公开(公告)号：WO2007089223A3

公开(公告)日：2007-11-01

申请号：PCT/US2006001154

申请日：2006-01-12

Applicant: IBM ,  DIMITRAKOPOULOS CHRISTOS D ,  GATES STEPHEN M ,  GRILL ALFRED ,  LANE MICHAEL W ,  LINIGER ERIC G ,  LIU XIAO HU ,  NGUYEN SON VAN ,  NEUMAYER DEBORAH A ,  SHAW THOMAS M

Inventor： DIMITRAKOPOULOS CHRISTOS D ,  GATES STEPHEN M ,  GRILL ALFRED ,  LANE MICHAEL W ,  LINIGER ERIC G ,  LIU XIAO HU ,  NGUYEN SON VAN ,  NEUMAYER DEBORAH A ,  SHAW THOMAS M

IPC: H01L21/20 ,  B05C11/00 ,  B32B3/26

CPC classification number: H01L21/76834 ,  C23C16/30 ,  C23C16/56 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02274 ,  H01L21/02282 ,  H01L21/02348 ,  H01L21/3105 ,  H01L21/31058 ,  H01L21/31633 ,  H01L21/76801 ,  H01L21/76825 ,  H01L21/76828 ,  H01L21/76829 ,  H01L21/76832 ,  Y10T428/249953 ,  Y10T428/249969 ,  Y10T428/249979

Abstract: A method for forming a ultralow dielectric constant layer with controlled biaxial stress is described incorporating the steps of forming a layer containing Si, C, O and H by one of PECVD and spin-on coating and curing the film in an environment containing very low concentrations of oxygen and water each less than 10 ppm. A material is also described by using the method with a dielectric constant of not more than 2.8. The invention overcomes the problem of forming films with low biaxial stress less than 46 MPa.

Abstract translation: 描述了一种用于形成具有受控双轴应力的超低介电常数层的方法，其包括通过PECVD和旋涂涂覆之一形成含有Si，C，O和H的层并且在包含非常低浓度 的氧气和水每个小于10ppm。 还通过使用介电常数不超过2.8的方法来描述材料。 本发明克服了形成低双轴应力小于46MPa的薄膜的问题。

公开(公告)号：WO2012145079A1

公开(公告)日：2012-10-26

申请号：PCT/US2012/027709

申请日：2012-03-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  COHEN, Guy ,  DIMITRAKOPOULOS, Christos D. ,  GRILL, Alfred

Inventor： COHEN, Guy ,  DIMITRAKOPOULOS, Christos D. ,  GRILL, Alfred

IPC: H01L29/15

CPC classification number: H01L29/66795 ,  B82Y10/00 ,  B82Y40/00 ,  B82Y99/00 ,  H01L21/02057 ,  H01L21/02381 ,  H01L21/02527 ,  H01L21/02529 ,  H01L21/02636 ,  H01L21/28008 ,  H01L21/30604 ,  H01L21/31051 ,  H01L21/324 ,  H01L29/0673 ,  H01L29/1025 ,  H01L29/1606 ,  H01L29/66439 ,  H01L29/66742 ,  H01L29/66787 ,  H01L29/775 ,  H01L29/785 ,  H01L51/0045 ,  H01L51/0048 ,  H01L51/0558

Abstract: Semiconductor structures including parallel graphene nanoribbons or carbon nanotubes oriented along crystallographic directions are provided from a template of silicon carbide (SiC) fins or nanowires. The SiC fins or nanowires are first provided and then graphene nanoribbons or carbon nanotubes are formed on the exposed surfaces of the fin or the nanowires by annealing. In embodiments in which closed carbon nanotubes are formed, the nanowires are suspended prior to annealing. The location, orientation and chirality of the graphene nanoribbons and the carbon nanotubes that are provided are determined by the corresponding silicon carbide fins and nanowires from which they are formed.

Abstract translation: 从碳化硅（SiC）翅片或纳米线的模板提供包括平行石墨烯纳米带或沿着晶体取向的碳纳米管的半导体结构。 首先提供SiC翅片或纳米线，然后通过退火在石墨片或纳米线的暴露表面上形成石墨烯纳米带或碳纳米管。 在形成封闭碳纳米管的实施方案中，纳米线在退火之前被悬浮。 提供的石墨烯纳米带和碳纳米管的位置，取向和手性由相应的碳化硅翅片和形成它们的纳米线确定。

公开(公告)号：WO2007089223A2

公开(公告)日：2007-08-09

申请号：PCT/US2006/001154

申请日：2006-01-12

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  DIMITRAKOPOULOS, Christos, D. ,  GATES, Stephen, M. ,  GRILL, Alfred ,  LANE, Michael, W. ,  LINIGER, Eric, G. ,  LIU, Xiao, Hu ,  NGUYEN, Son, Van ,  NEUMAYER, Deborah, A. ,  SHAW, Thomas, M.

Inventor： DIMITRAKOPOULOS, Christos, D. ,  GATES, Stephen, M. ,  GRILL, Alfred ,  LANE, Michael, W. ,  LINIGER, Eric, G. ,  LIU, Xiao, Hu ,  NGUYEN, Son, Van ,  NEUMAYER, Deborah, A. ,  SHAW, Thomas, M.

IPC: H01L21/00

CPC classification number: H01L21/76834 ,  C23C16/30 ,  C23C16/56 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02274 ,  H01L21/02282 ,  H01L21/02348 ,  H01L21/3105 ,  H01L21/31058 ,  H01L21/31633 ,  H01L21/76801 ,  H01L21/76825 ,  H01L21/76828 ,  H01L21/76829 ,  H01L21/76832 ,  Y10T428/249953 ,  Y10T428/249969 ,  Y10T428/249979

Abstract: A method for forming a ultralow dielectric constant layer with controlled biaxial stress is described incorporating the steps of forming a layer containing Si, C, O and H by one of PECVD and spin-on coating and curing the film in an environment containing very low concentrations of oxygen and water each less than 10 ppm. A material is also described by using the method with a dielectric constant of not more than 2.8. The invention overcomes the problem of forming films with low biaxial stress less than 46 MPa.

Abstract translation: 描述了形成具有受控双轴应力的超低介电常数层的方法，其包括以下步骤：通过PECVD和旋涂方法之一形成包含Si，C，O和H的层，并在含有非常低的浓度的环境中固化该膜 的氧和水各自小于10ppm。 还通过使用介电常数不大于2.8的方法描述材料。 本发明克服了低双轴应力低于46MPa的薄膜形成问题。