公开(公告)号：WO2005104231A2

公开(公告)日：2005-11-03

申请号：PCT/US2005008067

申请日：2005-03-09

Applicant: DELPHI TECH INC ,  OMAN TODD P ,  DEGENKOLB THOMAS A

Inventor： OMAN TODD P ,  DEGENKOLB THOMAS A

IPC: H01L23/14 ,  H01L23/367 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14

CPC classification number: H01L25/162 ,  H01L23/367 ,  H01L23/49833 ,  H01L2224/73204 ,  H01L2224/73253 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/142 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/0187 ,  H05K2201/1034 ,  H05K2201/10977 ,  Y10T428/24917

Abstract: Thermally managing high-power IC devices through the use of a circuit assembly comprising a ceramic substrate and an organic substrate. The ceramic substrate has at least one circuit component on a first surface thereof and a periphery defining a lateral surface surrounding the first surface. The organic substrate also comprises a first surface and a periphery defining a lateral surface surrounding the first surface. A portion of the lateral surface of the organic substrate is adjacent a portion of the lateral surface of the ceramic substrate so as to define an interface therebetween. At least one conductor common to both the ceramic and organic substrates and bridging the interface therebetween serves to physically connect the ceramic and organic substrates together.

Abstract translation: 通过使用包括陶瓷衬底和有机衬底的电路组件来热管理大功率IC器件。 陶瓷基板在其第一表面上具有至少一个电路元件，限定围绕第一表面的侧表面的周边。 有机基底还包括限定围绕第一表面的侧表面的第一表面和周边。 有机衬底的侧表面的一部分与陶瓷衬底的侧表面的一部分相邻以在其间限定界面。 陶瓷和有机衬底两者共同的至少一个导体和桥接它们之间的界面用于将陶瓷和有机衬底物理连接在一起。

公开(公告)号：WO2005104231A3

公开(公告)日：2005-11-03

申请号：PCT/US2005/008067

申请日：2005-03-09

Applicant: DELPHI TECHNOLOGIES, INC. ,  OMAN, Todd, P. ,  DEGENKOLB, Thomas, A.

Inventor： OMAN, Todd, P. ,  DEGENKOLB, Thomas, A.

IPC: H01L23/14

Abstract: Thermally managing high-power IC devices through the use of a circuit assembly comprising a ceramic substrate and an organic substrate. The ceramic substrate has at least one circuit component on a first surface thereof and a periphery defining a lateral surface surrounding the first surface. The organic substrate also comprises a first surface and a periphery defining a lateral surface surrounding the first surface. A portion of the lateral surface of the organic substrate is adjacent a portion of the lateral surface of the ceramic substrate so as to define an interface therebetween. At least one conductor common to both the ceramic and organic substrates and bridging the interface therebetween serves to physically connect the ceramic and organic substrates together.