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    2.
    发明专利
    未知

    公开(公告)号：DE3624629C2

    公开(公告)日：1991-11-14

    申请号：DE3624629

    申请日：1986-07-18

    Applicant: ADVANCED INTERCONNECTION TECHNOLOGY, INC. (N.D.GES.D.STAATES DELAWARE), ISLIP, N.Y., US

    Inventor： SCHOENBERG, ANDREW JED, HUNTINGTON, N.Y., US ,  FRIEDRICH, MARJU LAUBE, BABYLON, N.Y., US

    IPC: C09J201/00 ,  C08G18/79 ,  C08G59/18 ,  C08G59/40 ,  C09J163/00 ,  C09J167/00 ,  C09J175/00 ,  C09J175/04 ,  H05K3/10 ,  H05K3/38

    Abstract: A non-blocking, solid, adhesive composition which can be activated upon application of sufficient heat or ultra­sonic energy without becoming C-staged, comprising (a) a first component having an epoxide-, hydroxy- or unsaturated functionality grater than 2, said polymeric resin being selected from the group consisting of polyesters, poly­urethanes and epoxies; (b) a second component comprised of at least one filler, or at least one polyfunctional compound containing a polyaromatic backbone and having an average molecular weight below about 7000, or mixtures thereof, the weight ratio of said first component so said second com­ponent being between about 1.5 : 1 and about 9 : 1; and (c) a curing agent which is capable of reacting or initi­ating a reactio n with the functional groups of the poly­meric resin to form crosslinks and cure the polymeric resin to a C-stage upon application of sufficient energy in the form of heat or radiant energy, said curing agent being non-reactive or blocked at the condition which will acti­vate the adhesive composition, said curing agent being pre­sent in an amount sufficient to C-stage the polymeric resin. The adhesive composition is flexible, and in the C-stage, is capable of forming an infusible composition which does not melt, flow or decompose when exposed for 10 seconds to molten solder at 260°C and does not soften when exposed for 1 minute to dichloromethane at 25°C. The adhesive composi­tion is suitable for bonding wire to a surface, to another wire or to itself.

    Improved methods for wire-scribing filament circuit patterns with planar and non-planar portions; improved wire-scribed boards, interconnection cards, and smartcards made by these methods
    3.
    发明专利
    Improved methods for wire-scribing filament circuit patterns with planar and non-planar portions; improved wire-scribed boards, interconnection cards, and smartcards made by these methods 未知

    公开(公告)号：AU3110800A

    公开(公告)日：2000-07-03

    申请号：AU3110800

    申请日：1999-12-07

    Applicant: ADVANCED INTERCONNECTION TECHNOLOGY INC

    Inventor： KEOGH RAYMOND S

    IPC: B42D15/10 ,  G06K19/077 ,  H05K3/10 ,  H05K3/38 ,  H05K3/46 ,  H05K7/06

    Abstract: An apparatus and method of forming filament circuit patterns with planar and non-planar portions and interconnection cards, smart cards or optical fiber circuit cards formed therefrom are provided. A filament circuit path is scribed by moving a filament guide and a substrate relative to one another, and dispensing a filament on, or in the vicinity of, a surface of the substrate. The filament or the substrate or both have adhesive surface(s). The adhesive surface is capable of being adhesively actuated by application of energy. Energy is applied simultaneous with, or subsequent to, scribing. A portion of the filament circuit pattern is planar and another portion is non-planar. The non-planar portion traverses but does not contact or adhere to a pre-selected area of the substrate. The pre-selected area corresponds with a pad, a contact pattern, a hole, a slot, a raised feature, a part of the previously scribed planar portion of the pattern, and a filament termination point. Alternately, the non-planar portion may be embedded below the surface of the substrate. Another planar portion of the filament circuit traverses the non-planar portion but does not contact or adhere to a pre-selected part of the previously scribed non-planar portion. According to the above method wire-scribed circuit boards are formed including interconnection cards, smart cards or optical fiber circuit cards.

    Slotless electric motor or transducer and method for making same
    4.
    发明公开
    Slotless electric motor or transducer and method for making same 失效
    电动机或变压器具有气隙绕组，和方法，用于其生产。

    公开(公告)号：EP0644645A2

    公开(公告)日：1995-03-22

    申请号：EP94113863.8

    申请日：1994-09-05

    Applicant: KOLLMORGEN CORPORATION ,  Advanced Interconnection Technology, Inc.

    Inventor： Fougere,Richard J. ,  Khandan-Barani,Mohammad ,  Keogh,Raymond S.

    IPC: H02K3/47 ,  H02K15/04

    CPC classification number: H02K15/0457 ,  H02K3/47 ,  H02K15/02 ,  H02K15/12 ,  H02K21/14 ,  H02K41/02 ,  Y10T29/49009 ,  Y10T29/49012 ,  Y10T29/49073 ,  Y10T29/5137 ,  Y10T29/53143 ,  Y10T29/53161 ,  Y10T156/1737

    Abstract: A slotless stator for an electromechanical transducer, said stator including a stator shell (30) and a pre-formed, at least partially rigid, self-supporting winding structure having active segments and end-turns (40), is produced by a method that comprises depositing insulated wire on a support, adhesively affixing at least active wire segments portions to the support surface or previously deposited wires, with the active wire segments arranged in predetermined, substantially fixed positions with respect to each other, encapsulating and securely attaching the winding structure to the stator shell, and combining the completed stator with a structure including at least one permanent magnet mounted for movement relative to the stator. In a preferred embodiment, the self-supporting winding structure is removed from the support surface prior to insertion in the stator shell.

    Abstract translation: 在机电换能器无槽定子，所述定子包括定子外壳（30）和一个预先形成的，至少部分刚性的，自支撑的具有主动段和端匝（40）的绕组结构，通过一种方法产生的做 包括沉积绝缘电线上的支撑件，粘接固定至少有源导线段的部分到支撑表面或先前沉积的金属丝，并在预定的设置在有源导线段，相对于海誓山盟基本上固定的位置，封装和牢固地附连的绕组结构 到定子壳体，结合有包括安装用于相对于所述定子运动的至少一个永磁体的结构的完整的定子。 在优选实施方式中，自支撑绕组结构是从所述支撑表面插入到定子外壳之前去除。

    System and method for automatic optical inspection
    5.
    发明公开
    System and method for automatic optical inspection 失效
    装置和用于自动光学检测方法。

    公开(公告)号：EP0594146A3

    公开(公告)日：1994-12-07

    申请号：EP93116943.7

    申请日：1993-10-20

    Applicant: Advanced Interconnection Technology, Inc.

    Inventor： Luke,Edward P. ,  Creavin,Damien W.P. ,  Reetz,Robert R.

    IPC: G01R31/308 ,  G01N21/88 ,  G06F15/70 ,  H05K13/08

    CPC classification number: G06T7/0004 ,  G01R31/308 ,  G06T2207/10016 ,  G06T2207/10024 ,  G06T2207/30141

    Abstract: An optical inspection system for inspecting faults on circuit boards like printed circuit boards and wire scribed circuit boards is disclosed. A video camera (14) for receiving desired images of hole sites on a wire circuit board (18) is provided. The camera converts each image to electrical video signals. A frame grabber (12) converts electrical video signals to a plurality of pixels and stores information representing color element values contained in each of said pixels. A panel feature detector receives the color element values of the pixel that has to be analyzed and provides a wire indication when the color element value of the pixel corresponds to the wire feature. A fault detector circuit receives the wire indication from the panel feature detector corresponding to predetermined pixels associated with the hole site for determining faults on the circuit board.

    Broken wire detector for wire scribing machines
    6.
    发明公开
    Broken wire detector for wire scribing machines 失效
    Detektor einer gebrochenen DrahtelektrodefürVerdrahtungsmaschinen。

    公开(公告)号：EP0477489A1

    公开(公告)日：1992-04-01

    申请号：EP91111527.7

    申请日：1991-07-11

    Applicant: Advanced Interconnection Technology, Inc.

    Inventor： Fox, James A. ,  Malone, Howard F.

    IPC: H05K7/06 ,  H05K13/06

    CPC classification number: G01R31/026

    Abstract: An apparatus for detecting breaks in wire while the wire is being scribed is claimed wherein the apparatus measures changes, in real time, in the scribing system's electrical characteristics. These characteristics can be changes in phase shift and capacitance variations caused by breaks in the wire as the wire is scribed onto a workpiece.

    Abstract translation: 要求一种用于在线被划线时检测线中断断裂的装置，其中该装置实时测量划线系统的电特性。 这些特性可以是当线被划刻到工件上时由于线中断而引起的相移和电容变化的变化。

    IMPROVED METHOD FOR WIRE-SCRIBING FILAMENT CIRCUIT PATTERNS WITH PLANAR AND NON-PLANAR PORTIONS; IMPROVED WIRE-SCRIBED BOARDS AND SMART CARD MADE BY THIS METHOD
    8.
    发明授权
    IMPROVED METHOD FOR WIRE-SCRIBING FILAMENT CIRCUIT PATTERNS WITH PLANAR AND NON-PLANAR PORTIONS; IMPROVED WIRE-SCRIBED BOARDS AND SMART CARD MADE BY THIS METHOD 有权
    改进方法铺设平面丝状个头不算平坦面，与卡其发布和电线改进板连接在这个过程中生产的芯片卡

    公开(公告)号：EP1145609B1

    公开(公告)日：2004-07-28

    申请号：EP99965125.0

    申请日：1999-12-07

    Applicant: Advanced Interconnection Technology, Inc.

    Inventor： KEOGH, Raymond, S.

    IPC: H05K7/06 ,  G06K19/077

    CPC classification number: H05K3/103 ,  G06K19/07743 ,  H05K3/386 ,  H05K3/4685 ,  H05K7/06 ,  H05K2201/10287 ,  H05K2203/0285 ,  H05K2203/1105

    Abstract: An apparatus and method of forming filament circuit patterns with planar and non-planar portions and interconnection cards, smart cards or optical fiber circuit cards formed therefrom are provided. A filament circuit path is scribed by moving a filament guide and a substrate relative to one another, and dispensing a filament on, or in the vicinity of, a surface of the substrate. The filament or the substrate or both have adhesive surface(s). The adhesive surface is capable of being adhesively actuated by application of energy. Energy is applied simultaneous with, or subsequent to, scribing. A portion of the filament circuit pattern is planar and another portion is non-planar. The non-planar portion traverses but does not contact or adhere to a pre-selected area of the substrate. The pre-selected area corresponds with a pad, a contact pattern, a hole, a slot, a raised feature, a part of the previously scribed planar portion of the pattern, and a filament termination point. Alternately, the non-planar portion may be embedded below the surface of the substrate. Another planar portion of the filament circuit traverses the non-planar portion but does not contact or adhere to a pre-selected part of the previously scribed non-planar portion. According to the above method wire-scribed circuit boards are formed including interconnection cards, smart cards or optical fiber circuit cards.

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