements 8. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题为了抑制能够掌握施加到固定在绝缘基板3的表面上或与绝缘基板3的表面一体的柱6的应力的方向和大小的应力传感器中的各个电阻体2的形状的分散 从施加到柱6上的元件8施加的元件8的刺激引起的多个电阻元件8的电阻值的变化。电阻元件8分别由形成的电阻（4）构成 在电路图案电极1中，电极图案电极1是以成对状态设置在绝缘基板3的表面上并通过丝网印刷法形成的电阻元件的电极。 电极1通过导体9连接到设置在基板3的一端的基板端子部5.电极1和导体9或印刷精度调节部件7从基板3的表面固定高度。此外， 将导体9或电阻1附近的电极元件8或印刷精度调整部件7的布置与电阻元件8的布置相同或类似。（C）2005，JPO＆NCIPI
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公开(公告)号：JP2005063301A
公开(公告)日：2005-03-10
申请号：JP2003295253
申请日：2003-08-19
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： INUKAI ATSUOMI
Abstract: PROBLEM TO BE SOLVED: To provide an operating part for an electronic apparatus capable of reducing a manufacturing process load.
SOLUTION: The operating part for the electronic apparatus has a stress sensor part capable of outputting a stress sensor characteristic value based upon applied stress, and a control part supplying stress data wherein the output is converted into a signal to the electronic apparatus, and a plurality of strain gages 1 detecting stress is arranged in the stress sensor part. The control part has a means for measuring respective strain gage characteristic values as stress data by carrying out time sharing. Or, it has a means for individually measuring respective strain gage characteristic values, a means for grasping a measurement value variation, and a means for determining the measurement value variation from a difference between a strain gage characteristic value in a state applied with no stress, and a strain gage characteristic value after applying stress, and supplying the measurement value variation as stress data to the electronic apparatus.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题：提供一种能够降低制造工艺负载的电子设备的操作部件。 解决方案：电子设备的操作部分具有能够基于所施加的应力输出应力传感器特性值的应力传感器部分，以及提供应力数据的控制部分，其中输出被转换成电子设备的信号， 并且在应力传感器部中配置多个检测应力的应变计1。 控制部件具有通过执行时间分配来测量各应变计特性值作为应力数据的装置。 或者，具有单独测量各应变计特性值的手段，用于掌握测量值变化的装置，以及用于根据应力无应变状态下的应变计特性值之间的差确定测量值变化的装置， 以及施加应力之后的应变计特性值，并将测量值变化作为应力数据提供给电子设备。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2005044250A
公开(公告)日：2005-02-17
申请号：JP2003279627
申请日：2003-07-25
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： INUKAI ATSUOMI
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing an operation section of an electronic equipment causing no fluctuation in product characteristics, where, the operation section for the electronic equipment has a stress sensor section outputting a stress sensor characteristic value based on applied stress for output and a control section supplying stress data formed by converting the output into a signal to the electronic equipment. SOLUTION: The method for manufacturing the operation section for the electronic equipment has: a first process manufacturing the stress sensor section 1 and the control section; a second process providing the specified stress to the stress sensor section 1 in a state fixing the stress sensor section 1 and outputting the output value of the stress from the control section; and a third process implementing correction for the control section having an output value correction means correcting the output value to the specified value. The first, the second, and the third process are implemented in that order. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题：提供一种电子设备的操作部的制造方法，其不产生产品特性的波动，其中，电子设备的操作部具有应力传感器部，其输出基于 用于输出的施加应力和提供通过将输出转换成电子设备的信号形成的应力数据的控制部分。 解决方案：用于制造电子设备的操作部分的方法具有：制造应力传感器部分1和控制部分的第一工序; 在固定所述应力传感器部1的状态下，向所述应力传感器部1提供规定的应力的第二工序，输出来自所述控制部的所述应力的输出值。 以及实施用于控制部分的校正的第三处理，其具有将输出值校正为指定值的输出值校正装置。 第一个，第二个和第三个过程按照顺序执行。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP4005567B2
公开(公告)日：2007-11-07
申请号：JP2004014253
申请日：2004-01-22
Applicant: 箕輪興亜株式会社
IPC: H01L23/50
CPC classification number: H01L2924/0002 , H01L2924/00
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