公开(公告)号：WO2005104231A3

公开(公告)日：2005-11-03

申请号：PCT/US2005/008067

申请日：2005-03-09

Applicant: DELPHI TECHNOLOGIES, INC. ,  OMAN, Todd, P. ,  DEGENKOLB, Thomas, A.

Inventor： OMAN, Todd, P. ,  DEGENKOLB, Thomas, A.

IPC: H01L23/14

Abstract: Thermally managing high-power IC devices through the use of a circuit assembly comprising a ceramic substrate and an organic substrate. The ceramic substrate has at least one circuit component on a first surface thereof and a periphery defining a lateral surface surrounding the first surface. The organic substrate also comprises a first surface and a periphery defining a lateral surface surrounding the first surface. A portion of the lateral surface of the organic substrate is adjacent a portion of the lateral surface of the ceramic substrate so as to define an interface therebetween. At least one conductor common to both the ceramic and organic substrates and bridging the interface therebetween serves to physically connect the ceramic and organic substrates together.

公开(公告)号：WO2005104231A2

公开(公告)日：2005-11-03

申请号：PCT/US2005008067

申请日：2005-03-09

Applicant: DELPHI TECH INC ,  OMAN TODD P ,  DEGENKOLB THOMAS A

Inventor： OMAN TODD P ,  DEGENKOLB THOMAS A

IPC: H01L23/14 ,  H01L23/367 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14

CPC classification number: H01L25/162 ,  H01L23/367 ,  H01L23/49833 ,  H01L2224/73204 ,  H01L2224/73253 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/142 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/0187 ,  H05K2201/1034 ,  H05K2201/10977 ,  Y10T428/24917

Abstract: Thermally managing high-power IC devices through the use of a circuit assembly comprising a ceramic substrate and an organic substrate. The ceramic substrate has at least one circuit component on a first surface thereof and a periphery defining a lateral surface surrounding the first surface. The organic substrate also comprises a first surface and a periphery defining a lateral surface surrounding the first surface. A portion of the lateral surface of the organic substrate is adjacent a portion of the lateral surface of the ceramic substrate so as to define an interface therebetween. At least one conductor common to both the ceramic and organic substrates and bridging the interface therebetween serves to physically connect the ceramic and organic substrates together.

Abstract translation: 通过使用包括陶瓷衬底和有机衬底的电路组件来热管理大功率IC器件。 陶瓷基板在其第一表面上具有至少一个电路元件，限定围绕第一表面的侧表面的周边。 有机基底还包括限定围绕第一表面的侧表面的第一表面和周边。 有机衬底的侧表面的一部分与陶瓷衬底的侧表面的一部分相邻以在其间限定界面。 陶瓷和有机衬底两者共同的至少一个导体和桥接它们之间的界面用于将陶瓷和有机衬底物理连接在一起。

公开(公告)号：WO2009035681A1

公开(公告)日：2009-03-19

申请号：PCT/US2008/010689

申请日：2008-09-12

Applicant: DELPHI TECHNOLOGIES, INC. ,  DEGENKOLB, Thomas, A. ,  BRANDENBURG, Scott, D. ,  MANDEL, Larry, M. ,  CHOW, Kin, Yean ,  FANG, Ching, Meng ,  YONG, Sim, Ying

Inventor： DEGENKOLB, Thomas, A. ,  BRANDENBURG, Scott, D. ,  MANDEL, Larry, M. ,  CHOW, Kin, Yean ,  FANG, Ching, Meng ,  YONG, Sim, Ying

IPC: H01L23/28

CPC classification number: H05K3/284 ,  H05K3/0061 ,  H05K3/0064 ,  H05K5/0034 ,  H05K5/065 ,  H05K7/20854 ,  H05K2201/10189 ,  H05K2203/1316

Abstract: An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, and an overmold body that has peripheral edges that wrap around sides of the backplate and onto the edge recesses. The resulting over wrap feature eliminates delamination problems that would otherwise occur during thermal cycling of the electronic assembly, improves corrosion resistance at connector-to-backplate interfaces, and enhances securement of the printed circuit board assembly and electrical connector to the assembly.

Abstract translation: 改进的包覆成型电子组件包括设置有凹入边缘的背板，背板上的电路基板，安装在电路基板上的至少一个电子部件，电路基板上的导电迹线，其与电子部件一起限定电路 装置，电连接器和包覆模制体，其具有围绕背板的侧部并且围绕边缘凹陷的周边边缘。 所产生的过度包覆功能消除了在电子组件的热循环期间会发生的分层问题，提高了连接器到背板接口处的耐腐蚀性，并且增强了印刷电路板组件和电连接器到组件的固定。